Substrate mounting mechanism, substrate processing apparatus, method for suppressing film deposition on substrate mounting mechanism, and storage medium

Abstract

A substrate mounting mechanism on which a target substrate is placed is provided. The substrate mounting mechanism includes a heater plate, which has a substrate mounting surface on which the target substrate is placed and has a heater embedded therein to heat the substrate to a deposition temperature at which a film is deposited. The substrate mounting mechanism also includes a temperature control jacket, which is formed to cover at least a surface of the heater plate other than the substrate mounting surface and adjusts the temperature to a non-deposition temperature below the deposition temperature.

1 . A substrate mounting mechanism comprising:
 a heater plate having a substrate mounting surface on which a target substrate is placed and a heater embedded therein to heat the target substrate to a deposition temperature at which a film is deposited; and   a temperature control jacket formed to cover at least a surface of the heater plate other than the substrate mounting surface and having a non-deposition temperature below the deposition temperature.   
     
     
         2 . The substrate mounting mechanism of  claim 1 , wherein the temperature control jacket includes a temperature control unit. 
     
     
         3 . The substrate mounting mechanism of  claim 2 , wherein the temperature control unit has a temperature control fluid circulating mechanism for circulating a temperature control fluid to adjust a temperature of the temperature control jacket. 
     
     
         4 . The substrate mounting mechanism of  claim 3 , wherein the temperature control unit has a heater for adjusting a temperature of the temperature control jacket. 
     
     
         5 . The substrate mounting mechanism of  claim 1 , wherein the temperature control jacket is formed of a thermal insulator. 
     
     
         6 . The substrate mounting mechanism of  claim 1 , wherein the temperature control jacket is formed of an alloy, and the heater plate is formed of a pure metal or an alloy having less elements than the alloy forming the temperature control jacket. 
     
     
         7 . The substrate mounting mechanism of  claim 1 , further comprising a purge gas supply unit for supplying a purge gas between the heater plate and the temperature control jacket. 
     
     
         8 . The substrate mounting mechanism of  claim 1 , further comprising a thermal insulator provided between the heater plate and the temperature control jacket. 
     
     
         9 . The substrate mounting mechanism of  claim 8 , wherein the thermal insulator has uneven structures on at least one of a surface facing the heater plate and a surface facing the temperature control jacket, and
 wherein the thermal insulator is partially in contact with at least one of the heater plate and the temperature control jacket.   
     
     
         10 . The substrate mounting mechanism of  claim 8 , further comprising a purge gas supply unit for supplying a purge gas between the heater plate and the thermal insulator. 
     
     
         11 . A substrate processing apparatus comprising:
 a substrate mounting mechanism which includes a heater plate having a substrate mounting surface on which a target substrate is placed and a heater embedded therein to heat the target substrate to a deposition temperature at which a film is deposited; and a temperature control jacket formed to cover at least a surface of the heater plate other than the substrate mounting surface and having a non-deposition temperature below the deposition temperature;   a chamber accommodating the substrate mounting mechanism; and   a film forming section for performing a film forming process on the target substrate.   
     
     
         12 . The substrate processing apparatus of  claim 11 , wherein the temperature control jacket includes a temperature control unit. 
     
     
         13 . The substrate processing apparatus of  claim 12 , wherein the temperature control unit has a temperature control fluid circulating mechanism for circulating a temperature control fluid to adjust a temperature of the temperature control jacket. 
     
     
         14 . The substrate processing apparatus of  claim 13 , wherein the temperature control unit has a heater for adjusting a temperature of the temperature control jacket. 
     
     
         15 . The substrate processing apparatus of  claim 11 , wherein the temperature control jacket is formed by using a thermal insulator. 
     
     
         16 . The substrate processing apparatus of  claim 11 , wherein the temperature control jacket is formed of an alloy, and the heater plate is formed of a pure metal or an alloy having less elements than the alloy forming the temperature control jacket. 
     
     
         17 . The substrate processing apparatus of  claim 11 , further comprising a purge gas supply unit for supplying a purge gas between the heater plate and the temperature control jacket. 
     
     
         18 . The substrate processing apparatus of  claim 11 , further comprising a thermal insulator provided between the heater plate and the temperature control jacket. 
     
     
         19 . The substrate processing apparatus of  claim 18 , wherein the thermal insulator has uneven structures on at least one of a surface facing the heater plate and a surface facing the temperature control jacket, and
 wherein the thermal insulator is partially in contact with at least one of the heater plate and the temperature control jacket.   
     
     
         20 . The substrate processing apparatus of  claim 18 , further comprising a purge gas supply unit for supplying a purge gas between the heater plate and the thermal insulator. 
     
     
         21 . A method for suppressing film deposition on a substrate mounting mechanism, which includes a heater plate having a substrate mounting surface on which a target substrate is placed and a heater embedded therein to heat the target substrate to a deposition temperature at which a film is deposited, the method comprising:
 providing a temperature control jacket to cover at least a surface of the heater plate other than the substrate mounting surface;   heating the substrate mounting surface of the heater plate to the deposition temperature at which a film is deposited, by the heater embedded in the heater plate; and   adjusting a temperature of the temperature control jacket to a non-deposition temperature below the deposition temperature.   
     
     
         22 . The method of  claim 21 , wherein the temperature control jacket includes a temperature control unit and the temperature of the temperature control jacket is adjusted to the non-deposition temperature below the deposition temperature by the temperature control unit. 
     
     
         23 . A storage medium storing a program which runs on a computer and, when executed, controls a substrate processing apparatus, which includes a heater plate having a heater embedded therein to heat a target substrate to a deposition temperature at which a film is deposited, and a temperature control jacket formed to cover at least a surface of the heater plate other than a substrate mounting surface of the heater plate and having a temperature control unit, to perform a method for suppressing film deposition including:
 heating the substrate mounting surface of the heater plate to the deposition temperature at which a film is deposited by the heater embedded in the heater plate; and   adjusting a temperature of the temperature control jacket to a non-deposition temperature below the deposition temperature.