US2022216035A1PendingUtilityA1

Vacuum processing apparatus and maintenance apparatus

Assignee: TOKYO ELECTRON LTDPriority: Feb 16, 2017Filed: Mar 24, 2022Published: Jul 7, 2022
Est. expiryFeb 16, 2037(~10.6 yrs left)· nominal 20-yr term from priority
H10P 72/0462H01J 37/3288H01J 37/32642H01J 37/32807H01J 2237/334H01J 37/32889H10P 72/0406H10P 72/0421
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Claims

Abstract

A maintenance apparatus includes a case and a maintenance mechanism. The case includes an opening having a size corresponding to a second gate of a vacuum processing apparatus including a processing chamber having a first gate through which a substrate is loaded and unloaded and the second gate different from the first gate. The case is attachable to the second gate while maintaining airtightness. The maintenance mechanism is provided in the case and is configured to perform at least one of an operation of detaching a consumed part in the processing chamber through the opening, an operation of attaching a replacement part in the processing chamber and an operation of cleaning the processing chamber.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A maintenance apparatus, comprising,
 a case detachably connectable to a plasma processing apparatus; and   a maintenance mechanism configured to selectively perform one of maintenance operations when the case is connected to the plasma processing apparatus, the maintenance mechanism including:
 a robot arm; and 
 a plurality of maintenance units designed to perform the respective maintenance operations, one of the plurality of maintenance units being selectively held by the robot arm to perform the corresponding maintenance operation, the plurality of maintenance units including a cleaning unit designed to clean an inside of a chamber of the plasma processing apparatus. 
   
     
     
         2 . The maintenance apparatus of  claim 1 , wherein the plurality of maintenance units further includes one or more replacement units designed to replace a used consumable part with a new consumable part in the chamber. 
     
     
         3 . The maintenance apparatus of  claim 2 , wherein the one or more replacement units includes a detaching unit designed to detach the used consumable part in the chamber, and an attaching unit designed to attach the new consumable part in the chamber. 
     
     
         4 . The maintenance apparatus of  claim 1 , wherein the plurality of maintenance units further includes one or more replacement units designed to replace a used focus ring with a new focus ring in the chamber. 
     
     
         5 . The maintenance apparatus of  claim 4 , wherein the one or more replacement units includes a detaching unit designed to detach the used focus ring from a wafer stage in the chamber, and an attaching unit designed to attach the new consumable part to the wafer stage in the chamber. 
     
     
         6 . The maintenance apparatus of  claim 5 , wherein the detaching unit has an adhesive layer designed to contact with the used focus ring on the wafer stage. 
     
     
         7 . The maintenance apparatus of  claim 1 , wherein the cleaning unit is designed to clean a wafer stage in the chamber. 
     
     
         8 . The maintenance apparatus of  claim 7 , wherein the cleaning unit has an adhesive layer designed to contact with a surface of the wafer stage. 
     
     
         9 . The maintenance apparatus of  claim 1 , further comprising an elevation table, wherein the robot arm is fixed to the elevation table. 
     
     
         10 . The maintenance apparatus of  claim 1 , wherein the case is detachably connectable to the plasma processing apparatus at an opposite side of a first gate between the chamber and a wafer transfer system. 
     
     
         11 . The maintenance apparatus of  claim 10 , wherein the maintenance mechanism is configured to selectively perform one of the maintenance operations through a second gate disposed at an opposite side of the first gate. 
     
     
         12 . The maintenance apparatus of  claim 11 , wherein a size of the second gate is greater than a size of the first gate. 
     
     
         13 . The maintenance apparatus of  claim 11 , wherein one of the maintenance operations is selectively performed without exposing the chamber to an atmosphere. 
     
     
         14 . The maintenance apparatus of  claim 13 , wherein the case is connectable to the plasma processing apparatus while maintaining airtightness. 
     
     
         15 . The maintenance apparatus of  claim 14 , wherein the case is connectable to a vacuum pump of the plasma processing apparatus. 
     
     
         16 . The maintenance apparatus of  claim 14 , further comprising a vacuum pump connected to the case. 
     
     
         17 . The maintenance apparatus of  claim 1 , further comprising a plurality of supporting tables configured to store the plurality of maintenance units in the case.

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