US2016115590A1PendingUtilityA1

Method and system for treatment of deposition reactor

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Assignee: ASM IP HOLDING BVPriority: Feb 1, 2013Filed: Jan 4, 2016Published: Apr 28, 2016
Est. expiryFeb 1, 2033(~6.6 yrs left)· nominal 20-yr term from priority
H10P 50/267H10P 50/266C23C 16/4405C23C 16/4404C23F 1/08C23F 1/00C23C 16/30C23C 16/4408C23C 16/4412
49
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Claims

Abstract

A system and method for treating a deposition reactor are disclosed. The system and method remove or mitigate formation of residue in a gas-phase reactor used to deposit doped metal films, such as aluminum-doped titanium carbide films or aluminum-doped tantalum carbide films. The method includes a step of exposing a reaction chamber to a treatment reactant that mitigates formation of species that lead to residue formation.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A system for treating as reaction chamber, the system comprising:
 a reactor comprising a reaction chamber;   a metal halide source fluidly coupled to the reactor;   a metal CVD source selected from the group consisting of one or more of organometallic compounds and aluminum CVD compounds fluidly coupled to the reactor;   a treatment reactant source coupled to the reactor; and   a vacuum pump coupled to the reactor.   
     
     
         2 . The system of  claim 1 , further comprising a plasma source, wherein treatment reactant from the treatment reactant source is exposed to the plasma source to form one or more excited treatment reactant species. 
     
     
         3 . The system of  claim 1 , further comprising a thermal excitation source, wherein treatment reactant from the treatment reactant source is exposed to the thermal excitation source to form one or more excited treatment reactant species. 
     
     
         4 . The system of  claim 1 , wherein the treatment reactant source comprises one or more compounds selected from the group of compounds comprising one or more hydrogen atoms and compounds comprising a halogen. 
     
     
         5 . The system of  claim 1 , wherein the treatment reactant source comprises one or more of ammonia, hydrogen, silane, methane, silicon hydrides, boron hydrides, halosilanes, haloboranes, alkenes, alkynes, and hydrazine and its derivatives. 
     
     
         6 . The system of  claim 1 , wherein the treatment reactant source comprises a decomposition product of the CVD source.

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