Heat medium circulation system and substrate processing apparatus

Abstract

A heat medium circulation system including: a resin pipe forming at least a portion of a circulation flow path for circulating a heat medium to a temperature control target; a cover surrounding an outer peripheral surface of the resin pipe; and an exhaust pipe connected to a space between the resin pipe and the cover so as to exhaust the heat medium permeating through the resin pipe and released to the space, wherein the cover includes an air supply port configured to introduce air into the space between the resin pipe and the cover while the heat medium is exhausted from the exhaust pipe.

What is claimed is: 
     
         1 . A heat medium circulation system comprising:
 a resin pipe forming at least a portion of a circulation flow path for circulating a heat medium to a temperature control target;   a cover surrounding an outer peripheral surface of the resin pipe; and   an exhaust pipe connected to a space between the resin pipe and the cover so as to exhaust the heat medium permeating through the resin pipe and released to the space,   wherein the cover includes an air supply port configured to introduce air into the space between the resin pipe and the cover while the heat medium is exhausted from the exhaust pipe.   
     
     
         2 . The heat medium circulation system of  claim 1 , wherein the cover is a tubular member formed of a resin. 
     
     
         3 . The heat medium circulation system of  claim 2 , wherein the exhaust pipe is connected to a closing member provided at one end of the cover to close the space between the resin pipe and the cover, and communicates with the space through a buffer space formed in the closing member, and
 the cover includes the air supply port at the other end, which is located opposite the one end at which the closing member is provided.   
     
     
         4 . The heat medium circulation system of  claim 3 , wherein the air supply port is an open end portion formed by opening the other end of the cover. 
     
     
         5 . The heat medium circulation system of  claim 4 , further comprising a housing covering the temperature control target,
 wherein the resin pipe and the cover are disposed in a space surrounded by the housing and the temperature control target, and   a pressure in the space surrounded by the housing and the temperature control target is maintained at a positive pressure.   
     
     
         6 . The heat medium circulation system of  claim 5 , wherein the resin pipe is connected to a flow path formed inside the temperature control target so as to circulate the heat medium in the flow path. 
     
     
         7 . The heat medium circulation system of  claim 6 , wherein the heat medium is a liquid containing carbon. 
     
     
         8 . The heat medium circulation system of  claim 1 , further comprising a housing covering the temperature control target,
 wherein the resin pipe and the cover are disposed in a space surrounded by the housing and the temperature control target, and   a pressure in the space surrounded by the housing and the temperature control target is maintained at a positive pressure.   
     
     
         9 . The heat medium circulation system of  claim 1 , wherein the cover is a housing covering the temperature control target. 
     
     
         10 . The heat medium circulation system of  claim 1 , wherein the resin pipe is connected to a flow path formed inside the temperature control target so as to circulate the heat medium in the flow path. 
     
     
         11 . The heat medium circulation system of  claim 1 , wherein the heat medium is a liquid containing carbon. 
     
     
         12 . A substrate processing apparatus comprising a heat medium circulation system,
 wherein the heat medium circulation system comprises:   a resin pipe forming at least a portion of a circulation flow path for circulating a heat medium to a temperature control target;   a cover surrounding an outer peripheral surface of the resin pipe; and   an exhaust pipe connected to a space between the resin pipe and the cover and configured to exhaust the heat medium permeating through the resin pipe and released to the space, and   wherein the cover includes an air supply port configured to introduce air into the space between the resin pipe and the cover while the heat medium is exhausted from the exhaust pipe.