Polishing pad conditioner pivot point

Abstract

A polishing system includes a polishing pad having a polishing surface and a conditioner apparatus. The conditioner apparatus includes a conditioner head constructed to receive a conditioning disk for conditioning a surface of the polishing pad, an arm that supports the conditioner head, a base that supports the arm, the arm pivotally connected to the base such that the arm is pivotable about a pivot point to change an angle of inclination of the arm, wherein the pivot point is positioned below the polishing surface of the polishing pad.

What is claimed is: 
     
         1 . A polishing system, comprising:
 a platen having a top surface to support a polishing pad; and   a conditioner apparatus including
 a conditioner head constructed to receive a conditioner disk for conditioning a surface of the polishing pad; 
 an arm that supports the conditioner head; 
 a base that supports the arm, the arm pivotally connected to the base such that the arm is pivotable about a pivot point to change an angle of inclination of the arm, wherein the pivot point is positioned below a plane parallel to and positioned 130 mils above the top surface of the platen. 
   
     
     
         2 . The polishing system of  claim 1 , wherein the pivot point is positioned between 0.05 and 2 inches below the plane. 
     
     
         3 . The polishing system of  claim 2 , wherein the pivot point is positioned about 0.1 inch below the plane. 
     
     
         4 . The polishing system of  claim 1 , wherein the pivot point is positioned below the top surface of the platen. 
     
     
         5 . The polishing system of  claim 1 , comprising an actuator configured to sweep the arm over the polishing pad. 
     
     
         6 . The polishing system of  claim 1 , comprising a linear actuator connecting the base to the arm to control an angle of inclination of the arm. 
     
     
         7 . A polishing system, comprising:
 a polishing pad having a polishing surface; and   a conditioner apparatus including
 a conditioner head constructed to receive a conditioner disk for conditioning a surface of the polishing pad; 
 an arm that supports the conditioner head; 
 a base that supports the arm, the arm pivotally connected to the base such that the arm is pivotable about a pivot point to change an angle of inclination of the arm, wherein the pivot point is positioned below the polishing surface of the polishing pad. 
   
     
     
         8 . The polishing system of  claim 7 , wherein the pivot point is positioned between 0.05 and 2 inches below the polishing surface. 
     
     
         9 . The polishing system of  claim 8 , wherein the pivot point is positioned about 0.1 inch below the polishing surface. 
     
     
         10 . The polishing system of  claim 7 , wherein the pivot point is positioned below the top surface of the platen. 
     
     
         11 . The polishing system of  claim 7 , comprising an actuator configured to sweep the arm over the polishing pad. 
     
     
         12 . The polishing system of  claim 7 , comprising a linear actuator connecting the base to the arm to control an angle of inclination of the arm. 
     
     
         13 . A polishing system, comprising:
 a platen having a top surface to support a polishing pad; and   a conditioner apparatus including
 a conditioner head constructed to receive a conditioner disk for conditioning a surface of the polishing pad; 
 an arm that supports the conditioner head; 
 a base that supports the arm, the arm pivotally connected to the base such that the arm is pivotable about a pivot point to change an angle of inclination of the arm, wherein the pivot point is positioned the top surface of the platen.