Inventor · disambiguated record
Tzyy-Jang Tseng
Also filed as: TSENG TZYY-JANG
99 granted patents·45 pending applications·691 citations·filing 1998–2025
99Inventor score
Files withUNIMICRON TECHNOLOGY CORP98TSENG TZYY-JANG27HU DYI CHUNG2HU YU-SHAN2SUBTRON TECHNOLOGY CO LTD2
Top patents by PatentIndex Score
144 records- 0196US11690173B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Jun 27, 2023·4 cites·8 claims
- 0296US8709865B2Fabrication method of packaging substrate having through-holed interposer embedded thereinHU YU-SHAN·Filed 2012·Granted Apr 29, 2014·43 cites·12 claims
- 0396US8269337B2Packaging substrate having through-holed interposer embedded therein and fabrication method thereofHU YU-SHAN·Filed 2011·Granted Sep 18, 2012·43 cites·11 claims
- 0495US11516910B1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Nov 29, 2022·4 cites·10 claims
- 0594US12309943B2Circuit carrier and manufacturing method thereof and package structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted May 20, 2025·2 cites·17 claims
- 0694US11579178B1Inspection apparatus for bare circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Feb 14, 2023·8 cites·10 claims
- 0794US7080924B2LED light source with reflecting side wallHARVATEK CORP·Filed 2002·Granted Jul 25, 2006·98 cites·9 claims
- 0894US6057601AHeat spreader with a placement recess and bottom saw-teeth for connection to ground planes on a thin two-sided single-core BGA substrateEXPRESS PACKAGING SYSTEMS INC·Filed 1998·Granted May 2, 2000·242 cites·20 claims
- 0992US12412879B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Sep 9, 2025·1 cites·13 claims
- 1092US11808787B2Probe card testing deviceUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Nov 7, 2023·3 cites·13 claims
- 1191US11335670B2Light emitting diode package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted May 17, 2022·3 cites·11 claims
- 1289US11410971B2Chip package structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Aug 9, 2022·2 cites·11 claims
- 1388US9357659B2Packaging substrate having embedded through-via interposerUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted May 31, 2016·5 cites·6 claims
- 1487US9161454B2Electrical device package structure and method of fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2012·Granted Oct 13, 2015·8 cites·4 claims
- 1587US8946564B2Packaging substrate having embedded through-via interposer and method of fabricating the sameHU DYI-CHUNG·Filed 2012·Granted Feb 3, 2015·7 cites·6 claims
- 1687US8859912B2Coreless package substrate and fabrication method thereofTSENG TZYY-JANG·Filed 2011·Granted Oct 14, 2014·9 cites·16 claims
- 1786US6201300B1Printed circuit board with thermal conductive structureWORLD WISER ELECTRONICS INC·Filed 1998·Granted Mar 13, 2001·113 cites·31 claims
- 1885US11943877B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Mar 26, 2024·1 cites·6 claims
- 1985US9337136B2Method of fabricating a through-holed interposerUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted May 10, 2016·4 cites·3 claims
- 2084US8513796B2Package structure, fabricating method thereof, and package-on-package device therebyTSENG TZYY-JANG·Filed 2012·Granted Aug 20, 2013·6 cites·12 claims
- 2182US8952268B2Interposed substrate and manufacturing method thereofHU DYI-CHUNG·Filed 2012·Granted Feb 10, 2015·5 cites·3 claims
- 2282US8624382B2Packaging substrate and method of fabricating the sameTSENG TZYY-JANG·Filed 2012·Granted Jan 7, 2014·5 cites·4 claims
- 2381US10685922B2Package structure with structure reinforcing element and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jun 16, 2020·2 cites·8 claims
- 2478US11445617B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Sep 13, 2022·2 cites·13 claims
- 2578US8981570B2Through-holed interposer, packaging substrate, and methods of fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Mar 17, 2015·3 cites·8 claims
- 2678US8390013B2Semiconductor package structure and fabricating method of semiconductor package structureTSENG TZYY-JANG·Filed 2010·Granted Mar 5, 2013·5 cites·5 claims
- 2778US2025227857A1Manufacturing method of circuit carrierUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 2877US8956909B2Method of fabricating an electronic device comprising photodiodeUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Feb 17, 2015·1 cites·6 claims
- 2976US9781843B2Method of fabricating packaging substrate having embedded through-via interposerUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Oct 3, 2017·2 cites·4 claims
- 3076US9484223B2Coreless packaging substrate and method of fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Nov 1, 2016·2 cites·11 claims
- 3174US11127664B2Circuit board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Sep 21, 2021·2 cites·10 claims
- 3274US8624366B2Semiconductor package structure and method of fabricating the sameTSENG TZYY-JANG·Filed 2012·Granted Jan 7, 2014·3 cites·5 claims
- 3373US9510464B2Manufacturing method of circuit boardTSENG TZYY-JANG·Filed 2012·Granted Nov 29, 2016·2 cites·12 claims
- 3473US8424202B2Process for fabricating a circuit boardTSENG TZYY-JANG·Filed 2010·Granted Apr 23, 2013·2 cites·13 claims
- 3572US11923350B2Light emitting diode package structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Mar 5, 2024·0 cites·6 claims
- 3671US10658282B2Package substrate structure and bonding method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted May 19, 2020·1 cites·7 claims
- 3771US8294034B2Circuit board and process for fabricating the sameTSENG TZYY-JANG·Filed 2010·Granted Oct 23, 2012·3 cites·20 claims
- 3870US11837591B2Manufacturing method of light emitting diode package structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Dec 5, 2023·0 cites·17 claims
- 3970US8288662B2Circuit structureTSENG TZYY-JANG·Filed 2010·Granted Oct 16, 2012·2 cites·12 claims
- 4070US7834274B2Multi-layer printed circuit board and method for fabricating the sameIND TECH RES INST·Filed 2006·Granted Nov 16, 2010·3 cites·16 claims
- 4169US11410940B2Package structure with structure reinforcing element and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Aug 9, 2022·0 cites·6 claims
- 4269US2025240887A1Circuit board and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 4368US9370107B2Embedded component structure and process thereofUNIMICRON TECHNOLOGY CORP·Filed 2014·Granted Jun 14, 2016·1 cites·9 claims
- 4468US8365401B2Circuit board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2010·Granted Feb 5, 2013·2 cites·10 claims
- 4567US12414243B2Manufacturing method of package structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Sep 9, 2025·0 cites·10 claims
- 4667US11690180B2Manufacturing method of carrier structureUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Jun 27, 2023·0 cites·9 claims
- 4767US10957658B2Package structure with structure reinforcing element and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Mar 23, 2021·0 cites·9 claims
- 4866US11600936B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Mar 7, 2023·0 cites·8 claims
- 4966US2014069574A1Manufacturing method of circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 5064US11991824B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted May 21, 2024·0 cites·3 claims
Showing the top 50 of 144 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →