Via and trench filling using injection molded soldering

Abstract

An apparatus includes a substrate having one or more vias formed therein. At least one of the vias has at least one liner disposed on at least one sidewall thereof. The apparatus also includes at least one interconnect formed through the at least one via. The one or more interconnects comprise a solder material filled using injection molded soldering.

What is claimed is: 
     
         1 . An apparatus comprising:
 a substrate having one or more vias formed therein, wherein at least one of the vias has at least one liner disposed on at least one sidewall thereof; and   at least one interconnect formed through said at least one via, the interconnect comprising solder material filled using injection molded soldering.   
     
     
         2 . The apparatus of  claim 1 , wherein the substrate comprises a glass substrate and said at least one liner comprises a solder adhesion layer. 
     
     
         3 . The apparatus of  claim 1 , wherein the substrate comprises a silicon substrate and said at least one liner comprises a barrier layer and a solder adhesion layer disposed over the barrier layer. 
     
     
         4 . The apparatus of  claim 3 , wherein the barrier layer comprises at least one of: a nickel layer; a titanium layer; a titanium nitride layer; a tantalum layer; and a tantalum nitride layer. 
     
     
         5 . The apparatus of  claim 4 , wherein the solder adhesion layer comprises at least one of: a copper layer; a nickel layer; a chromium layer; a gold layer; and a titanium layer. 
     
     
         6 . The apparatus of  claim 3 , wherein the barrier layer has a first thickness and the solder adhesion layer has a second thickness, the second thickness being greater than the first thickness. 
     
     
         7 . The apparatus of  claim 1 , wherein said at least one liner comprises a solder adhesion layer. 
     
     
         8 . The apparatus of  claim 7 , wherein the solder adhesion layer has a thickness independent of the size of said at least one via. 
     
     
         9 . The apparatus of  claim 7 , further comprising a metal layer disposed on the solder adhesion layer. 
     
     
         10 . The apparatus of  claim 9 , further comprising an intermetallic compound formed by annealing the solder material and at least a portion of the metal layer. 
     
     
         11 . The apparatus of  claim 10 , wherein the liner and the metal layer have a total thickness in a range of one-half to three-quarters of a diameter of said at least one via. 
     
     
         12 . The apparatus of  claim 11 , wherein said at least one via has a height to width ratio of five to one or greater. 
     
     
         13 . The apparatus of  claim 12 , wherein a first one of the vias in the substrate has a first thickness and a second one of the vias in the substrate has a second thickness different than the first thickness. 
     
     
         14 . The apparatus of  claim 13 , wherein said at least one liner comprises:
 at least a first liner comprising the solder adhesion layer disposed on at least one sidewall of the first via; and   at least a second liner comprising the solder adhesion layer disposed on at least one sidewall of the second via.   
     
     
         15 . The apparatus of  claim 14 , wherein the first liner and the second liner have a same thickness. 
     
     
         16 . The apparatus of  claim 15 , wherein the metal layer comprises a first metal coated with a second metal, the first metal comprising at least one of copper and nickel, the second metal comprising gold. 
     
     
         17 . The apparatus of  claim 16 , wherein the second metal coating the first metal has a thickness of 0.1 to 1 microns. 
     
     
         18 . An integrated circuit comprising:
 a glass interposer having one or more vias formed therein, wherein at least one of the vias has a solder adhesion layer formed on at least one sidewall thereof; and   at least one interconnect formed through said at least one via, the interconnect comprising solder material filled using injection molded soldering.   
     
     
         19 . The integrated circuit of  claim 18 , wherein the substrate comprises a glass substrate and said at least one liner comprises a solder adhesion layer. 
     
     
         20 . The integrated circuit of  claim 18 , wherein the substrate comprises a silicon substrate and said at least one liner comprises a barrier layer and a solder adhesion layer disposed over the barrier layer.