Vapor chamber with spoiler structure

Abstract

A vapor chamber includes an upper plate and a lower plate covering each other to form a hollow internal space, an evaporation portion and a condensation portion jointly formed by the upper plate and the lower plate, and a transmission portion communicating with the evaporation portion and the condensation portion. The transmission portion comprises multiple spoiler rods disposed therein to support between the lower plate and the upper plate. The spoiler rods at least include multiple first rods adjacent to an end of the evaporation portion and multiple second rods adjacent to an end of the condensation portion. A distance between any two of the first rods is less than a distance between any two of the second rods.

What is claimed is: 
     
         1 . A vapor chamber with a spoiler structure, the vapor chamber comprising:
 an upper plate and a lower plate, covering each other to configure a hollow internal space;   an evaporation portion and a condensation portion, jointly configured by the upper plate and the lower plate; and   a transmission portion, communicating with the evaporation portion and the condensation portion;   wherein the transmission portion comprises multiple spoiler rods disposed therein to support between the lower plate and the upper plate, the spoiler rods at least comprise multiple first rods adjacent to an end of the evaporation portion and multiple second rods adjacent to an end of the condensation portion, and a distance between any two of the first rods is less than a distance between any two of the second rods.   
     
     
         2 . The vapor chamber of  claim 1 , wherein a capillary layer is laid inside the lower plate. 
     
     
         3 . The vapor chamber of  claim 2 , wherein the capillary layer comprises a woven mesh, a sintered metal powder or multiple grooves disposed in the lower plate. 
     
     
         4 . The vapor chamber of  claim 1 , wherein the lower plate comprises a lower evaporation portion corresponding to the evaporation portion and a lower condensation portion corresponding to the condensation portion, and the upper plate comprises an upper evaporation portion corresponding to the evaporation portion and an upper condensation portion corresponding to the condensation portion. 
     
     
         5 . The vapor chamber of  claim 4 , wherein an area of the evaporation portion is greater than an area of the condensation portion. 
     
     
         6 . The vapor chamber of  claim 1 , wherein the lower plate comprises a lower transmission portion corresponding to the transmission portion, the upper plate comprises an upper transmission portion corresponding to the transmission portion, and the transmission portion is tapered from the evaporation portion to the condensation portion. 
     
     
         7 . The vapor chamber of  claim 1 , wherein multiple third rods are disposed in the transmission portion and between the first rods and the second rods. 
     
     
         8 . The vapor chamber of  claim 7 , wherein the third rods are arranged between the first rods and the second rods to be regularly distributed in the transmission portion. 
     
     
         9 . The vapor chamber of  claim 1 , wherein the condensation portion is multiple in number. 
     
     
         10 . The vapor chamber of  claim 9 , wherein the condensation portions jointly communicate with the evaporation portion by the transmission portion respectively.