Method and system for forming non-manhattan patterns using variable shaped beam lithography

Abstract

A method and system for fracturing or mask data preparation or proximity effect correction is disclosed in which a series of charged particle beam shots is determined, where the series of shots is capable of forming a continuous non-manhattan track on a surface, such that the non-manhattan track has a line width roughness (LWR) which nearly equals a target LWR. A method and system for fracturing or mask data preparation or proximity effect correction is also disclosed in which at least two series of shots are determined, where each series of shots is capable of forming a continuous non-manhattan track on a surface, and where the space between tracks has space width roughness (SWR) which nearly equals a target SWR.

1 . A method for fracturing or mask data preparation or proximity effect correction for shaped beam charged particle beam lithography, the method comprising the steps of:
 determining a target line width roughness (LWR);   determining a series of two or more shots, wherein the series of shots is capable of forming a continuous non-manhattan track on a surface, and wherein the LWR of the track nearly equals the target LWR; and   outputting the series of shots.   
     
     
         2 . The method of  claim 1  wherein each shot in the series of shots overlaps another shot in the series of shots, and wherein the overlap between adjacent shots is adjusted to achieve the LWR of the track. 
     
     
         3 . The method of  claim 1  wherein the shots are variable shaped beam (VSB) shots. 
     
     
         4 . The method of  claim 1  wherein the shots are circular character projection (CP) shots. 
     
     
         5 . The method of  claim 1  wherein the track is diagonal. 
     
     
         6 . The method of  claim 1  wherein the track is curvilinear. 
     
     
         7 . The method of  claim 1  wherein the track is of constant width, exclusive of line edge roughness (LER). 
     
     
         8 . The method of  claim 1  wherein the difference between the LWR of the track and the target LWR is in the range of 0.1 nm to 4.0 nm. 
     
     
         9 . The method of  claim 1  wherein the LWR of the track is nearly minimized. 
     
     
         10 . The method of  claim 9  wherein the LWR of the track is between 0.1 nm and 4.0 nm. 
     
     
         11 . The method of  claim 1  wherein the step of determining a target LWR comprises using charged particle beam simulation. 
     
     
         12 . The method of  claim 11  wherein the charged particle beam simulation includes at least one of the group consisting of forward scattering, backward scattering, resist diffusion, coulomb effect, etching, fogging, loading and resist charging. 
     
     
         13 . The method of  claim 11  wherein the step of determining a target LWR further comprises using lithography simulation. 
     
     
         14 . A method for fracturing or mask data preparation or proximity effect correction for shaped beam charged particle beam lithography, the method comprising the steps of:
 determining a target space width roughness (SWR);   determining at least two series of shots, wherein each series has at least two shots, wherein each series of shots is capable of forming a continuous non-manhattan track on a surface, wherein adjacent tracks have a space between them, wherein the space between adjacent tracks comprises an actual SWR, and wherein the actual SWR nearly equals the target SWR; and   outputting the series of shots.   
     
     
         15 . The method of  claim 14  wherein each shot in each series of shots overlaps another shot in the same series. 
     
     
         16 . The method of  claim 15 , further comprising the step of determining a target line width roughness (LWR), wherein the LWR of the track formed by each series of shots nearly equals the target LWR. 
     
     
         17 . The method of  claim 14  wherein the shots are variable shaped beam (VSB) shots. 
     
     
         18 . The method of  claim 14  wherein the shots are circular character projection (CP) shots. 
     
     
         19 . The method of  claim 14  wherein the difference between the actual SWR and the target SWR is between 0.1 nm and 4.0 nm. 
     
     
         20 . The method of  claim 14  wherein the actual SWR is nearly minimized. 
     
     
         21 . The method of  claim 20  wherein the actual SWR is between 0.1 nm and 4.0 nm. 
     
     
         22 . The method of  claim 14  wherein the step of determining the target SWR comprises using lithography simulation. 
     
     
         23 . A method for forming a set of patterns on a surface, the method comprising the steps of:
 providing a charged particle beam source; and   exposing a series of two or more charged particle beam shots, wherein the series of shots forms a continuous non-manhattan track on the surface, the track comprising a portion of a pattern in the set of patterns, and wherein line width roughness (LWR) of the track nearly equals or is optimized to be close to a pre-determined LWR.   
     
     
         24 . A method for forming a set of patterns on a surface, the method comprising the steps of:
 providing a charged particle beam source; and   exposing two series of shots, each series having two or more charged particle beam shots each, wherein each series of shots forms a continuous non-manhattan track on a surface, wherein the tracks have a space between them, and wherein the space between the tracks comprises an SWR, and wherein the SWR nearly equals or is optimized to be close to a pre-determined SWR.   
     
     
         25 . The method of  claim 24 , wherein each shot in each series of shots overlaps another shot in the same series, and wherein the method further comprises the step of determining a target line width roughness (LWR), wherein the LWR of the track formed by each series of shots nearly equals the target LWR. 
     
     
         26 . A system for fracturing or mask data preparation or proximity effect correction for use with shaped beam charged particle beam lithography, the system comprising:
 a target line width roughness (LWR);   a device capable of determining a series of two or more shots, wherein the series of shots are capable of forming a continuous non-manhattan track on a surface, and wherein an LWR of the track nearly equals the target LWR; and   a device capable of outputting the series of two or more VSB shots.   
     
     
         27 . The system of  claim 26  wherein each shot in the series of shots overlaps another shot in the series of shots. 
     
     
         28 . The system of  claim 26  wherein the shots are variable shaped beam (VSB) shots. 
     
     
         29 . The system of  claim 26  wherein the shots are circular character projection (CP) shots. 
     
     
         30 . The system of  claim 26  wherein the track is diagonal. 
     
     
         31 . The system of  claim 26  wherein the track is curvilinear. 
     
     
         32 . The system of  claim 26  wherein the track is of constant width, exclusive of line edge roughness (LER). 
     
     
         33 . The system of  claim 26  wherein the difference between the LWR of the track and the target LWR is in the range of 0.1 nm to 4.0 nm. 
     
     
         34 . The system of  claim 26  wherein the LWR of the track is minimized. 
     
     
         35 . The system of  claim 34  wherein the LWR of the track is between 0.1 nm and 4.0 nm. 
     
     
         36 . The system of  claim 26 , further comprising a device capable of determining the target LWR. 
     
     
         37 . The system of  claim 36  wherein the device capable of determining the target LWR performs lithography simulation. 
     
     
         38 . A system for fracturing or mask data preparation or proximity effect correction for use with shaped beam charged particle beam lithography, the system comprising:
 a target space width roughness (SWR);   a device capable of determining at least two series of at least two shots each, wherein each series of shots can form a continuous non-manhattan track on a surface, wherein the tracks have a space between them, and wherein the space between the tracks formed by the two series of shots comprises an actual SWR, and wherein the actual SWR nearly equals the target SWR; and   a device capable of outputting the two series of two or more shots.   
     
     
         39 . The system of  claim 38  wherein each shot in each series of shots overlaps another shot in the same series. 
     
     
         40 . The system of  claim 38  wherein the shots are variable shaped beam (VSB) shots. 
     
     
         41 . The system of  claim 38  wherein the shots are circular character projection (CP) shots. 
     
     
         42 . The system of  claim 38  wherein the difference between the actual SWR and the target SWR is in the range of 0.1 nm to 4.0 nm. 
     
     
         43 . The system of  claim 38  wherein the actual SWR is minimized. 
     
     
         44 . The system of  claim 43  wherein the actual SWR is between 0.1 nm and 4.0 nm. 
     
     
         45 . The system of  claim 38 , further comprising a device capable of determining the target SWR. 
     
     
         46 . The system of  claim 45  wherein the device capable of determining the target SWR performs lithography simulation.