US2014027289A1PendingUtilityA1
Roughened substrate support
Est. expiryJul 27, 2032(~6 yrs left)· nominal 20-yr term from priority
H10P 72/7616B24C 1/06C23C 16/4581B24C 1/00
49
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Claims
Abstract
The present invention generally relates to a substrate support for use in a substrate processing chamber. A roughened substrate support reduces arcing within the chamber and also contributes to uniform deposition on the substrate. The roughening can occur in two steps. In a first step, the substrate support is bead blasted to initially roughen the surfaces. Then, the roughened surface is bead blasted with a finer grit to produce a substrate support with a surface roughness of between about 707 micro-inches and about 837 micro-inches. Following the surface roughening, the substrate support is anodized.
Claims
exact text as granted — not AI-modified1 . A method of forming a roughened substrate support, comprising:
bead blasting a surface of a substrate support in a first process where the beads have a first grit size; and bead blasting the surface of the substrate support in a second process where the beads have a second grit size that is smaller than the first grit size.
2 . The method of claim 1 , wherein the first process comprises delivering the beads from a nozzle to the substrate support and wherein the nozzle is disposed at an angle of between about 85 degrees and 95 degrees relative to the surface of the substrate support.
3 . The method of claim 2 , wherein the first grit size is between about 23 grit and about 25 grit.
4 . The method of claim 3 , wherein the nozzle is spaced between about 400 mm and about 600 mm from the surface of the substrate support during the first process.
5 . The method of claim 4 , wherein the first process further comprises:
scanning the nozzle across the surface of the substrate support in a first direction; shifting the nozzle along the surface of the substrate support in a second direction perpendicular to the first direction; and scanning the nozzle across the surface of the substrate support in a third direction opposite the first direction.
6 . The method of claim 5 , wherein the shifting comprises moving the nozzle in the second direction for a distance between about 20 mm and about 40 mm.
7 . The method of claim 1 , wherein the second process comprises delivering the beads from a nozzle to the substrate support and wherein the nozzle is disposed at an angle of between about 85 degrees and 95 degrees relative to the surface of the substrate support.
8 . The method of claim 7 , wherein the second grit size is between about 58 grit and about 61 grit.
9 . The method of claim 8 , wherein the nozzle is spaced between about 400 mm and about 600 mm from the surface of the substrate support during the second process.
10 . The method of claim 9 , wherein the second process further comprises:
scanning the nozzle across the surface of the substrate support in a first direction; shifting the nozzle along the surface of the substrate support in a second direction perpendicular to the first direction; and scanning the nozzle across the surface of the substrate support in a third direction opposite the first direction.
11 . The method of claim 10 , wherein the shifting comprises moving the nozzle in the second direction for a distance between about 20 mm and about 40 mm.
12 . The method of claim 11 , wherein the second process further comprises:
rotating the substrate support 90 degrees counterclockwise; scanning the nozzle across the surface of the substrate support in the first direction; shifting the nozzle along the surface of the substrate support in the second direction; and scanning the nozzle across the surface of the substrate support in the third direction.
13 . The method of claim 12 , wherein the second process further comprises:
rotating the substrate support 90 degrees counterclockwise; scanning the nozzle across the surface of the substrate support in the first direction; shifting the nozzle along the surface of the substrate support in the second direction; and scanning the nozzle across the surface of the substrate support in the third direction.
14 . The method of claim 13 , wherein the second process further comprises:
rotating the substrate support 90 degrees counterclockwise; scanning the nozzle across the surface of the substrate support in the first direction; shifting the nozzle along the surface of the substrate support in the second direction; and scanning the nozzle across the surface of the substrate support in the third direction.
15 . A method of forming a roughened substrate support, comprising:
bead blasting a surface of a substrate support in a first process comprising:
scanning the nozzle across the surface of the substrate support in a first direction;
shifting the nozzle along the surface of the substrate support in a second direction perpendicular to the first direction; and
scanning the nozzle across the surface of the substrate support in a third direction opposite the first direction; and
bead blasting the surface of the substrate support in a second process comprising:
first scanning the nozzle across the surface of the substrate support in the first direction;
shifting the nozzle along the surface of the substrate support in the second direction;
second scanning the nozzle across the surface of the substrate support in the third direction;
rotating the substrate support about 90 degrees counterclockwise; and
repeating the first scanning, shifting, second scanning and rotating.
16 . The method of claim 15 , wherein the repeating occurs three times.
17 . The method of claim 16 , wherein the first process comprises bead blasting the surface with beads having a grit size of between about 23 grit and about 25 grit.
18 . The method of claim 17 , wherein the second process comprises bead blasting the surface with beads having a grit size of between about 58 grit and 61 grit.
19 . A substrate support, comprising:
a substrate support body having a surface roughness of between about 707 micro-inches and about 834 micro-inches; and an anodized coating on the substrate support.
20 . The substrate support of claim 19 , wherein the substrate support body comprises aluminum.Cited by (0)
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