Chemical mechanical polishing pad with internal channels

Abstract

A polishing pad for chemical mechanical polishing is provided. The polishing pad includes a base region having a supporting surface. The polishing pad further includes a plurality of polishing features forming a polishing surface, the polishing surface opposing the supporting surface. The polishing pad further includes one or more channels formed in an interior region of the polishing pad and extending at least partly around a center of the polishing pad, wherein each channel is fluidly coupled to at least one port.

1 . A polishing pad for chemical mechanical polishing comprising:
 a base region having a supporting surface;   a plurality of polishing features forming a polishing surface, the polishing surface opposing the supporting surface; and   one or more channels formed in an interior region of the polishing pad, the one or more channels extending at least partly around a center of the polishing pad, wherein each channel is fluidly coupled to at least one port.   
     
     
         2 . The polishing pad of  claim 1 , wherein:
 the one or more ports comprises two or more ports; and   the one or more channels comprises two or more channels, wherein at least two of the channels are fluidly coupled to a separate port.   
     
     
         3 . The polishing pad of  claim 2 , wherein the two or more channels comprise at least an inner channel and an outer channel, wherein the outer channel substantially surrounds the inner channel. 
     
     
         4 . The polishing pad of  claim 3 , further comprising a pressure sensor disposed in at least one of the inner channel and the outer channel. 
     
     
         5 . The polishing pad of  claim 1 , wherein:
 the plurality of polishing features comprises fixed polishing features and adjustable polishing features; and   the one or more channels comprises two or more channels, wherein each channel is disposed adjacent to at least some of the adjustable polishing features.   
     
     
         6 . The polishing pad of  claim 1 , wherein each channel is fluidly coupled to two or more ports. 
     
     
         7 . The polishing pad of  claim 6 , wherein at least two of the channels are fluidly coupled to separate ports. 
     
     
         8 . The polishing pad of  claim 6 , wherein each channel is fluidly coupled to a supply port and a return port, and each channel extends about 360 degrees around the center of the polishing pad. 
     
     
         9 . The polishing pad of  claim 6 , further comprising a temperature sensor disposed in each channel. 
     
     
         10 . The polishing pad of  claim 1 , wherein at least some of the polishing features comprise a polishing feature channel coupling one of the one or more channels to an aperture through the polishing surface. 
     
     
         11 . The polishing pad of  claim 10 , further comprising a plurality of sectors disposed around a center of the polishing pad, wherein each sector includes one of the one or more channels and each channel is coupled to a separate port of the polishing pad. 
     
     
         12 . The polishing pad of  claim 10 , further comprising a ring of polishing features that each have an aperture through the polishing surface surrounding a ring of polishing features that each lack an aperture through the polishing surface. 
     
     
         13 . A polishing pad for chemical mechanical polishing comprising:
 a base region having a supporting surface;   a plurality of polishing features forming a polishing surface, the polishing surface opposing the supporting surface; and   one or more plenums formed in an interior region of the polishing pad, wherein each of the one or more plenums is fluidly coupled to a port.   
     
     
         14 . The polishing pad of  claim 13 , wherein at least some of the polishing features comprise a polishing feature channel coupling the plenum to an aperture in the polishing surface. 
     
     
         15 . The polishing pad of  claim 13 , further comprising an inner channel and an outer channel, wherein the outer channel substantially surrounds the inner channel and the inner channel substantially surrounds one of the one or more plenums. 
     
     
         16 . The polishing pad of  claim 15 , further comprising a pressure sensor disposed in each of the plenum, the inner channel and the outer channel. 
     
     
         17 . The polishing pad of  claim 15 , wherein the plenum, the inner channel, and the outer channel are each coupled to a supply port and a return port and a temperature sensor is disposed in at least one of the plenum, the inner channel, and the outer channel. 
     
     
         18 . The polishing device of  claim 15 , wherein the plenum, the inner channel and the outer channel are filled with a non-Newtonian fluid. 
     
     
         19 . A polishing device for chemical mechanical polishing comprising:
 a platen comprising:
 a shaft; 
 a platen plate supported by the shaft, the platen plate having a mounting surface; and 
 one or more conduits distributed through the shaft and the platen plate; 
   a polishing pad comprising:
 a base region having a supporting surface for contacting the mounting surface of the platen; 
 a plurality of polishing features forming a polishing surface, the polishing surface opposing the supporting surface; 
 one or more channels formed in an interior of the polishing pad, the one or more channels extending at least 15 degrees around a center of the polishing pad; and 
   a seal providing a sealed connection between the one or more conduits of the platen and the one or more channels of the polishing pad.   
     
     
         20 . The polishing device of  claim 19 , wherein:
 the one or more channels comprise two or more channels, and   the one or more conduits comprise two or more conduits, wherein at least two of the channels are fluidly coupled to a separate conduit.