Assignee
TAIWAN MICROLOOPS CORP
TW·23 granted patents·44 pending applications·65 citations·filing 2005–2025
Top patents by PatentIndex Score
67 records- 0198US10048015B1Liquid-vapor separating type heat conductive structureTAIWAN MICROLOOPS CORP·Filed 2017·Granted Aug 14, 2018·15 cites·7 claims
- 0297US11304331B1Heat dissipating module having auxiliary fanTAIWAN MICROLOOPS CORP·Filed 2020·Granted Apr 12, 2022·6 cites·6 claims
- 0397US11060799B1Vapor chamber structureTAIWAN MICROLOOPS CORP·Filed 2020·Granted Jul 13, 2021·5 cites·6 claims
- 0496US12535278B2Heat dissipation device of heat pipe combined with vapor chamberTAIWAN MICROLOOPS CORP·Filed 2024·Granted Jan 27, 2026·2 cites·10 claims
- 0593US12374316B2Separate active noise cancellation deviceTAIWAN MICROLOOPS CORP·Filed 2023·Granted Jul 29, 2025·2 cites·8 claims
- 0693US10018427B2Vapor chamber structureTAIWAN MICROLOOPS CORP·Filed 2016·Granted Jul 10, 2018·9 cites·10 claims
- 0791US10012445B2Vapor chamber and heat pipe combined structureTAIWAN MICROLOOPS CORP·Filed 2016·Granted Jul 3, 2018·8 cites·7 claims
- 0888US10483190B2Thermal conduction structrure and manufacturing method thereofTAIWAN MICROLOOPS CORP·Filed 2017·Granted Nov 19, 2019·6 cites·7 claims
- 0982US9841246B2Dual material vapor chamber and upper shell thereofTAIWAN MICROLOOPS CORP·Filed 2016·Granted Dec 12, 2017·2 cites·2 claims
- 1079US10927842B2Cooling fan moduleTAIWAN MICROLOOPS CORP·Filed 2018·Granted Feb 23, 2021·4 cites·6 claims
- 1176US11044833B2Water-cooled pressurized distributive heat dissipation system for rackTAIWAN MICROLOOPS CORP·Filed 2019·Granted Jun 22, 2021·2 cites·10 claims
- 1276US10288356B2Vapor chamber and heat pipe combined structure and combining method thereofTAIWAN MICROLOOPS CORP·Filed 2016·Granted May 14, 2019·2 cites·9 claims
- 1375US10999952B1Vapor chamber and manufacturing method thereofTAIWAN MICROLOOPS CORP·Filed 2020·Granted May 4, 2021·1 cites·3 claims
- 1474US12276461B2Vapor chamber and single-piece support structure thereofTAIWAN MICROLOOPS CORP·Filed 2023·Granted Apr 15, 2025·0 cites·10 claims
- 1573US12436723B2Display card with noise reduction mechanismTAIWAN MICROLOOPS CORP·Filed 2023·Granted Oct 7, 2025·0 cites·11 claims
- 1669US12173969B2Separate capillary vapor chamber structure for dual heat sourcesTAIWAN MICROLOOPS CORP·Filed 2023·Granted Dec 24, 2024·0 cites·10 claims
- 1767US11044832B2Water-cooled distributive heat dissipation system for rackTAIWAN MICROLOOPS CORP·Filed 2019·Granted Jun 22, 2021·1 cites·5 claims
- 1867US2026055969A1Three-dimensional vapor chamber bonding structureTAIWAN MICROLOOPS CORP·Filed 2024·Application pending·0 cites
- 1966US2025290702A1Vapor chamber with sandwiched upper wickTAIWAN MICROLOOPS CORP·Filed 2024·Application pending·0 cites
- 2066US2025290703A1Heat dissipation structure combining vapor chamber with heat pipe and manufacturing method thereofTAIWAN MICROLOOPS CORP·Filed 2024·Application pending·0 cites
- 2166US2025297810A1Vapor chamber structure with partially increased plate thicknessTAIWAN MICROLOOPS CORP·Filed 2024·Application pending·0 cites
- 2265US12114464B2Liquid immersion coolerTAIWAN MICROLOOPS CORP·Filed 2022·Granted Oct 8, 2024·0 cites·8 claims
- 2364US12490409B2Vapor chamber and manufacturing method thereofTAIWAN MICROLOOPS CORP·Filed 2022·Granted Dec 2, 2025·0 cites·2 claims
- 2464US2026049771A1Three-dimensional vapor chamber assembly structureTAIWAN MICROLOOPS CORP·Filed 2024·Application pending·0 cites
- 2563US12010814B2Liquid immersion cooling sheet with improved surface structureTAIWAN MICROLOOPS CORP·Filed 2022·Granted Jun 11, 2024·0 cites·3 claims
- 2663US11892240B2Combination structure of vapor chamber and heat pipeTAIWAN MICROLOOPS CORP·Filed 2022·Granted Feb 6, 2024·0 cites·8 claims
- 2763US2025334346A1Three-dimensional vapor chamber cooling deviceTAIWAN MICROLOOPS CORP·Filed 2024·Application pending·0 cites
- 2862US11125507B2Heat dissipating apparatus using phase change heat transferTAIWAN MICROLOOPS CORP·Filed 2019·Granted Sep 21, 2021·0 cites·9 claims
- 2962US2024216833A1Vapor chamber degassing tube structure and manufacturing method thereofTAIWAN MICROLOOPS CORP·Filed 2023·Application pending·0 cites
- 3059US2023356113A1Vapor chamber with improved fixing structure for degassing tubeTAIWAN MICROLOOPS CORP·Filed 2022·Application pending·0 cites
- 3158US2024060724A1Vapor chamber and supporting column securement structure thereofTAIWAN MICROLOOPS CORP·Filed 2023·Application pending·0 cites
- 3256US2024329704A1Heat dissipation device having noise cancelling moduleTAIWAN MICROLOOPS CORP·Filed 2023·Application pending·0 cites
- 3356US2023122387A1Vapor chamber with unequal cross-sectional widthsTAIWAN MICROLOOPS CORP·Filed 2021·Application pending·0 cites
- 3456US2023123190A1Vapor chamber with spoiler structureTAIWAN MICROLOOPS CORP·Filed 2021·Application pending·0 cites
- 3555US2025223969A1Membrane fanTAIWAN MICROLOOPS CORP·Filed 2024·Application pending·0 cites
- 3655US2026049772A1Three-dimensional vapor chamber assembly structureTAIWAN MICROLOOPS CORP·Filed 2025·Application pending·0 cites
- 3754US2024268081A1Composite heat dissipation deviceTAIWAN MICROLOOPS CORP·Filed 2023·Application pending·0 cites
- 3854US2023324130A1Heat dissipation module and manufacturing method thereofTAIWAN MICROLOOPS CORP·Filed 2022·Application pending·0 cites
- 3954US2023337398A1Heat dissipation moduleTAIWAN MICROLOOPS CORP·Filed 2022·Application pending·0 cites
- 4054US2022364798A1Heat dissipation module and manufacturing method thereofTAIWAN MICROLOOPS CORP·Filed 2021·Application pending·0 cites
- 4153US2023354552A1Assembly structure of vapor chamber and heat pipeTAIWAN MICROLOOPS CORP·Filed 2022·Application pending·0 cites
- 4251US2020033067A1Heat sink and cooling device using the sameTAIWAN MICROLOOPS CORP·Filed 2018·Application pending·0 cites
- 4350US2022346274A1Heat dissipation structure and manufacturing method thereofTAIWAN MICROLOOPS CORP·Filed 2021·Application pending·0 cites
- 4450US2023012170A1Heat conduction structure with liquid-gas split mechanismTAIWAN MICROLOOPS CORP·Filed 2021·Application pending·0 cites
- 4549US2022243991A1Wind-guiding type heat dissipation moduleTAIWAN MICROLOOPS CORP·Filed 2021·Application pending·0 cites
- 4648US2022272873A1Water-cooled and flow-controlled heat dissipation system used in cabinet and control method thereofTAIWAN MICROLOOPS CORP·Filed 2021·Application pending·0 cites
- 4747US2021307206A1Vapor chamber structureTAIWAN MICROLOOPS CORP·Filed 2020·Application pending·0 cites
- 4847US2021215434A1Thin type vapor chamber and method for making the sameTAIWAN MICROLOOPS CORP·Filed 2020·Application pending·0 cites
- 4946US2008040925A1Bendable heat spreader with metallic wire mesh-based microstructure and method for fabricating sameTAIWAN MICROLOOPS CORP·Filed 2007·Application pending·0 cites
- 5045US2017314873A1Heat conduction module structure and method of manufacturing the sameTAIWAN MICROLOOPS CORP·Filed 2016·Application pending·0 cites
Showing the top 50 of 67 patent records by PatentIndex Score.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →