Electroless Deposition System

Abstract

An electroless deposition method includes providing a deposition solution, and saturating the deposition solution with an oxygen concentration in a range from about two thousand parts per million to about twenty thousand parts per million, and replenishing deionized water in the deposition solution.

1 . An electroless deposition method comprising:
 providing a deposition solution; and   saturating the deposition solution with an oxygen concentration in a range from about two thousand parts per million to about twenty thousand parts per million, wherein saturating includes dissolving an inert gas and oxygen in the deposition solution; and   replenishing de-ionized water in the deposition solution.   
     
     
         2 . The method as claimed in  claim 1  wherein the inert gas is nitrogen. 
     
     
         3 . The method as claimed in  claim 1  wherein saturating includes bubbling oxygen through the deposition solution for a predetermined time. 
     
     
         4 . The method as claimed in  claim 1  wherein saturating includes humidifying the oxygen during saturation. 
     
     
         5 . An electroless deposition method comprising:
 providing an electroless deposition solution;   dissolving oxygen with a concentration in a range from about two thousand parts per million to about twenty thousand parts per million in the electroless deposition solution; and   depositing a deposition layer on an outlier feature of a work piece.   
     
     
         6 . The method as claimed in  claim 5  wherein dissolving oxygen includes oxygen in an inert gas in a range of about two parts per billion to about twenty parts per billion. 
     
     
         7 . The method as claimed in  claim 5  wherein dissolving oxygen includes oxygen in nitrogen in a range of about two parts per billion to about twenty parts per billion. 
     
     
         8 . The method as claimed in  claim 5  wherein dissolving oxygen includes bubbling oxygen through the electroless deposition solution for a predetermined time. 
     
     
         9 . The method as claimed in  claim 5  wherein dissolving oxygen includes replenishing de-ionized water in the electroless deposition solution. 
     
     
         10 . An electroless deposition method, comprising:
 storing an electroless deposition solution;   receiving an oxygen-containing gas from a gas source;   humidifying the oxygen-containing gas by bubbling the oxygen-containing gas through de-ionized water;   bubbling the humidified oxygen-containing gas through the electroless deposition solution;   applying the electroless deposition solution to a work piece;   replenishing de-ionized water to the electroless deposition solution to compensate for evaporation during processing;   wherein the bubbling of the humidified oxygen-containing gas through the electroless deposition solution saturates the electroless deposition solution with an oxygen level in a range from about two thousand parts per million to about twenty thousand parts per million, the oxygen level providing for plating on outlier features of the work piece as well as stability for the electroless deposition solution.   
     
     
         11 . The electroless deposition method of  claim 10 , wherein the oxygen-containing gas includes an inert gas. 
     
     
         12 . The electroless deposition method of  claim 11 , wherein the inert gas is nitrogen. 
     
     
         13 . The electroless deposition method of  claim 10 , wherein the dispenser bubbles the humidified oxygen-containing gas through the electroless deposition solution for a predetermined time.