Cmp machine with improved throughput and process flexibility

Abstract

An apparatus for performing chemical mechanical planarization is disclosed. The apparatus includes a support, wherein an axis of rotation extends through the support. The apparatus includes at least one elongated member including a first portion and a second portion opposed to the first portion. The first portion is configured to rotatably connect to the support and pivot the elongated member about the axis of rotation relative to the support through an angle of rotation that is at least about 270 degrees in a single direction. The apparatus includes a carrier head configured to connect to the second portion and to hold and process a substrate.

What is claimed is: 
     
         1 . A substrate carrier head system, comprising:
 a support, wherein an axis of rotation extends through the support;   at least one elongated member comprising a first portion and a second portion opposed to the first portion, wherein the first portion is configured to rotatably connect to the support and pivot the elongated member about the axis of rotation relative to the support through an angle of rotation that is at least about 270 degrees in a single direction; and   a carrier head configured to connect to the second portion and to hold and process a substrate.   
     
     
         2 . The system of  claim 1 , wherein the angle of rotation is substantially unrestricted in a single direction. 
     
     
         3 . The system of  claim 1 , wherein the carrier head comprises a membrane configured to be pressurized, to allow a substrate to contact and be processed by a polishing pad on a platen. 
     
     
         4 . The system of  claim 1 , further comprising:
 a controller configured to cause the carrier head to move the substrate from a first position allowing a first process to be performed on the substrate on a first platen, to a second position allowing a second process to be performed on the substrate on a second platen.   
     
     
         5 . The system of  claim 4 , wherein the first and second processes are different. 
     
     
         6 . The system of  claim 5 , wherein the first process is a bulk removal process and the second process is a fine removal process. 
     
     
         7 . A substrate carrier head system, comprising:
 at least one support, wherein a first axis of rotation extends through the support;   at least one elongated member comprising:
 a first link having a first portion and a second portion opposed to the first portion, wherein the first portion is configured to rotatably connect to the support and pivot the first link about the first axis of rotation relative to the support through a first angle of rotation, and wherein a second axis of rotation extends through the second portion, the first and the second axes of rotation approximately parallel with respect to each other; and 
 a second link having a third portion and a fourth portion opposed to the third portion, wherein the third portion is configured to rotatably connect to the second portion and pivot the second link relative to the first link about the second axis of rotation through a second angle of rotation; and 
   a carrier head configured to connect to the fourth portion and to hold and process a substrate.   
     
     
         8 . The system of  claim 7 , wherein the first angle of rotation is at least about  270  degrees in a single direction. 
     
     
         9 . The system of  claim 7 , wherein the carrier head is configured to provide pressure against a substrate to allow the substrate to be processed by a platen. 
     
     
         10 . The system of  claim 7 , wherein the system is configured to move the carrier head linearly toward a center of a platen based at least in part on a synchronized rotation of the first link and the second link. 
     
     
         11 . A chemical mechanical planarization apparatus comprising the system of  claim 7 , further comprising at least one platen configured to process a substrate held by the carrier head. 
     
     
         12 . A chemical mechanical planarization apparatus comprising at least two of the systems of  claim 7 , wherein each system further comprises:
 at least two elongated members and at least two carrier heads; and   at least two platens configured to process at least four substrates handled by each carrier head,   wherein the first angle of rotation is at least about 270 degrees in a single direction.   
     
     
         13 . The apparatus of  claim 11 , further comprising a second platen, wherein the at least one elongated member is configured to move the substrate from a first position allowing a first process to be performed on the substrate on the first platen, to a second position allowing a second process to be performed on the substrate on the second platen. 
     
     
         14 . A chemical mechanical planarization apparatus, comprising:
 at least a first substrate carrier head system and a second substrate carrier head system, each carrier head system comprising:
 a support, wherein an axis of rotation extends through the support; 
 at least one elongated member comprising a first portion and a second portion opposed to the first portion, wherein the first portion is configured to rotatably connect to the support and pivot the elongated member about the axis of rotation relative to the support through an angle of rotation; and 
 a carrier head configured to connect to the second portion and to hold and process a substrate; and 
   at least one platen configured to process a first substrate held by the first carrier head system and a second substrate held by the second carrier head system.   
     
     
         15 . The apparatus of  claim 14 , wherein the angle of rotation is at least about  270  degrees in a single direction. 
     
     
         16 . The apparatus of  claim 15 , wherein the angle of rotation is substantially unrestricted in a single direction. 
     
     
         17 . The apparatus of  claim 14 , further comprising:
 a controller configured to cause the first carrier head system to move a first substrate from a first position for performing a first process on the first substrate on a first platen to a second position for performing a second process on a second substrate on a second platen.   
     
     
         18 . The apparatus of  claim 17 , wherein the first and second processes are different. 
     
     
         19 . The apparatus of  claim 14 , further comprising:
 a controller configured to place the first substrate carrier head system in an offline state while the second substrate carrier head system remains in a processing state.   
     
     
         20 . The apparatus of  claim 19 , wherein the controller is configured to cause the first or second carrier head system to replace a polishing pad of the at least one platen.