Inventor · disambiguated record
Takashi Kitazawa
Also filed as: KITAZAWA TAKASHI
19 granted patents·6 pending applications·658 citations·filing 1998–2023
94Inventor score
Top patents by PatentIndex Score
25 records- 0197USD494552SExhaust ring for manufacturing semiconductorsTOKYO ELECTRON LTD·Filed 2003·Granted Aug 17, 2004·432 cites·1 claims
- 0295US7353841B2Relative pressure control system and relative flow control systemCKD CORP·Filed 2005·Granted Apr 8, 2008·101 cites·14 claims
- 0392US8858754B2Plasma processing apparatusHORIGUCHI MASATO·Filed 2011·Granted Oct 14, 2014·30 cites·2 claims
- 0489US7472581B2Vacuum apparatusTOKYO ELECTRON LTD·Filed 2006·Granted Jan 6, 2009·18 cites·11 claims
- 0584US7201851B2Vacuum processing apparatus and substrate transfer methodTOSHIBA KK·Filed 2005·Granted Apr 10, 2007·11 cites·5 claims
- 0674US6896764B2Vacuum processing apparatus and control method thereofTOKYO ELECTRON LTD·Filed 2002·Granted May 24, 2005·14 cites·11 claims
- 0769US10249478B2Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2014·Granted Apr 2, 2019·2 cites·6 claims
- 0867US8829685B2Circuit device having funnel shaped lead and method for manufacturing the sameFUKUSHIMA TETSUYA·Filed 2009·Granted Sep 9, 2014·5 cites·19 claims
- 0964US8692370B2Semiconductor device with copper wire ball-bonded to electrode pad including buffer layerKITAZAWA TAKASHI·Filed 2010·Granted Apr 8, 2014·4 cites·4 claims
- 1062US6990747B2Vacuum processing apparatus and substrate transfer methodTOSHIBA KK·Filed 2004·Granted Jan 31, 2006·8 cites·8 claims
- 1159US7589488B2Motor control apparatusYASKAWA DENKI SEISAKUSHO KK·Filed 2005·Granted Sep 15, 2009·5 cites·17 claims
- 1258US2023298864A1Upper electrode and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1356US10676823B2Processing method and processing apparatusTOKYO ELECTRON LTD·Filed 2017·Granted Jun 9, 2020·0 cites·16 claims
- 1454US6252369B1Motor speed controller and gain setting method of the controllerYASKAWA DENKI SEISAKUSHO KK·Filed 1998·Granted Jun 26, 2001·21 cites·2 claims
- 1553US8609467B2Lead frame and method for manufacturing circuit device using the sameFUKUSHIMA TETSUYA·Filed 2009·Granted Dec 17, 2013·1 cites·4 claims
- 1652US10553408B2Supporting member and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2014·Granted Feb 4, 2020·0 cites·5 claims
- 1751US2023317422A1Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1848US2005167398A1Vacuum processing apparatus and control method thereforTOKYO ELECTRON LTD·Filed 2005·Application pending·0 cites
- 1948US2005167049A1Vacuum processing apparatus and control method thereforTOKYO ELECTRON LTD·Filed 2005·Application pending·0 cites
- 2047US7023153B2Motor control deviceYASKAWA DENKI SEISAKUSHO KK·Filed 2003·Granted Apr 4, 2006·5 cites·2 claims
- 2141US7332803B2Circuit deviceSANYO ELECTRIC CO·Filed 2004·Granted Feb 19, 2008·1 cites·17 claims
- 2240US2021074519A1Heat medium circulation system and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2020·Application pending·0 cites
- 2338US2004129218A1Exhaust ring mechanism and plasma processing apparatus using the sameFiled 2003·Application pending·0 cites
- 2437US8687343B2Substrate mounting table of substrate processing apparatusSATO TETSUJI·Filed 2010·Granted Apr 1, 2014·0 cites·7 claims
- 2535US8426318B2Method of setting thickness of dielectric and substrate processing apparatus having dielectric disposed in electrodeOYABU JUN·Filed 2011·Granted Apr 23, 2013·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →