Method and device for the correction of imaging defects

Abstract

The disclosure relates to a microlithography projection exposure system having optical corrective elements configured to modify the imaging characteristics, as well as related systems and component.

1 .- 42 . (canceled) 
     
     
         43 . A method, comprising:
 recording usage parameters of a microlithography projection exposure system comprising an optical corrective element;   predicting degradation phenomena;   producing at least one matched corrective element in advance; and   replacing the optical corrective element.   
     
     
         44 . The method as claimed in  claim 43 , further comprising measuring the usage parameters. 
     
     
         45 . The method as claimed in  claim 43 , wherein the degradation phenomena are predicted on the basis of drift measurements and/or known exposure settings. 
     
     
         46 - 53 . (canceled) 
     
     
         54 . The method of  claim 43 , wherein the method corrects image defects of the microlithography projection exposure system. 
     
     
         55 . The method of  claim 43 , wherein the method comprises replacing the optical corrective element with the at least one matched corrective element. 
     
     
         56 . The method of  claim 43 , wherein the method comprises predicting the degradation phenomena based on the usage parameters. 
     
     
         57 . A method, comprising:
 predicting degradation phenomena of a microlithography projection exposure system comprising a first optical corrective element based on usage parameters of the microlithography projection exposure system;   producing a second optical corrective element based on the predicted degradation phenomena; and   replacing the first optical corrective element with the second optical corrective element.   
     
     
         58 . The method of  claim 57 , wherein replacing the first optical corrective element with the optical corrective element reduces image defects of the microlithography projection exposure system. 
     
     
         59 . The method of  claim 57 , further comprising measuring the usage parameters. 
     
     
         60 . The method of  claim 59 , wherein the degradation phenomena are predicted based on drift measurements and/or known exposure settings. 
     
     
         61 . The method of  claim 57 , wherein the degradation phenomena are predicted based on drift measurements and/or known exposure settings. 
     
     
         62 . The method of  claim 57 , wherein, before replacing the first optical corrective element, the first optical corrective element is arranged at a distance from a pupil plane of the microlithography projection exposure system which corresponds to a sub-aperture ratio of greater than 0.75. 
     
     
         63 . The method of  claim 57 , wherein, after replacing the first optical corrective element, the second optical corrective element is arranged at a distance from the pupil plane of the microlithography projection exposure system which corresponds to a sub-aperture ratio of greater than 0.75. 
     
     
         64 . The method of  claim 57 , wherein first optical corrective element is a plane parallel plate. 
     
     
         65 . The method of  claim 57 , wherein first optical corrective element is a screen. 
     
     
         66 . A method, comprising:
 producing a second optical corrective element based on predicted degradation phenomena of a microlithography projection exposure system comprising a first optical corrective element, the predicted degradation phenomena being based on usage parameters of the microlithography projection exposure system; and   replacing the first optical corrective element with the second optical corrective element.   
     
     
         67 . The method of  claim 66 , wherein replacing the first optical corrective element with the optical corrective element reduces image defects of the microlithography projection exposure system. 
     
     
         68 . The method of  claim 66 , further comprising measuring the usage parameters. 
     
     
         69 . The method of  claim 68 , wherein the degradation phenomena are predicted based on drift measurements and/or known exposure settings. 
     
     
         70 . The method of  claim 66 , wherein the degradation phenomena are predicted on drift measurements and/or known exposure settings.