Substrate processing apparatus and processing liquid supply method

Abstract

A substrate processing apparatus includes a processing liquid supply mechanism 70 configured to supply a SPM liquid to a substrate; a temperature adjusting unit (heater) 303 configured to adjust a temperature of the SPM liquid at a time when the SPM liquid is supplied to the substrate from the processing liquid supply mechanism 70; an acquisition unit (temperature sensor) 80 configured to acquire temperature information of the SPM liquid on a surface of the substrate; and a control unit 18 configured to set an adjustment amount of the temperature adjusting unit (heater) 303 based on the temperature information of the SPM liquid acquired by the acquisition unit (temperature sensor) 80. The temperature adjusting unit (heater) 303 adjusts, based on the adjustment amount set by the control unit 18, the temperature of the SPM liquid at the time when the SPM liquid is supplied to the substrate.

We claim: 
     
         1 . A substrate processing apparatus, comprising:
 a processing liquid supply mechanism configured to generate a SPM liquid by mixing sulfuric acid and hydrogen peroxide and supply the generated SPM liquid to a substrate;   a temperature adjusting unit configured to adjust a temperature of the SPM liquid at a time when the SPM liquid is supplied to the substrate from the processing liquid supply mechanism;   an acquisition unit configured to acquire temperature information of the SPM liquid on a surface of the substrate; and   a control unit configured to set an adjustment amount of the temperature adjusting unit based on the temperature information acquired by the acquisition unit,   wherein the temperature adjusting unit adjusts, based on the adjustment amount set by the control unit, the temperature of the SPM liquid at the time when the SPM liquid is supplied to the substrate from the processing liquid supply mechanism.   
     
     
         2 . The substrate processing apparatus of  claim 1 ,
 wherein the processing liquid supply mechanism comprises:   a first path through which the sulfuric acid is flown;   a second path through which the hydrogen peroxide is flown;   a mixing unit configured to generate the SPM liquid by mixing the sulfuric acid from the first path and the hydrogen peroxide from the second path at a preset mixing ratio; and   a discharging unit configured to discharge the SPM liquid generated by the mixing unit toward the substrate,   wherein the temperature adjusting unit is provided at the first path to adjust a temperature of the sulfuric acid flowing in the first path.   
     
     
         3 . The substrate processing apparatus of  claim 1 ,
 wherein the processing liquid supply mechanism comprises:   a first path through which the sulfuric acid is flown;   a second path through which the hydrogen peroxide is flown;   a mixing unit configured to generate the SPM liquid by mixing the sulfuric acid from the first path and the hydrogen peroxide from the second path at a preset mixing ratio; and   a discharging unit configured to discharge the SPM liquid generated by the mixing unit toward the substrate,   wherein the temperature adjusting unit serves as the mixing unit and is configured to adjust the temperature of the SPM liquid by varying the mixing ratio based on the temperature information of the SPM liquid acquired by the acquisition unit.   
     
     
         4 . The substrate processing apparatus of  claim 1 ,
 wherein the acquisition unit is configured to acquire the temperature information when the SPM liquid is supplied to a single sheet of substrate, and   the control unit controls the adjustment amount of the temperature adjusting unit when the SPM liquid is supplied to the single sheet of substrate.   
     
     
         5 . The substrate processing apparatus of  claim 1 ,
 wherein the processing liquid supply mechanism comprises:   a storing unit configured to store the sulfuric acid therein;   a circulation path configured to circulate the sulfuric acid of the storing unit therethrough;   a branch path, branched off from the circulation path, through which the sulfuric acid is flown;   a mixing unit configured to generate the SPM liquid by mixing the sulfuric acid flowing in the branch path with the hydrogen peroxide at a preset mixing ratio; and   a discharging unit configured to discharge the SPM liquid generated by the mixing unit toward the substrate,   wherein the temperature adjusting unit adjusts a temperature of the sulfuric acid flowing in the circulation path.   
     
     
         6 . The substrate processing apparatus of  claim 1 ,
 wherein the acquisition unit is implemented by a temperature sensor configured to measure a temperature distribution of the SPM liquid on the substrate, and   the control unit calculates a difference value between a required temperature of the SPM liquid and the temperature of the SPM liquid on the substrate based on a temperature distribution characteristic obtained from the acquired temperature information, and sets the adjustment amount of the temperature adjusting unit based on the calculated difference value.   
     
     
         7 . The substrate processing apparatus of  claim 6 ,
 wherein the control unit sets the adjustment amount of the temperature adjusting unit based on a difference between the required temperature of the SPM liquid and a temperature value of the SPM liquid at a central zone of the substrate.   
     
     
         8 . The substrate processing apparatus of  claim 6 ,
 wherein the control unit sets the adjustment amount of the temperature adjusting unit based on a difference between the required temperature of the SPM liquid and a temperature value of the SPM liquid at a peripheral zone of the substrate.   
     
     
         9 . The substrate processing apparatus of  claim 6 ,
 wherein the control unit sets the adjustment amount of the temperature adjusting unit based on a difference between the required temperature of the SPM liquid and an average value of temperature values of the SPM liquid on an entire surface of the substrate.   
     
     
         10 . The substrate processing apparatus of  claim 6 ,
 wherein the control unit sets the adjustment amount of the temperature adjusting unit based on a difference between the required temperature of the SPM liquid and a lowest value among temperature values of the SPM liquid on an entire surface of the substrate.   
     
     
         11 . A processing liquid supply method of generating a SPM liquid by mixing sulfuric acid and hydrogen peroxide and supplying the generated SPM liquid to a substrate, the processing liquid supply method comprising:
 acquiring temperature information of the SPM liquid on a surface of the substrate;   setting, based on the temperature information acquired in the acquiring of the temperature information, an adjustment amount of a temperature of the SPM liquid at a time when the SPM liquid is supplied to the substrate; and   adjusting the temperature of the SPM liquid at the time when the SPM liquid is supplied to the substrate, based on the adjustment amount set in the setting of the adjustment amount.