Inventor · disambiguated record
Cheng-Hung Yu
Also filed as: YU CHENG-HUNG
32 granted patents·17 pending applications·212 citations·filing 1998–2021
96Inventor score
Files withUNITED MICROELECTRONICS CORP17IND TECH RES INST6YU CHENG-HUNG6UNIMICRON TECHNOLOGY CORP5MICROJET TECHNOLOGY CO LTD3
Top patents by PatentIndex Score
49 records- 0190US6635844B2Apparatus for on-line cleaning a wafer chuck with laserUNITED MICROELECTRONICS CORP·Filed 2002·Granted Oct 21, 2003·50 cites·17 claims
- 0286US7180044B2Image sensor device with color filters and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2004·Granted Feb 20, 2007·38 cites·25 claims
- 0385US6571485B1Structure of an overlay mark and its dosimetry applicationUNITED MICROELECTRONICS CORP·Filed 2001·Granted Jun 3, 2003·26 cites·13 claims
- 0484US7987589B2Multilayer three-dimensional circuit structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted Aug 2, 2011·10 cites·19 claims
- 0583US8033014B2Method of making a molded interconnect deviceUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted Oct 11, 2011·14 cites·12 claims
- 0681US8314469B2Image sensor structure with different pitches or shapes of microlensesYU CHENG-HUNG·Filed 2009·Granted Nov 20, 2012·5 cites·15 claims
- 0779US10950588B2Chip package structure and manufacturing method thereofIND TECH RES INST·Filed 2018·Granted Mar 16, 2021·3 cites·11 claims
- 0879US9507264B2Color filter and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 29, 2016·2 cites·17 claims
- 0979US8765333B2Color filter array having hybrid color filters and manufacturing method thereofYU CHENG-HUNG·Filed 2012·Granted Jul 1, 2014·3 cites·20 claims
- 1075US8003983B2Wafer for manufacturing image sensors, test key layout for defects inspection, and methods for manufacturing image sensors and for forming test keyUNITED MICROELECTRONICS CORP·Filed 2006·Granted Aug 23, 2011·3 cites·4 claims
- 1171US9070612B2Method for fabricating optical micro structure and applications thereofUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jun 30, 2015·0 cites·6 claims
- 1270US9279923B2Color filter layer and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2013·Granted Mar 8, 2016·2 cites·9 claims
- 1370US7834274B2Multi-layer printed circuit board and method for fabricating the sameIND TECH RES INST·Filed 2006·Granted Nov 16, 2010·3 cites·16 claims
- 1469US10778086B1Power-switching circuit with soft-start circuitQUANTA COMP INC·Filed 2019·Granted Sep 15, 2020·1 cites·20 claims
- 1569US8707974B2Wafer cleaning deviceTSAI HSIN-TING·Filed 2009·Granted Apr 29, 2014·4 cites·12 claims
- 1669US8455294B2Method of fabricating an image sensor structureUNITED MICROELECTRONICS CORP·Filed 2012·Granted Jun 4, 2013·0 cites·18 claims
- 1768US7473522B2Method for manufacturing micro-lenses of image sensorsUNITED MICROELECTRONICS CORP·Filed 2007·Granted Jan 6, 2009·1 cites·28 claims
- 1865US8084289B2Method of fabricating image sensor and reworking method thereofTSAI HSIN-TING·Filed 2010·Granted Dec 27, 2011·1 cites·11 claims
- 1965USD631184SLensCAL COMP ELECTRONICS & COMM CO·Filed 2009·Granted Jan 18, 2011·15 cites·1 claims
- 2062US2013010165A1Optical micro structure, method for fabricating the same and applications thereofUNITED MICROELECTRONICS CORP·Filed 2011·Application pending·0 cites
- 2160US2015187832A1Image sensor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 2256US9857508B2Color filter pattern and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jan 2, 2018·0 cites·13 claims
- 2356US6623109B2Structure of printheadMICROJET TECHNOLOGY CO LTD·Filed 2002·Granted Sep 23, 2003·6 cites·12 claims
- 2455US7723150B2Image sensor and fabricating method thereofUNITED MICROELECTRONICS CORP·Filed 2008·Granted May 25, 2010·0 cites·20 claims
- 2552US6971170B2Method of manufacturing printheadMICROJET TECHNOLOGY CO LTD·Filed 2002·Granted Dec 6, 2005·5 cites·9 claims
- 2652US2011253435A1Multilayer three-dimensional circuit structureUNIMICRON TECHNOLOGY CORP·Filed 2011·Application pending·0 cites
- 2751US9539621B2Wafer cleaning device and method thereofUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jan 10, 2017·0 cites·12 claims
- 2851US2009124037A1Method of preventing color striation in fabricating process of image sensor and fabricating process of image sensorUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 2951US2012261731A1Image sensorYU CHENG-HUNG·Filed 2011·Application pending·0 cites
- 3051US2011023297A1Multi-layered printed circuit board and method for fabricating the sameIND TECHNOLOGY RES INST AND UNIMICRON TECHNOLOGY CORP·Filed 2010·Application pending·0 cites
- 3150US2022096019A1Electronic device for signal interference compensationIND TECH RES INST·Filed 2021·Application pending·0 cites
- 3249US8137901B2Method for fabricating an image sensorTSAI HSIN-TING·Filed 2008·Granted Mar 20, 2012·0 cites·7 claims
- 3347US11690571B2Wristband biosensing system, wristband biosensing apparatus and biosensing methodIND TECH RES INST·Filed 2020·Granted Jul 4, 2023·0 cites·15 claims
- 3446US2007263862A1Manufacturing process and apparatus for printing imprint on defective boardUNIMICRON TECHNOLOGY CORP·Filed 2006·Application pending·0 cites
- 3545US8294041B2Circuit board and manufacturing method thereofYU CHENG-PO·Filed 2008·Granted Oct 23, 2012·0 cites·3 claims
- 3642US2007281388A1Selective metal surface treatment process and apparatus for circuit board and resist used in the processUNIMICRON TECHNOLOGY CORP·Filed 2006·Application pending·0 cites
- 3740US11387230B2System in package structure for perform electrostatic discharge operation and electrostatic discharge protection structure thereofIND TECH RES INST·Filed 2018·Granted Jul 12, 2022·0 cites·20 claims
- 3840US2007166649A1Method of forming a micro deviceYU CHENG-HUNG·Filed 2006·Application pending·0 cites
- 3939USD619154SLensCAL COMP ELECTRONICS & COMM CO·Filed 2009·Granted Jul 6, 2010·4 cites·1 claims
- 4038US6936386B2Reticle alignment procedureUNITED MICROELECTRONICS CORP·Filed 2003·Granted Aug 30, 2005·0 cites·10 claims
- 4138US2019103360A1Flexible chip packageIND TECH RES INST·Filed 2018·Application pending·0 cites
- 4237US2014042819A1Electronic apparatus and power management methodBRIVIEW CORP·Filed 2013·Application pending·0 cites
- 4337US2006176326A1Fluid injector devices and methods for utilizing the sameBENQ CORP·Filed 2005·Application pending·0 cites
- 4437US2006170536A1Security apparatus for motor vehiclesYU CHENG-HUNG·Filed 2005·Application pending·0 cites
- 4536US6071094APhotoresist dispense pumpUNITED INTEGRATED CIRCUITS CORP·Filed 1998·Granted Jun 6, 2000·10 cites·14 claims
- 4636US2012038261A1Heat-dissipating structure and lighting module having the sameYU CHENG-HUNG·Filed 2010·Application pending·0 cites
- 4735US2017186795A1Image sensor and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 4832US6132113ADeveloper cupUNITED INTEGRATED CIRCUITS CORP·Filed 1999·Granted Oct 17, 2000·6 cites·14 claims
- 4931US2003025754A1Chip structure in ink-jet headMICROJET TECHNOLOGY CO LTD·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →