Multi-layered printed circuit board and method for fabricating the same

Abstract

A method for fabricating a double-sided or multi-layer printed circuit board (PCB) by ink jet printing that includes providing a substrate, forming a first self-assembly membrane (SAM) on at least one side of the substrate, forming a non-adhesive membrane on the first SAM, forming at least one microhole in the substrate, forming a second SAM on a surface of the microhole, providing catalyst particles on the at least one side of the substrate and on the surface of the microhole, and forming a catalyst circuit pattern on the substrate.

1 . A method for fabricating a printed circuit board (PCB), comprising:
 providing a substrate;   forming a first self-assembly membrane (SAM) on at least one side of the substrate;   forming a non-adhesive membrane on the first SAM;   forming at least one microhole in the substrate;   forming a second SAM on a surface of the microhole;   providing catalyst particles on the at least one side of the substrate and on the surface of the microhole; and   forming a catalyst circuit pattern on the substrate.   
     
     
         2 . The method of  claim 1 , further comprising immersing the substrate into an electrolyte to form a metal circuit on the substrate and a metal membrane in the microhole. 
     
     
         3 . The method of  claim 1 , further comprising immersing the substrate in an accelerator solution. 
     
     
         4 . The method of  claim 1 , wherein the step of forming the self-assembly membrane (SAM) comprises:
 immersing the substrate into a first polyelectrolyte solution;   immersing the substrate into a second polyelectrolyte solution having an opposite charge from the first polyelectrolyte solution; and   immersing the substrate into a third polyelectrolyte solution having a same charge as the first polyelectrolyte solution.   
     
     
         5 . The method of  claim 1 , wherein the step of forming the microhole comprises drilling the substrate to form the microhole. 
     
     
         6 . A method for fabricating a multi-layer printed circuit board (PCB), comprising:
 providing a substrate;   forming a self-assembly membrane (SAM) at each side of the substrate;   forming a non-adhesive membrane on the SAM;   forming at least one microhole in the substrate;   forming the SAM on a surface of the microhole;   applying catalyst particles on at least one side of the substrate and on the surface of the microhole;   forming a catalyst circuit pattern on the substrate through catalyst micro-dispensing and accelerator solution immersing; and   immersing the substrate into an electrolyte to form a metal circuit on the substrate and a metal membrane in the microhole.   
     
     
         7 . The method of  claim 6 , further comprising:
 adhering an insulating layer on at least one side of the double-sided PCB; and   repeating the step of forming the double-sided PCB once to form a multi-layer PCB.   
     
     
         8 . The method for fabricating a multi-layer PCB as claimed in  claim 6 , wherein the step of forming a microhole comprises drilling the substrate to form the microhole. 
     
     
         9 . The method for fabricating a multi-layer PCB as claimed in  claim 8 , wherein the drilling step forms a buried hole, a blind hole, or a through hole of the multi-layer PCB. 
     
     
         10 . The method for fabricating a multi-layer PCB as claimed in  claim 6 , wherein the step of forming the self-assembly membrane (SAM) comprises a conducting surface treatment process that includes
 immersing the substrate in a first polyelectrolyte solution;   immersing the substrate in a second polyelectrolyte solution having an opposite charge from the first polyelectrolyte solution; and   immersing the substrate in a third polyelectrolyte solution having the same charge as the first polyelectrolyte solution.   
     
     
         11 . The method for fabricating a multi-layer PCB as claimed in  claim 6 , wherein the catalyst comprises a palladium salt catalyst or a platinum salt catalyst.