Three-dimensional vapor chamber cooling device

Abstract

A cooling device includes a body, a heat pipe, a fin assembly and a working fluid. The body has a bottom plate and an upright plate. The upright plate is upright arranged on the bottom plate. A first chamber is encompassed in the bottom plate. A second chamber is encompassed in the upright plate. The first chamber communicates with the second chamber. The heat pipe is extended from a side of the upright plate and communicates with the second chamber. The fin assembly is disposed on the heat pipe. The working fluid is filled in the bottom plate in a liquid state. The working fluid can flow to the upright plate and the heat pipe when vaporizing.

What is claimed is: 
     
         1 . A three-dimensional vapor chamber cooling device comprising:
 a body, comprising a bottom plate and an upright plate, the upright plate being upright arranged on the bottom plate, a first chamber being encompassed in the bottom plate, a second chamber being encompassed in the upright plate, and the first chamber communicating with the second chamber;   a heat pipe, extended from a side of the upright plate, and communicating with the second chamber;   a fin assembly, disposed on the heat pipe; and   a working fluid, filled in the bottom plate in a liquid state, and being capable of flowing to the upright plate and the heat pipe when vaporizing.   
     
     
         2 . The three-dimensional vapor chamber cooling device of  claim 1 , wherein the heat pipe is parallel to the bottom plate. 
     
     
         3 . The three-dimensional vapor chamber cooling device of  claim 1 , wherein a first wick structure is attached on an inner wall of the bottom plate. 
     
     
         4 . The three-dimensional vapor chamber cooling device of  claim 3 , wherein a second wick structure is attached on an inner wall of the upright plate, and the first wick structure is connected to the second wick structure. 
     
     
         5 . The three-dimensional vapor chamber cooling device of  claim 4 , wherein a third wick structure is attached on an inner wall of the heat pipe, and the second wick structure is connected to the third wick structure. 
     
     
         6 . The three-dimensional vapor chamber cooling device of  claim 1 , wherein the second chamber is extended with a buffer space. 
     
     
         7 . The three-dimensional vapor chamber cooling device of  claim 6 , wherein the first chamber communicates with the buffer space. 
     
     
         8 . The three-dimensional vapor chamber cooling device of  claim 1 , wherein the upright plate is disposed on a side of an edge of the bottom plate. 
     
     
         9 . The three-dimensional vapor chamber cooling device of  claim 1 , wherein a side of the bottom plate is extended with another heat pipe, and the another heat pipe communicates with the first chamber. 
     
     
         10 . The three-dimensional vapor chamber cooling device of  claim 9 , wherein the another heat pipe is disposed with another fin assembly. 
     
     
         11 . The three-dimensional vapor chamber cooling device of  claim 1 , wherein the body comprises another upright plate, the upright plate and the another upright plate are upright disposed on the bottom plate and oppositely disposed on two sides of the bottom plate, and the heat pipe is connected between the upright plate and the another upright plate.