Inventor · disambiguated record
Weng Hong Teh
Also filed as: TEH WENG HONG
46 granted patents·9 pending applications·412 citations·filing 2011–2025
98Inventor score
Top patents by PatentIndex Score
55 records- 0199US9190380B2High density substrate routing in BBUL packageINTEL CORP·Filed 2012·Granted Nov 17, 2015·64 cites·17 claims
- 0299US9171816B2High density substrate routing in BBUL packageINTEL CORP·Filed 2015·Granted Oct 27, 2015·53 cites·17 claims
- 0398US9437569B2High density substrate routing in BBUL packageINTEL CORP·Filed 2015·Granted Sep 6, 2016·23 cites·20 claims
- 0497US10199346B2High density substrate routing in packageINTEL CORP·Filed 2018·Granted Feb 5, 2019·12 cites·20 claims
- 0597US9929119B2High density substrate routing in BBUL packageINTEL CORP·Filed 2016·Granted Mar 27, 2018·11 cites·20 claims
- 0697US9224674B2Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packagesMALATKAR PRAMOD·Filed 2011·Granted Dec 29, 2015·38 cites·28 claims
- 0797US9153552B2Bumpless build-up layer package including an integrated heat spreaderINTEL CORP·Filed 2014·Granted Oct 6, 2015·43 cites·8 claims
- 0897US8912670B2Bumpless build-up layer package including an integrated heat spreaderINTEL CORP·Filed 2012·Granted Dec 16, 2014·53 cites·10 claims
- 0996US8633551B1Semiconductor package with mechanical fuseTEH WENG HONG·Filed 2012·Granted Jan 21, 2014·30 cites·30 claims
- 1094US9520376B2Bumpless build-up layer package including an integrated heat spreaderINTEL CORP·Filed 2015·Granted Dec 13, 2016·11 cites·7 claims
- 1192US9368401B2Embedded structures for package-on-package architectureINTEL CORP·Filed 2014·Granted Jun 14, 2016·13 cites·19 claims
- 1291US12327807B2High density substrate routing in packageINTEL CORP·Filed 2024·Granted Jun 10, 2025·0 cites·20 claims
- 1391US2025323204A1High density substrate routing in packageINTEL CORP·Filed 2025·Application pending·0 cites
- 1491US2025323203A1High density substrate routing in packageINTEL CORP·Filed 2025·Application pending·0 cites
- 1590US8866287B2Embedded structures for package-on-package architectureINTEL CORP·Filed 2012·Granted Oct 21, 2014·11 cites·15 claims
- 1688US2025323202A1High density substrate routing in packageINTEL CORP·Filed 2025·Application pending·0 cites
- 1787US12051667B2High density substrate routing in packageINTEL CORP·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
- 1887US8937382B2Secondary device integration into coreless microelectronic device packagesTEH WENG HONG·Filed 2011·Granted Jan 20, 2015·8 cites·5 claims
- 1985US9748177B2Embedded structures for package-on-package architectureINTEL CORP·Filed 2016·Granted Aug 29, 2017·4 cites·20 claims
- 2083US9345184B2Magnetic field shielding for packaging build-up architecturesINTEL CORP·Filed 2013·Granted May 17, 2016·6 cites·22 claims
- 2183US9297824B2Techniques, systems and devices related to acceleration measurementMA QING·Filed 2012·Granted Mar 29, 2016·4 cites·16 claims
- 2283US9200973B2Semiconductor package with air pressure sensorLin kevin l·Filed 2012·Granted Dec 1, 2015·6 cites·14 claims
- 2382US10636769B2Semiconductor package having spacer layerINTEL CORP·Filed 2018·Granted Apr 28, 2020·2 cites·21 claims
- 2481US9490196B2Multi die package having a die and a spacer layer in a recessTEH WENG HONG·Filed 2011·Granted Nov 8, 2016·4 cites·9 claims
- 2580US11810884B2High density substrate routing in packageINTEL CORP·Filed 2022·Granted Nov 7, 2023·0 cites·24 claims
- 2679US9520350B2Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layerTEH WENG HONG·Filed 2013·Granted Dec 13, 2016·5 cites·15 claims
- 2779US2023420400A1Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (bbul) packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 2876US11251150B2High density substrate routing in packageINTEL CORP·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 2974US9242854B2Hermetic encapsulation for microelectromechanical systems (MEMS) devicesINTEL CORP·Filed 2013·Granted Jan 26, 2016·2 cites·18 claims
- 3072US2022068861A1Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (bbul) packagesINTEL CORP·Filed 2021·Application pending·0 cites
- 3171US9686870B2Method of forming a microelectronic device packageINTEL CORP·Filed 2014·Granted Jun 20, 2017·2 cites·18 claims
- 3271US9601421B2BBUL material integration in-plane with embedded die for warpage controlTEH WENG HONG·Filed 2011·Granted Mar 21, 2017·3 cites·11 claims
- 3370US10861815B2High density substrate routing in packageINTEL CORP·Filed 2019·Granted Dec 8, 2020·0 cites·19 claims
- 3470US9275969B2Optical interconnect on bumpless build-up layer packageINTEL CORP·Filed 2012·Granted Mar 1, 2016·2 cites·24 claims
- 3567US10438915B2High density substrate routing in packageINTEL CORP·Filed 2019·Granted Oct 8, 2019·0 cites·20 claims
- 3666US9800015B2Optical interconnect on bumpless build-up layer packageINTEL CORP·Filed 2016·Granted Oct 24, 2017·1 cites·20 claims
- 3763US9576909B2Bumpless die-package interface for bumpless build-up layer (BBUL)INTEL CORP·Filed 2013·Granted Feb 21, 2017·1 cites·24 claims
- 3861US11264301B2System and method to enhance reliability in connection with arrangements including circuitsWESTERN DIGITAL TECH INC·Filed 2020·Granted Mar 1, 2022·0 cites·17 claims
- 3960US10156583B2Method of making an accelerometerINTEL CORP·Filed 2016·Granted Dec 18, 2018·0 cites·5 claims
- 4058US11094604B2System and method to enhance solder joint reliabilityWESTERN DIGITAL TECH INC·Filed 2019·Granted Aug 17, 2021·0 cites·20 claims
- 4156US10083936B2Semiconductor package having spacer layerINTEL CORP·Filed 2016·Granted Sep 25, 2018·0 cites·7 claims
- 4255US11201128B2Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packagesINTEL CORP·Filed 2015·Granted Dec 14, 2021·0 cites·3 claims
- 4355US10179729B2Hermetic encapsulation for microelectromechanical systems (MEMS) devicesINTEL CORP·Filed 2016·Granted Jan 15, 2019·0 cites·18 claims
- 4452US10508961B2Semiconductor package with air pressure sensorINTEL CORP·Filed 2015·Granted Dec 17, 2019·0 cites·10 claims
- 4551US10636722B2System and method to enhance solder joint reliabilityWESTERN DIGITAL TECH INC·Filed 2017·Granted Apr 28, 2020·0 cites·18 claims
- 4649US9708178B2Integration of laminate MEMS in BBUL coreless packageTEH WENG HONG·Filed 2011·Granted Jul 18, 2017·0 cites·15 claims
- 4749US9429427B2Inductive inertial sensor architecture and fabrication in packaging build-up layersMA QING·Filed 2012·Granted Aug 30, 2016·0 cites·17 claims
- 4849US2017225946A1Integration of laminate mems in bbul coreless packageINTEL CORP·Filed 2017·Application pending·0 cites
- 4947US9674945B2Heterogeneous integration of microfluidic devices in package structuresINTEL CORP·Filed 2012·Granted Jun 6, 2017·0 cites·36 claims
- 5044US9505610B2Device, system and method for providing MEMS structures of a semiconductor packageTEH WENG HONG·Filed 2013·Granted Nov 29, 2016·0 cites·19 claims
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →