Inventor · disambiguated record
Takehiro Ueda
Also filed as: UEDA TAKEHIRO
59 granted patents·19 pending applications·869 citations·filing 1999–2025
98Inventor score
Files withTOKYO ELECTRON LTD30RENESAS ELECTRONICS CORP21NEC ELECTRONICS CORP14UEDA TAKEHIRO6KIKUCHI AKIHIRO2
Top patents by PatentIndex Score
78 records- 0198USD553104SAbsorption board for an electric chuck used in semiconductor manufactureTOKYO ELECTRON LTD·Filed 2004·Granted Oct 16, 2007·598 cites·1 claims
- 0294US8387562B2Plasma processor and plasma processing methodKIKUCHI AKIHIRO·Filed 2011·Granted Mar 5, 2013·22 cites·12 claims
- 0393US9437402B2Plasma processor and plasma processing methodTOKYO ELECTRON LTD·Filed 2014·Granted Sep 6, 2016·11 cites·9 claims
- 0493US8056503B2Plasma procesor and plasma processing methodKIKUCHI AKIHIRO·Filed 2002·Granted Nov 15, 2011·47 cites·31 claims
- 0592US8904957B2Plasma processor and plasma processing methodTOKYO ELECTRON LTD·Filed 2013·Granted Dec 9, 2014·12 cites·2 claims
- 0690US7646581B2Electrostatic chuckSUMITOMO OSAKA CEMENT CO LTD·Filed 2007·Granted Jan 12, 2010·16 cites·11 claims
- 0789US7635907B2Semiconductor device with electric fuse having a flowing-out regionNEC ELECTRONICS CORP·Filed 2007·Granted Dec 22, 2009·14 cites·14 claims
- 0888US11756808B2Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Sep 12, 2023·1 cites·14 claims
- 0988US8476701B2Semiconductor device with gate electrode including a concave portionUEDA TAKEHIRO·Filed 2011·Granted Jul 2, 2013·9 cites·28 claims
- 1088US7282751B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2004·Granted Oct 16, 2007·33 cites·6 claims
- 1185US9728381B2Plasma processor and plasma processing methodTOKYO ELECTRON LTD·Filed 2014·Granted Aug 8, 2017·4 cites·3 claims
- 1285US7529147B2Semiconductor device and method of fabricating the sameNEC ELECTRONICS CORP·Filed 2006·Granted May 5, 2009·11 cites·12 claims
- 1382US11121010B2Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2019·Granted Sep 14, 2021·2 cites·6 claims
- 1482US8491752B2Substrate mounting table and method for manufacturing same, substrate processing apparatus, and fluid supply mechanismUEDA TAKEHIRO·Filed 2007·Granted Jul 23, 2013·7 cites·17 claims
- 1582US7728407B2Semiconductor device and method of cutting electrical fuseNEC ELECTRONICS CORP·Filed 2007·Granted Jun 1, 2010·7 cites·19 claims
- 1682US7411851B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Granted Aug 12, 2008·13 cites·7 claims
- 1781US11175321B1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2020·Granted Nov 16, 2021·1 cites·10 claims
- 1880US11309168B2Vacuum processing apparatus and maintenance apparatusTOKYO ELECTRON LTD·Filed 2018·Granted Apr 19, 2022·2 cites·21 claims
- 1980US8362524B2Semiconductor device having a fuse elementRENESAS ELECTRONICS CORP·Filed 2011·Granted Jan 29, 2013·3 cites·16 claims
- 2079US7489230B2Semiconductor device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2006·Granted Feb 10, 2009·8 cites·20 claims
- 2177US8573836B2Apparatus and method for evaluating a substrate mounting deviceSASAKI YASUHARU·Filed 2007·Granted Nov 5, 2013·6 cites·8 claims
- 2277US7989913B2Semiconductor device and method for cutting electric fuseRENESAS ELECTRONICS CORP·Filed 2007·Granted Aug 2, 2011·6 cites·17 claims
- 2376US7376036B2Semiconductor device including fuse and method for testing the same capable of suppressing erroneous determinationNEC ELECTRONICS CORP·Filed 2006·Granted May 20, 2008·8 cites·17 claims
- 2474US7679871B2Semiconductor device and method for determining fuse stateNEC ELECTRONICS CORP·Filed 2007·Granted Mar 16, 2010·6 cites·10 claims
- 2573US7835211B2Semiconductor device and method of fabricating the sameNEC ELECTRONICS CORP·Filed 2009·Granted Nov 16, 2010·4 cites·6 claims
- 2671US10396153B2Semiconductor device and method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Aug 27, 2019·1 cites·19 claims
- 2771US2025227984A1Semiconductor device having integrated turn-on and turn-off resistors and diodeRENESAS ELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 2870US7619264B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Granted Nov 17, 2009·4 cites·19 claims
- 2970US2023197501A1Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 3068US9177912B2Semiconductor device having a fuse elementRENESAS ELECTRONICS CORP·Filed 2013·Granted Nov 3, 2015·1 cites·12 claims
- 3166US12334410B2Semiconductor device with protective film for reducing aluminum slide in aluminum wiring and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2022·Granted Jun 17, 2025·0 cites·9 claims
- 3266US2022216035A1Vacuum processing apparatus and maintenance apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 3365US12289918B2Semiconductor device having integrated turn-on and turn-off resistors and diodeRENESAS ELECTRONICS CORP·Filed 2021·Granted Apr 29, 2025·0 cites·6 claims
- 3465US9000559B2Semiconductor device, method of cutting electrical fuse, and method of determining electrical fuse stateUEDA TAKEHIRO·Filed 2007·Granted Apr 7, 2015·3 cites·26 claims
- 3563US2025155483A1Semiconductor measurement device and semiconductor measurement methodRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 3662US2023002963A1Moisture-permeable waterproof fabricTORAY COATEX CO LTD·Filed 2020·Application pending·0 cites
- 3761US11929240B2Substrate support, substrate processing apparatus, and substrate processing methodTOKYO ELECTRON LTD·Filed 2021·Granted Mar 12, 2024·0 cites·7 claims
- 3860US8236622B2Method for cutting electric fuseUEDA TAKEHIRO·Filed 2009·Granted Aug 7, 2012·1 cites·2 claims
- 3959US11923228B2Stage and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Mar 5, 2024·0 cites·19 claims
- 4056US9620449B2Semiconductor device having a fuse elementRENESAS ELECTRONICS CORP·Filed 2015·Granted Apr 11, 2017·0 cites·14 claims
- 4156US8610178B2Semiconductor device having a fuse elementRENESAS ELECTRONICS CORP·Filed 2012·Granted Dec 17, 2013·0 cites·24 claims
- 4256US2008145556A1Method for manufacturing substrate mounting tableTOKYO ELECTRON LTD·Filed 2007·Application pending·0 cites
- 4355US8742465B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2012·Granted Jun 3, 2014·0 cites·7 claims
- 4455US7795699B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2004·Granted Sep 14, 2010·5 cites·36 claims
- 4554US11887935B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2021·Granted Jan 30, 2024·0 cites·12 claims
- 4654US11582854B2Mounting table and charge neutralization method for target objectTOKYO ELECTRON LTD·Filed 2019·Granted Feb 14, 2023·0 cites·6 claims
- 4754US11443925B2Substrate support and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Sep 13, 2022·0 cites·12 claims
- 4854US11387334B2Semiconductor device with electrode plating depositionRENESAS ELECTRONICS CORP·Filed 2020·Granted Jul 12, 2022·0 cites·14 claims
- 4953US8869376B2Substrate mounting table and method for manufacturing same, substrate processing apparatus, and fluid supply mechanismTOKYO ELECTRON LTD·Filed 2013·Granted Oct 28, 2014·0 cites·8 claims
- 5053US7994544B2Semiconductor device having a fuse elementRENESAS ELECTRONICS CORP·Filed 2007·Granted Aug 9, 2011·0 cites·10 claims
Showing the top 50 of 78 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →