Integration of laminate mems in bbul coreless package

Abstract

An apparatus including a die including a first side and an opposite second side including a device side with contact points and lateral sidewalls defining a thickness of the die; a build-up carrier coupled to the second side of the die, the build-up carrier including a plurality of alternating layers of conductive material and insulating material, wherein at least one of the layers of conductive material is coupled to one of the contact points of the die; and at least one device within the build-up carrier disposed in an area void of a layer of patterned conductive material. A method and an apparatus including a computing device including a package including a microprocessor are also disclosed.

1 .- 8 . (canceled) 
     
     
         9 . A method comprising:
 forming a first portion of a build-up carrier adjacent a device side of a die, the first portion comprising at least one layer of patterned conductive material coupled to a contact point of the die;   forming a second portion of the build-up carrier on the first portion, the second portion comprising at least one device in an area pre-determined to be void of a patterned layer of conductive material; and   encapsulating the at least one device in the build-up carrier.   
     
     
         10 . (canceled) 
     
     
         11 . The method of  claim 9 , wherein encapsulating comprises encapsulating the at least one device in a cavity. 
     
     
         12 . The method of  claim 9 , wherein encapsulating the at least one device comprises surrounding each side of the device with a dielectric material, and after encapsulating the at least one device, forming a cavity around at least a portion of the at least one device. 
     
     
         13 . The method of  claim 9 , wherein forming a cavity comprises forming at least one release hole in a dielectric material on the device and removing dielectric material from around the device through the at least one release hole. 
     
     
         14 . The method of  claim 13 , wherein after forming the cavity, the method further comprises sealing the at least one release hole. 
     
     
         15 . The method of  claim 9 , wherein the at least one device comprises a microelectromechanical system (MEMS) device. 
     
     
         16 . The method of  claim 15 , wherein the at least one MEMS devices is a sensor. 
     
     
         17 . The method of  claim 15 , wherein the at least one MEMS device is an actuator. 
     
     
         18 .- 20 . (Canceled)