US2019035796A1PendingUtilityA1
Metal layers for a three-port bit cell
Est. expiryFeb 12, 2035(~8.6 yrs left)· nominal 20-yr term from priority
Inventors:Niladri Narayan MojumderRitu ChabaPing-Lin LiuStanley Seungchul SongZhongze WangChoh Fei Yeap
H10P 50/00H10W 20/069H10W 20/43H10W 20/42H01L 21/76897H01L 27/11G11C 8/14H01L 27/1104H01L 23/528H01L 21/3213G11C 11/418G11C 8/16G11C 11/419H01L 23/5226H01L 27/0207H10D 89/10H10B 10/12H10B 10/00
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Claims
Abstract
An apparatus includes first means for routing current coupled to a bit cell. The apparatus includes third means for routing current. The third means for routing current includes a write word line coupled to the bit cell. The apparatus includes second means for routing current. The second means for routing current is between the first means for routing current and the third means for routing current. The second means for routing current includes two read word lines coupled to the bit cell.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An apparatus comprising:
first means for routing current coupled to a bit cell; third means for routing current, the third means for routing current including a write word line coupled to the bit cell; and second means for routing current, the second means for routing current between the first means for routing current and the third means for routing current, the second means for routing current including two read word lines coupled to the bit cell.
2 . The apparatus of claim 1 , wherein the bit cell is a three-port bit cell.
3 . The apparatus of claim 2 , wherein the three-port bit cell includes a first read port, a second read port, and a write port.
4 . The apparatus of claim 1 , wherein the first means for routing current, the second means for routing current, and the third means for routing current are patterned using a self-aligned double patterning (SADP) process.
5 . The apparatus of claim 1 , wherein the bit cell is manufactured using a semiconductor manufacturing process, and wherein the semiconductor manufacturing process is a sub-14 nanometer (nm) process.
6 . The apparatus of claim 5 , wherein the semiconductor manufacturing process comprises a 10 nm process.
7 . The apparatus of claim 5 , wherein the semiconductor manufacturing process comprises a 7 nm process.
8 . The apparatus of claim 1 , wherein the bit cell is included in a static random access memory (SRAM) device.
9 . The apparatus of claim 1 , further comprising first means for connecting the first means for routing current to the second means for routing current.
10 . The apparatus of claim 9 , further comprising second means for connecting the second means for routing current to the third means for routing current.
11 . The apparatus of claim 1 , wherein the second means for routing current does not include jogs.
12 . The apparatus of claim 1 , wherein a first read word line of the second means for routing current is coupled to a first read transistor of the bit cell, and wherein a second read word line of the second means for routing current is coupled to a second read transistor of the bit cell.
13 . The apparatus of claim 1 , wherein the write word line of the third means for routing current is coupled to a first write transistor of the bit cell and to a second write transistor of the bit cell.
14 . An apparatus comprising:
first means for routing current coupled to a bit cell; third means for routing current, the third means for routing current including a write word line coupled to the bit cell; second means for routing current, the second means for routing current between the first means for routing current and the third means for routing current, the second means for routing current including two read word lines coupled to the bit cell; first means for connecting the first means for routing current to the second means for routing current; and second means for connecting the second means for routing current to the third means for routing current.
15 . The apparatus of claim 14 , wherein the bit cell is a three-port bit cell.
16 . The apparatus of claim 15 , wherein the three-port bit cell includes a first read port, a second read port, and a write port.
17 . The apparatus of claim 14 , wherein the first means for routing current, the second means for routing current, and the third means for routing current are patterned using a self-aligned double patterning (SADP) process.
18 . The apparatus of claim 14 , wherein the bit cell is manufactured using a semiconductor manufacturing process, and wherein the semiconductor manufacturing process is a sub-14 nanometer (nm) process.
19 . The apparatus of claim 18 , wherein the semiconductor manufacturing process comprises a 7 nm process or a 10 nm process.
20 . The apparatus of claim 14 , wherein the bit cell is included in a static random access memory (SRAM) device.Cited by (0)
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