Method and device for producing a microlens

Abstract

A method for producing a microlens with a carrier wafer, in which a lens in one opening of the carrier wafer is molded into the carrier wafer by stamping of the lens and to a corresponding device for executing the method and to a microlens which has been produced using the method.

Having described the invention, the following is claimed: 
     
         1 . Method for producing a microlens with a carrier wafer, the carrier wafer having an inner ring extending between opposite facing surfaces of the carrier wafer, the inner ring defining an opening of the carrier wafer for accommodating the microlens therein, the method comprising a step of:
 molding the microlens into the carrier wafer by stamping of the microlens using two lens dies each having a contact surface dimensioned to adjoin a corresponding mating surface of the carrier wafer for coplanar alignment of the lens dies during stamping,   wherein a thickness of the carrier wafer defines a thickness of the formed micro lens.   
     
     
         2 . Method as claimed in  claim 1 , wherein the carrier wafer is located outside a beam path of the microlens. 
     
     
         3 . Method as claimed in  claim 1 , wherein each of a plurality of microlenses is molded into a corresponding opening of a carrier wafer matrix which encompasses corresponding carrier wafers during stamping. 
     
     
         4 . Method as claimed in  claim 1 , further comprising the following sequence:
 alignment and fixing of a lower lens die with the opening of the carrier wafer,   delivery of a lens material which forms the microlens into the opening,   stamping of the microlens by acting on the lens material with an upper lens die and   curing of the microlens.   
     
     
         5 . Method as claimed in  claim 1 , wherein a holding structure extends from an annular surface of the inner ring at a location spaced from both of the opposite facing surfaces of the carrier wafer, and wherein the holding structure is an annular projection extending from the annular surface of the inner ring. 
     
     
         6 . Method as claimed in  claim 1 , wherein a holding structure extends from an annular surface of the inner ring at a location spaced from both of the opposite facing surfaces of the carrier wafer, and wherein the holding structure is a plurality of projections extending from the annular surface of the inner ring. 
     
     
         7 . Method for producing a microlens with a carrier wafer, the carrier wafer having an inner ring extending between opposite facing surfaces of the carrier wafer, the inner ring defining an opening of the carrier wafer for accommodating the microlens therein, the method comprising a step of:
 molding the microlens into the carrier wafer by stamping of the microlens using two lens dies each having a contact surface dimensioned to adjoin a corresponding mating surface of the carrier wafer for coplanar alignment of the lens dies during stamping,   wherein a coefficient of thermal expansion of the microlens is greater than a coefficient of thermal expansion of the carrier wafer such that gap is formed between the microlens and the carrier wafer during said step of molding.   
     
     
         8 . Method as claimed in  claim 7 , wherein the carrier wafer is located outside a beam path of the microlens. 
     
     
         9 . Method as claimed in  claim 7 , wherein each of a plurality of microlenses is molded into a corresponding opening of a carrier wafer matrix which encompasses corresponding carrier wafers during stamping. 
     
     
         10 . Method as claimed in  claim 7 , further comprising the following sequence:
 alignment and fixing of a lower lens die with the opening of the carrier wafer,   delivery of a lens material which forms the microlens into the opening,   stamping of the microlens by acting on the lens material with an upper lens die and   curing of the microlens.   
     
     
         11 . Method as claimed in  claim 7 , wherein a holding structure extends from an annular surface of the inner ring at a location spaced from both of the opposite facing surfaces of the carrier wafer, and wherein the holding structure is an annular projection extending from the annular surface of the inner ring. 
     
     
         12 . Method as claimed in  claim 7 , wherein a holding structure extends from an annular surface of the inner ring at a location spaced from both of the opposite facing surfaces of the carrier wafer, and wherein the holding structure is a plurality of projections extending from the annular surface of the inner ring. 
     
     
         13 . Method for producing a microlens with a carrier wafer, the carrier wafer having an inner ring extending between opposite facing surfaces of the carrier wafer, the inner ring defining an opening of the carrier wafer for accommodating the microlens therein, wherein a holding structure extends from an annular surface of the inner ring at a location spaced from both of the opposite facing surfaces of the carrier wafer, the method comprising a step of:
 molding the microlens into the carrier wafer by stamping of the microlens using two lens dies each having a contact surface dimensioned to adjoin a corresponding mating surface of the carrier wafer for coplanar alignment of the lens dies during stamping,   wherein a plurality of minor projections define the holding structure.   
     
     
         14 . Method as claimed in  claim 13 , wherein the carrier wafer is located outside a beam path of the microlens. 
     
     
         15 . Method as claimed in  claim 13 , wherein each of a plurality of microlenses is molded into a corresponding opening of a carrier wafer matrix which encompasses corresponding carrier wafers during stamping. 
     
     
         16 . Method as claimed in  claim 13 , further comprising the following sequence:
 alignment and fixing of a lower lens die with the opening of the carrier wafer,   delivery of a lens material which forms the microlens into the opening,   stamping of the microlens by acting on the lens material with an upper lens die and   curing of the microlens.   
     
     
         17 . Method for producing a microlens with a carrier wafer, the carrier wafer having an inner ring extending between opposite facing surfaces of the carrier wafer, the inner ring defining an opening of the carrier wafer for accommodating the microlens therein, the method comprising a step of:
 molding the microlens into the carrier wafer by stamping of the microlens using two lens dies each having a contact surface dimensioned to adjoin a corresponding mating surface of the carrier wafer for coplanar alignment of the lens dies during stamping,   wherein a spacer extends from a surface of at least one of the two lens dies, said spacer dimensioned to extend through an opening formed in the carrier wafer to contact an opposite lens die such that the spacer defines a thickness of the formed microlens.   
     
     
         18 . Method as claimed in  claim 17 , wherein the carrier wafer is located outside a beam path of the microlens. 
     
     
         19 . Method as claimed in  claim 17 , wherein each of a plurality of microlenses is molded into a corresponding opening of a carrier wafer matrix which encompasses corresponding carrier wafers during stamping. 
     
     
         20 . Method as claimed in  claim 17 , further comprising the following sequence:
 alignment and fixing of a lower lens die with the opening of the carrier wafer,   delivery of a lens material which forms the microlens into the opening,   stamping of the microlens by acting on the lens material with an upper lens die and   curing of the microlens.   
     
     
         21 . Method as claimed in  claim 17 , wherein a holding structure extends from an annular surface of the inner ring at a location spaced from both of the opposite facing surfaces of the carrier wafer, and wherein the holding structure is an annular projection extending from the annular surface of the inner ring. 
     
     
         22 . Method as claimed in  claim 17 , wherein a holding structure extends from an annular surface of the inner ring at a location spaced from both of the opposite facing surfaces of the carrier wafer, and wherein the holding structure is a plurality of projections extending from the annular surface of the inner ring.