US2020098856A1PendingUtilityA1

Power Semiconductor Devices, Methods, and Structures with Embedded Dielectric Layers Containing Permanent Charges

Assignee: MAXPOWER SEMICONDUCTOR INCPriority: Apr 13, 2009Filed: Jun 12, 2019Published: Mar 26, 2020
Est. expiryApr 13, 2029(~2.7 yrs left)· nominal 20-yr term from priority
H10P 30/222H01L 29/408H01L 29/7813H01L 29/8611H01L 29/407H01L 29/66348H01L 29/063H01L 21/26586H01L 29/66734H01L 29/7811H01L 29/7827H01L 29/0611H01L 29/4236H01L 29/7802H10D 64/111H10D 62/393H10D 62/158H10D 62/156H10D 62/111H10D 62/104H10D 64/513H10D 64/118H10D 64/117H10D 62/109H10D 30/668H10D 30/665H10D 30/0297H10D 30/66H10D 30/63H10D 12/038H10D 8/411H10D 62/103
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Claims

Abstract

Power devices using refilled trenches with permanent charge at or near their sidewalls. These trenches extend vertically into a drift region.

Claims

exact text as granted — not AI-modified
1 - 59 . (canceled) 
     
     
         60 . A method for operating a power device which switches between an ON state and an OFF state, comprising:
 controlling ON-state current by use of a current-controlling structure at a first surface of a semiconductor mass; said ON-state current flowing through a drift region, to provide a controllable electrical connection between a first source/drain region, at said first surface, and a second source/drain region which is not otherwise connected to said first source/drain region; and   blocking current, in the OFF state, using said drift region in conjunction said current-controlling structure;   wherein bottomless trenches extend into said drift region, and at least some ones of said trenches are at least partially filled with a trench filling material which is not an insulator, and which is electrically connected to said second source/drain region;   wherein said current-controlling structure comprises a source, a body, and a gate which is capacitively coupled to control inversion of a nearby portion of said body.   
     
     
         61 . (canceled) 
     
     
         62 . The method of  claim 60 , wherein said bottomless trenches have immobile electrostatic charge in proximity to sidewalls thereof. 
     
     
         63 . The method of  claim 60 , wherein said trench filling material is silicon. 
     
     
         64 . The method of  claim 60 , wherein said trench filling material is a substantially crystalline semiconductor material. 
     
     
         65 . The method of  claim 60 , wherein said trench filling material is substantially the same semiconductor material as parts of said drift region outside said trenches. 
     
     
         66 . The method of  claim 60 , wherein said semiconductor mass is monocrystalline silicon. 
     
     
         67 . A method for operating a power device, comprising:
 controlling turn-on and turn-off using an array of semiconductor devices; wherein said devices include trenches which have a first minimum width, and which have been angle-implanted with ions which provide immobile electrostatic charge; and   providing a graded transition of voltage outside said array, using peripheral trenches which have graduated minimum widths, including widths which are less than said first minimum width; wherein narrower ones of said peripheral trenches have a lower density of said ions in bottom portions thereof, as compared with upper portions thereof, than do wider ones of said trenches.   
     
     
         68 . The method of  claim 67 , wherein said devices are trench transistors. 
     
     
         69 . The method of  claim 67 , wherein said trenches are bottomless. 
     
     
         70 - 97 . (canceled)

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