Method for depositing film

Abstract

The method for depositing a film of the present invention comprises the first film deposition step of depositing a first film 103 having hardness higher than hardness of a substrate 101 on a surface of the substrate 101 , the first irradiation step of irradiating particles having energy on the first film 103 , and the second film deposition step of depositing an oil-repellent film 105 on a surface of the first film 103 subjected to the first irradiation step. According to the present invention, a method for depositing a film enabling production of an oil-repellent substrate comprising an oil-repellent film having abrasion resistance of a practically sufficient level can be provided.

1 . A method for preparing an abrasion resistant oil-repellent film on a substrate comprising:
 depositing a first film on a surface of a substrate by a film deposition method by repeating between a sputtering treatment and a plasma exposure treatment,   irradiating particles having energy on the first film, and   depositing a second film having oil repellency on a surface of the first film.   
     
     
         2 . The method for depositing a film according to  claim 1 , comprising:
 depositing the first film on the surface of the substrate by the film deposition method, on the substrate to form a film of a predetermined thickness at which time film deposition is stopped, and the particles having energy exposure starts as a first irradiation treatment to form a predetermined surface roughness on the deposited film; and   depositing, the second film having oil repellency on the roughened surface by vacuum vapor deposition to form an abrasion resistant oil-repellent film on the substrate.   
     
     
         3 . The method for depositing a film according to  claim 2 , wherein the surface roughness formed on the first film by particles having energy exposure, has a centerline average roughness (Ra): 0.1 to 1000 nm, a 10 point average height (Rz): 5 to 2000 nm, a maximum valley depth (Pv): is 15 to 200 nm and a cycle of projections: 1 to 50 nm. 
     
     
         4 . The method for depositing a film according to  claim 2 , wherein the first film deposited on the substrate by the film deposition method, is made of an inorganic material selected from a group of SiO 2 , ZrO 2 , Si 3 N 4  and Al 2 O 3 . 
     
     
         5 . The method for depositing a film according to  claim 1 , comprising:
 depositing the first film on the surface of the substrate by the film deposition method, on the substrate to form a film of a predetermined thickness at which time the sputtering treatment only in film deposition is stopped, and the plasma exposure continues as a first irradiation treatment to form a predetermined surface roughness on the deposited film; and   depositing, the second film having oil repellency on the roughened surface by vacuum vapor deposition to form an abrasion resistant oil-repellent film on the substrate.   
     
     
         6 . The method for depositing a film according to  claim 5 , wherein the surface roughness formed on the first film by plasma exposure continuation, has a centerline average roughness (Ra): 0.1 to 1000 nm, a 10 point average height (Rz): 5 to 2000 nm, a maximum valley depth (Pv): is 15 to 200 nm and a cycle of projections: 1 to 50 nm. 
     
     
         7 . The method for depositing a film according to  claim 5 , wherein the first film deposited on the substrate by the film deposition method, is made of an inorganic material selected from a group of SiO 2 , ZrO 2 , Si 3 N 4  and Al 2 O 3 . 
     
     
         8 . The method for depositing a film according to  claim 1 , wherein particles having energy that are irradiated to the first film, have an accelerating voltage between 100 and 2000 V. 
     
     
         9 . The method for depositing a film according to  claim 1 , wherein particles having energy that are irradiated to the first film, have a current density between 1 and 120 μA/cm 2 . 
     
     
         10 . The method for depositing a film according to  claim 1 , wherein particles having energy are irradiated to the first film for 1 to 800 seconds. 
     
     
         11 . The method for depositing a film according to  claim 1 , wherein particles having energy are irradiated by the number of 1×10 13  to 5×10 17  particles/cm 2  to the first film. 
     
     
         12 . The method for depositing a film according to  claim 1 , wherein particles having energy consist of an ion beam containing at least argon. 
     
     
         13 . The method for depositing a film according to  claim 1 , wherein the first film deposited on the surface of the substrate has a thickness of 3 to 1000 nm. 
     
     
         14 . The method for depositing a film according to  claim 1 , wherein the first film deposited on the surface of the substrate has a hardness higher than that of the substrate. 
     
     
         15 . The method for depositing a film according to  claim 1 , wherein particles having energy are irradiated to the surface of the substrate prior to deposition of the first film. 
     
     
         16 . The method for depositing a film according to  claim 1 , wherein the substrate is a glass substrate with a pencil hardness of 6H and the second film is formed from a fluorine-containing organosilicon compound.