Printed chemical mechanical polishing pad

Abstract

A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material.

What is claimed is: 
     
         1 . A method of fabricating a polishing pad comprising:
 successively forming a plurality of polishing pad layers using a print head of an additive manufacturing system, wherein forming a polishing pad layer comprises:
 ejecting droplets comprising a base material from one of one or more nozzles of the print head; 
 ejecting droplets comprising an additive material from one of the one or more nozzles of the print head, wherein the droplets comprising the additive material are ejected from the print head independently of the droplets comprising the base material; and 
 polymerizing the ejected droplets of the base material and the additive material to form the polishing pad layer comprising a polymer matrix of the base material crosslinked with the additive material. 
   
     
     
         2 . The method of  claim 1 , wherein the additive material modifies a porosity of the polishing pad. 
     
     
         3 . The method of  claim 2 , wherein the additive material comprises a UV curable polyurethane-acrylate. 
     
     
         4 . The method of  claim 3 , wherein the UV curable polyurethane-acrylate comprises hollow nanoparticles. 
     
     
         5 . The method of  claim 1 , wherein the additive material comprises piezoelectric material. 
     
     
         6 . The method of  claim 1 , further comprising:
 successively depositing a plurality of layers on the plurality of polishing layers to integrally form a backing layer therewith.   
     
     
         7 . The method of  claim 6 , wherein forming the backing layer comprises:
 ejecting droplets comprising a composition of material different than the composition of the base material from one of the one or more nozzles of the print head.   
     
     
         8 . The method of  claim 1 , wherein the polishing pad layer has a Shore D hardness of about 30 Shore D to about 90 Shore D. 
     
     
         9 . The method of  claim 8 , wherein the polishing pad layer has a Shore D hardness of about 50 Shore D to about 65 Shore D. 
     
     
         10 . The method of  claim 1 , wherein the polishing pad layer has a Shore A hardness between about 26 Shore A to about 95 Shore A. 
     
     
         11 . The method of  claim 1 , wherein the droplets of the additive material are ejected using one or more nozzles which are different from the one or more nozzles used to eject the droplets of the base material. 
     
     
         12 . The method of  claim 1 , wherein a deposition rate for the additive material is independent from a deposition rate for the base material. 
     
     
         13 . The method of  claim 1 , wherein ejecting droplets of the additive material from one of the one or more nozzles controls a local concentration of the additive material disposed in or crosslinked with the polymerized base material. 
     
     
         14 . The method of  claim 1 , wherein the additive material modifies at least one property of the polishing pad layer selected from the group consisting of porosity, stiffness, surface energy, abrasiveness, conductivity, and chemical functionality. 
     
     
         15 . A polishing pad, comprising:
 a polishing layer comprising:   a plurality of printer deposited layers, wherein a first layer of the plurality of layers comprises:
 a polymerized base material forming a polymer matrix; and 
 an additive material crosslinked with the base material in the polymer matrix. 
   
     
     
         16 . The polishing pad of  claim 15 , wherein the additive material modifies a thermal conductivity of the polishing layer. 
     
     
         17 . The polishing pad of  claim 15 , wherein the additive material modifies a porosity of the polishing layer. 
     
     
         18 . The polishing pad of  claim 15 , wherein the additive material comprises a UV curable polyurethane-acrylate. 
     
     
         19 . The polishing pad of  claim 18 , wherein the UV curable polyurethane comprises hollow nanoparticles. 
     
     
         20 . The polishing pad of  claim 15 , further comprising:
 a backing layer integrally formed with the polishing layer, wherein the backing layer is formed from a different material than the base material of the polishing layer.