Inventor · disambiguated record
Artur Kolics
Also filed as: KOLICS ARTUR · KOLICS ARTUR K
60 granted patents·18 pending applications·935 citations·filing 2002–2024
98Inventor score
Top patents by PatentIndex Score
78 records- 0198US11209729B2Vacuum-integrated hardmask processes and apparatusLAM RES CORP·Filed 2019·Granted Dec 28, 2021·21 cites·14 claims
- 0298US10831096B2Vacuum-integrated hardmask processes and apparatusLAM RES CORP·Filed 2018·Granted Nov 10, 2020·34 cites·18 claims
- 0398US10514598B2Vacuum-integrated hardmask processes and apparatusLAM RES CORP·Filed 2017·Granted Dec 24, 2019·33 cites·10 claims
- 0498US9778561B2Vacuum-integrated hardmask processes and apparatusLAM RES CORP·Filed 2015·Granted Oct 3, 2017·380 cites·9 claims
- 0597US9837312B1Atomic layer etching for enhanced bottom-up feature fillLAM RES CORP·Filed 2016·Granted Dec 5, 2017·48 cites·20 claims
- 0693US10262943B2Interlevel conductor pre-fill utilizing selective barrier depositionLAM RES CORP·Filed 2018·Granted Apr 16, 2019·7 cites·19 claims
- 0793US9583386B2Interlevel conductor pre-fill utilizing selective barrier depositionLAM RES CORP·Filed 2015·Granted Feb 28, 2017·8 cites·21 claims
- 0893US9287183B1Using electroless deposition as a metrology tool to highlight contamination, residue, and incomplete via etchLAM RES CORP·Filed 2015·Granted Mar 15, 2016·11 cites·17 claims
- 0993US6913651B2Apparatus and method for electroless deposition of materials on semiconductor substratesBLUE29 LLC·Filed 2002·Granted Jul 5, 2005·67 cites·15 claims
- 1092US10049921B2Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursorLAM RES CORP·Filed 2014·Granted Aug 14, 2018·15 cites·19 claims
- 1191US2025053080A1Vacuum-integrated hardmask processes and apparatusLAM RES CORP·Filed 2024·Application pending·0 cites
- 1290US8404626B2Post-deposition cleaning methods and formulations for substrates with cap layersKOLICS ARTUR·Filed 2008·Granted Mar 26, 2013·14 cites·22 claims
- 1389US6794288B1Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activationBLUE29 CORP·Filed 2003·Granted Sep 21, 2004·56 cites·27 claims
- 1488US6902605B2Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copperBLUE29 LLC·Filed 2003·Granted Jun 7, 2005·53 cites·34 claims
- 1587US9768063B1Dual damascene fillLAM RES CORP·Filed 2016·Granted Sep 19, 2017·5 cites·20 claims
- 1686US6911067B2Solution composition and method for electroless deposition of coatings free of alkali metalsBLUE29 LLC·Filed 2003·Granted Jun 28, 2005·30 cites·43 claims
- 1785US8906446B2Apparatus and method for electroless deposition of materials on semiconductor substratesIVANOV IGOR C·Filed 2012·Granted Dec 9, 2014·6 cites·13 claims
- 1884US6908512B2Temperature-controlled substrate holder for processing in fluidsBLUE29 LLC·Filed 2002·Granted Jun 21, 2005·34 cites·20 claims
- 1984US2023273516A1Vacuum-integrated hardmask processes and apparatusLAM RES CORP·Filed 2023·Application pending·0 cites
- 2084US2023266662A1Vacuum-integrated hardmask processes and apparatusLAM RES CORP·Filed 2023·Application pending·0 cites
- 2183US8632628B2Solutions and methods for metal depositionKOLICS ARTUR·Filed 2010·Granted Jan 21, 2014·2 cites·30 claims
- 2281US9875968B2Interlevel conductor pre-fill utilizing selective barrier depositionLAM RES CORP·Filed 2017·Granted Jan 23, 2018·2 cites·19 claims
- 2381US9761524B2Metallization of the wafer edge for optimized electroplating performance on resistive substratesLAM RES CORP·Filed 2016·Granted Sep 12, 2017·2 cites·16 claims
- 2481US8586133B2Method for strengthening adhesion between dielectric layers formed adjacent to metal layersIVANOV IGOR C·Filed 2012·Granted Nov 19, 2013·3 cites·16 claims
- 2581US8328919B2Electroless deposition solutions and process controlKOLICS ARTUR·Filed 2010·Granted Dec 11, 2012·4 cites·16 claims
- 2680US8921296B2Post deposition wafer cleaning formulationKOLICS ARTUR·Filed 2010·Granted Dec 30, 2014·4 cites·12 claims
- 2780US8736055B2Methods and layers for metallizationKOLICS ARTUR·Filed 2012·Granted May 27, 2014·9 cites·36 claims
- 2879US7226856B1Nano-electrode-array for integrated circuit interconnectsKLA TENCOR TECH CORP·Filed 2004·Granted Jun 5, 2007·23 cites·8 claims
- 2979US2022075260A1Vacuum-integrated hardmask processes and apparatusLAM RES CORP·Filed 2021·Application pending·0 cites
- 3076US9406556B2Method of making an interconnect deviceLAM RES CORP·Filed 2013·Granted Aug 2, 2016·2 cites·25 claims
- 3176US9058975B2Cleaning solution formulations for substratesKOLICS ARTUR·Filed 2008·Granted Jun 16, 2015·5 cites·11 claims
- 3275US9048088B2Processes and solutions for substrate cleaning and electroless depositionKOLICS ARTUR·Filed 2009·Granted Jun 2, 2015·4 cites·36 claims
- 3374US8603913B1Porous dielectrics K value restoration by thermal treatment and or solvent treatmentLAM RES CORP·Filed 2012·Granted Dec 10, 2013·3 cites·18 claims
- 3473US9490211B1Copper interconnectLAM RES CORP·Filed 2015·Granted Nov 8, 2016·2 cites·17 claims
- 3573US8980746B2Adhesion layer for through silicon via metallizationLAM RES CORP·Filed 2013·Granted Mar 17, 2015·3 cites·19 claims
- 3672US9382627B2Methods and materials for anchoring gapfill metalsLAM RES CORP·Filed 2014·Granted Jul 5, 2016·2 cites·11 claims
- 3772US6875691B2Temperature control sequence of electroless plating bathsMATTSON TECH INC·Filed 2002·Granted Apr 5, 2005·16 cites·34 claims
- 3871US9006893B2Devices for metallizationLAM RES CORP·Filed 2013·Granted Apr 14, 2015·2 cites·17 claims
- 3971US8808791B2Method for strengthening adhesion between dielectric layers formed adjacent to metal layersLAM RES CORP·Filed 2013·Granted Aug 19, 2014·1 cites·6 claims
- 4070US7913644B2Electroless deposition systemLAM RES CORP·Filed 2006·Granted Mar 29, 2011·1 cites·9 claims
- 4168US9368340B2Metallization of the wafer edge for optimized electroplating performance on resistive substratesLAM RES CORP·Filed 2014·Granted Jun 14, 2016·1 cites·19 claims
- 4268US6846519B2Method and apparatus for electroless deposition with temperature-controlled chuckBLUE29 LLC·Filed 2002·Granted Jan 25, 2005·13 cites·19 claims
- 4366US8790465B2Post-deposition cleaning methods for substrates with cap layersLAM RES CORP·Filed 2013·Granted Jul 29, 2014·1 cites·23 claims
- 4464US7883739B2Method for strengthening adhesion between dielectric layers formed adjacent to metal layersLAM RES CORP·Filed 2003·Granted Feb 8, 2011·6 cites·2 claims
- 4564US2010062164A1Methods and Solutions for Preventing the Formation of Metal Particulate Defect Matter Upon a Substrate After a Plating ProcessLAM RES·Filed 2008·Application pending·0 cites
- 4662US8128987B2Apparatus and method for electroless deposition of materials on semiconductor substratesIVANOV IGOR C·Filed 2005·Granted Mar 6, 2012·1 cites·13 claims
- 4762US7772128B2Semiconductor system with surface modificationLAM RES CORP·Filed 2007·Granted Aug 10, 2010·1 cites·30 claims
- 4861US8551575B1Methods and solutions for preventing the formation of metal particulate defect matter upon a substrate after a plating processLI SHIJIAN·Filed 2012·Granted Oct 8, 2013·0 cites·23 claims
- 4959US10079207B2Metallization of the wafer edge for optimized electroplating performance on resistive substratesLAM RES CORP·Filed 2017·Granted Sep 18, 2018·0 cites·15 claims
- 5059US9476018B2Wafer cleaning formulationLAM RES CORP·Filed 2014·Granted Oct 25, 2016·0 cites·16 claims
Showing the top 50 of 78 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →