US2014224281A1PendingUtilityA1

Methods and apparatus for cleaning flip chip assemblies

Assignee: ZHANG XIAOYANPriority: Sep 22, 2011Filed: Sep 22, 2011Published: Aug 14, 2014
Est. expirySep 22, 2031(~5.2 yrs left)· nominal 20-yr term from priority
H10W 72/07118H10W 72/072H10W 72/01271H10W 90/724H10W 72/252H10P 72/0404H10P 70/15H10P 72/0414H01L 21/67051H01L 21/02052H01L 21/67023
46
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

An apparatus for cleaning flip chip assemblies is provided. The apparatus comprises: a chuck assembly; a motor coupled to the chuck assembly by a spindle; at least one carrier for holding flip chips; at least one spray nozzle for directing DIW, a cleaning solution, a gas or a vapor. Apparatus of the invention further provides a method for cleaning flip chip assemblies. The method comprises: loading at least one flip chip to the flip chip carriers; rotating the chuck assembly at a rotation speed; flowing DIW for rinsing the flip chips; flowing a cleaning solution for removing the contaminants; applying ultrasonic/megasonic energy to the flip chips; blowing a gas or a vapor via the spray nozzles for drying the flip chips; bringing the flip chips out of the flip chip carriers.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An apparatus for cleaning flip chip assemblies, comprising:
 a chuck assembly;   a motor coupled to the chuck assembly by a spindle;   at least one carrier for holding a flip chip;   at least one spray nozzle for directing DIW, a cleaning solution, a gas or a vapor.   
     
     
         2 . The apparatus of  claim 1 , wherein said flip chip carrier is located off rotation center on the chuck assembly. 
     
     
         3 . The apparatus of  claim 1 , wherein the apparatus further comprises a loading plate, and said flip chip carrier is located on said loading plate, and said loading plate is held by said chuck assembly. 
     
     
         4 . The apparatus of  claim 1 , wherein said carrier holds a flip chip in top fixing manner. 
     
     
         5 . The apparatus of  claim 1 , wherein said carrier holds a flip chip in bottom fixing manner. 
     
     
         6 . The apparatus of  claim 1 , wherein said flip chip carriers is located at the off rotation center on the chuck assembly, the distribution pattern of the flip chip carriers is circle, square, swirl or concentric. 
     
     
         7 . The apparatus of  claim 1 , wherein said spray nozzles is a fix nozzle, a scan nozzle or a swing nozzle. 
     
     
         8 . The apparatus of  claim 1 , wherein said spray nozzle is disposed at the top of the chuck assembly. 
     
     
         9 . The apparatus of  claim 1 , wherein said spray nozzle is disposed at one side of the flip chip carriers. 
     
     
         10 . The apparatus of  claim 1  further comprising a recess located in the center of said chuck assembly, and a guide channel connects the recess with each flip chip carrier. 
     
     
         11 . The apparatus of  claim 1  further comprising a recess with a spray nozzle at edge for holding each carrier. 
     
     
         12 . The apparatus of  claim 1  further comprising an outer tank for holding cleaning solution for pre-soaking said flip chips held by said chuck assembly. 
     
     
         13 . The apparatus of  claim 12  further comprising an ultrasonic/megasonic device attached on wall of said outer tank. 
     
     
         14 . The apparatus of  claim 1 , wherein said spindle is disposed at the bottom of the chuck assembly. 
     
     
         15 . The apparatus of  claim 1 , wherein said spindle is disposed on the top of the chuck assembly. 
     
     
         16 . The apparatus of  claim 1  further comprising at least one ultrasonic/megasonic device. 
     
     
         17 . The apparatus of  claim 14 , wherein said ultrasonic/megasonic device operates in a range from 5 KHz to 10 MHz. 
     
     
         18 . The apparatus of  claim 14 , wherein said ultrasonic/megasonic device is disposed in a position above said carrier and said chuck assembly. 
     
     
         19 . A method for cleaning flip chip assemblies comprising:
 loading at least one flip chip to flip chip carriers held by a chuck assembly;   flowing a cleaning solution for removing contaminants;   rotating the chuck assembly at a rotation speed.   
     
     
         20 . The method of  claim 19 , further comprising the steps of:
 changing chuck rotation speed during a cleaning process, in which a low rotation speed and a high rotation speed are used alternatively;   said low rotation speed N 1  is in the range less than   
       
         
           
             
               
                 
                   60 
                   × 
                   
                     
                       ( 
                       
                         
                           
                             2 
                              
                             σ 
                           
                           
                             ρ 
                              
                             
                                 
                             
                              
                             h 
                              
                             
                                 
                             
                              
                             A 
                              
                             
                                 
                             
                              
                             r 
                           
                         
                         + 
                         
                           
                             2 
                              
                             B 
                           
                           
                             rt 
                             2 
                           
                         
                       
                       ) 
                     
                     
                       1 
                       2 
                     
                   
                 
                 
                   2 
                    
                   π 
                 
               
               ; 
             
           
         
         said high speed N h  is in the range higher than 
       
       
         
           
             
               
                 60 
                 × 
                 
                   
                     ( 
                     
                       
                         
                           2 
                            
                           σ 
                         
                         
                           ρ 
                            
                           
                               
                           
                            
                           h 
                            
                           
                               
                           
                            
                           A 
                            
                           
                               
                           
                            
                           r 
                         
                       
                       + 
                       
                         
                           2 
                            
                           B 
                         
                         
                           rt 
                           2 
                         
                       
                     
                     ) 
                   
                   
                     1 
                     2 
                   
                 
               
               
                 2 
                  
                 π 
               
             
           
         
         where B denotes length of the flip chip, A denotes width of the flip chip, r denotes radius of position of the flip chip carrier on the chuck, h denotes space between two chip bond pads, t denotes chuck spin time, ρ denotes liquid density, and σ denotes liquid surface tension coefficient. 
       
     
     
         21 . The method of  claim 19 , further comprising the step of:
 applying ultrasonic/megasonic energy to the flip chip during cleaning process.   
     
     
         22 . The method of  claim 19 , further comprising the step of:
 blowing a gas or a vapor via the spray nozzles for drying the flip chips.   
     
     
         23 . A method for cleaning flip chip assemblies comprising:
 loading at least one flip chip to flip chip carriers held by a loading plate;   placing the loading plate into a cassette;   transferring a loading plate from a cassette to a chuck assembly in the process chamber;   flowing a cleaning solution onto the flip chips for removing contaminants;   rotating the chuck assembly at a rotation speed.   
     
     
         24 . The method of  claim 23 , further comprising the steps of:
 changing chuck rotation speed during a cleaning process, in which a low rotation speed and a high rotation speed are used alternatively;   said low rotation speed N 1  is in the range less than   
       
         
           
             
               
                 
                   60 
                   × 
                   
                     
                       ( 
                       
                         
                           
                             2 
                              
                             σ 
                           
                           
                             ρ 
                              
                             
                                 
                             
                              
                             h 
                              
                             
                                 
                             
                              
                             A 
                              
                             
                                 
                             
                              
                             r 
                           
                         
                         + 
                         
                           
                             2 
                              
                             B 
                           
                           
                             rt 
                             2 
                           
                         
                       
                       ) 
                     
                     
                       1 
                       2 
                     
                   
                 
                 
                   2 
                    
                   π 
                 
               
               ; 
             
           
         
         said high speed N h  is in the range higher than 
       
       
         
           
             
               
                 
                   60 
                   × 
                   
                     
                       ( 
                       
                         
                           
                             2 
                              
                             σ 
                           
                           
                             ρ 
                              
                             
                                 
                             
                              
                             h 
                              
                             
                                 
                             
                              
                             A 
                              
                             
                                 
                             
                              
                             r 
                           
                         
                         + 
                         
                           
                             2 
                              
                             B 
                           
                           
                             rt 
                             2 
                           
                         
                       
                       ) 
                     
                     
                       1 
                       2 
                     
                   
                 
                 
                   2 
                    
                   π 
                 
               
               ; 
             
           
         
         where B denotes length of a flip chip, A denotes width of a flip chip, r denotes radius of position of the flip chip carrier on the chuck, h denotes space between the two chip bond pads, t denotes chuck spin time, ρ denotes liquid density, and σ denotes liquid surface tension coefficient. 
       
     
     
         25 . The method of  claim 23 , further comprising the step of:
 applying ultrasonic/megasonic energy to the flip chip during cleaning process.   
     
     
         26 . The method of  claim 23 , further comprising the step of:
 blowing a gas or a vapor via the spray nozzles for drying the flip chips.

Join the waitlist — get patent alerts

Track US2014224281A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.