Methods and apparatus for cleaning flip chip assemblies
Abstract
An apparatus for cleaning flip chip assemblies is provided. The apparatus comprises: a chuck assembly; a motor coupled to the chuck assembly by a spindle; at least one carrier for holding flip chips; at least one spray nozzle for directing DIW, a cleaning solution, a gas or a vapor. Apparatus of the invention further provides a method for cleaning flip chip assemblies. The method comprises: loading at least one flip chip to the flip chip carriers; rotating the chuck assembly at a rotation speed; flowing DIW for rinsing the flip chips; flowing a cleaning solution for removing the contaminants; applying ultrasonic/megasonic energy to the flip chips; blowing a gas or a vapor via the spray nozzles for drying the flip chips; bringing the flip chips out of the flip chip carriers.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An apparatus for cleaning flip chip assemblies, comprising:
a chuck assembly; a motor coupled to the chuck assembly by a spindle; at least one carrier for holding a flip chip; at least one spray nozzle for directing DIW, a cleaning solution, a gas or a vapor.
2 . The apparatus of claim 1 , wherein said flip chip carrier is located off rotation center on the chuck assembly.
3 . The apparatus of claim 1 , wherein the apparatus further comprises a loading plate, and said flip chip carrier is located on said loading plate, and said loading plate is held by said chuck assembly.
4 . The apparatus of claim 1 , wherein said carrier holds a flip chip in top fixing manner.
5 . The apparatus of claim 1 , wherein said carrier holds a flip chip in bottom fixing manner.
6 . The apparatus of claim 1 , wherein said flip chip carriers is located at the off rotation center on the chuck assembly, the distribution pattern of the flip chip carriers is circle, square, swirl or concentric.
7 . The apparatus of claim 1 , wherein said spray nozzles is a fix nozzle, a scan nozzle or a swing nozzle.
8 . The apparatus of claim 1 , wherein said spray nozzle is disposed at the top of the chuck assembly.
9 . The apparatus of claim 1 , wherein said spray nozzle is disposed at one side of the flip chip carriers.
10 . The apparatus of claim 1 further comprising a recess located in the center of said chuck assembly, and a guide channel connects the recess with each flip chip carrier.
11 . The apparatus of claim 1 further comprising a recess with a spray nozzle at edge for holding each carrier.
12 . The apparatus of claim 1 further comprising an outer tank for holding cleaning solution for pre-soaking said flip chips held by said chuck assembly.
13 . The apparatus of claim 12 further comprising an ultrasonic/megasonic device attached on wall of said outer tank.
14 . The apparatus of claim 1 , wherein said spindle is disposed at the bottom of the chuck assembly.
15 . The apparatus of claim 1 , wherein said spindle is disposed on the top of the chuck assembly.
16 . The apparatus of claim 1 further comprising at least one ultrasonic/megasonic device.
17 . The apparatus of claim 14 , wherein said ultrasonic/megasonic device operates in a range from 5 KHz to 10 MHz.
18 . The apparatus of claim 14 , wherein said ultrasonic/megasonic device is disposed in a position above said carrier and said chuck assembly.
19 . A method for cleaning flip chip assemblies comprising:
loading at least one flip chip to flip chip carriers held by a chuck assembly; flowing a cleaning solution for removing contaminants; rotating the chuck assembly at a rotation speed.
20 . The method of claim 19 , further comprising the steps of:
changing chuck rotation speed during a cleaning process, in which a low rotation speed and a high rotation speed are used alternatively; said low rotation speed N 1 is in the range less than
60
×
(
2
σ
ρ
h
A
r
+
2
B
rt
2
)
1
2
2
π
;
said high speed N h is in the range higher than
60
×
(
2
σ
ρ
h
A
r
+
2
B
rt
2
)
1
2
2
π
where B denotes length of the flip chip, A denotes width of the flip chip, r denotes radius of position of the flip chip carrier on the chuck, h denotes space between two chip bond pads, t denotes chuck spin time, ρ denotes liquid density, and σ denotes liquid surface tension coefficient.
21 . The method of claim 19 , further comprising the step of:
applying ultrasonic/megasonic energy to the flip chip during cleaning process.
22 . The method of claim 19 , further comprising the step of:
blowing a gas or a vapor via the spray nozzles for drying the flip chips.
23 . A method for cleaning flip chip assemblies comprising:
loading at least one flip chip to flip chip carriers held by a loading plate; placing the loading plate into a cassette; transferring a loading plate from a cassette to a chuck assembly in the process chamber; flowing a cleaning solution onto the flip chips for removing contaminants; rotating the chuck assembly at a rotation speed.
24 . The method of claim 23 , further comprising the steps of:
changing chuck rotation speed during a cleaning process, in which a low rotation speed and a high rotation speed are used alternatively; said low rotation speed N 1 is in the range less than
60
×
(
2
σ
ρ
h
A
r
+
2
B
rt
2
)
1
2
2
π
;
said high speed N h is in the range higher than
60
×
(
2
σ
ρ
h
A
r
+
2
B
rt
2
)
1
2
2
π
;
where B denotes length of a flip chip, A denotes width of a flip chip, r denotes radius of position of the flip chip carrier on the chuck, h denotes space between the two chip bond pads, t denotes chuck spin time, ρ denotes liquid density, and σ denotes liquid surface tension coefficient.
25 . The method of claim 23 , further comprising the step of:
applying ultrasonic/megasonic energy to the flip chip during cleaning process.
26 . The method of claim 23 , further comprising the step of:
blowing a gas or a vapor via the spray nozzles for drying the flip chips.Join the waitlist — get patent alerts
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