US2023128330A1PendingUtilityA1
Vapor deposition of molybdenum using a bis(alkyl-arene) molybdenum precursor
Est. expiryJan 19, 2038(~11.5 yrs left)· nominal 20-yr term from priority
H10B 41/35C23C 16/0272C23C 16/32H10B 41/20C23C 16/18C23C 16/45553C23C 16/08H10P 95/90H10P 14/43H10P 14/6938
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Claims
Abstract
Described are vapor deposition methods for depositing molybdenum materials onto a substrate by the use of bis(alkyl-arene) molybdenum, also referred to herein as (alkyl-arene)2Mo, for example bis(ethyl-benzene) molybdenum ((EtBz)2Mo), as a precursor for such deposition, as well as structures that contain the deposited material.
Claims
exact text as granted — not AI-modified1 - 18 . (canceled)
19 . A substrate comprising:
a molybdenum carbide seed layer deposited onto titanium nitride by chemical vapor deposition, the molybdenum carbide seed layer derived from bis(alkyl-arene) molybdenum precursor and the molybdenum carbide seed layer comprising Mo 2 C or MoC and the molybdenum carbide seed layer consists essentially of molybdenum carbide, and metallic molybdenum deposited on the seed layer by chemical vapor deposition, the metallic molybdenum derived from molybdenum halide precursor or molybdenum oxyhalide precursor.
20 . The substrate of claim 19 , wherein the bis(alkyl-arene) molybdenum is bis(ethyl-benzene) molybdenum.
21 . The substrate of claim 19 , wherein the molybdenum halide precusor or molybdenum oxyhalide precursor is selected from the group consisting of MoOCl 4 , MoCl 5 , and MoF 6 .
22 . The substrate of claim 19 , wherein the seed layer has a thickness of from 5 angstroms to 100 angstroms.
23 . The substrate of claim 19 , wherein the seed layer has a thickness of from 5 angstroms to 50 angstroms.
24 . The substrate of claim 19 , wherein the seed layer contains not more than 1 percent (atomic) of any material other than carbon and molybdenum.
25 . The substrate of claim 19 , wherein the seed layer contains not more than 0.1 percent (atomic) of any material other than carbon and molybdenum.
26 . The substrate of claim 19 , wherein the seed layer contains not more than 0.01 percent (atomic) of any material other than carbon and molybdenum.
27 . A substrate comprising:
A molybdenum carbide seed layer deposited onto titanium nitride by chemical vapor deposition, the molybdenum carbide seed layer derived from bis(alkyl-arene) molybdenum precursor and the molybdenum carbide seed layer comprising Mo 2 C or MoC and the molybdenum carbide seed layer consists of molybdenum carbide and molybdenum metal, and metallic molybdenum deposited on the seed layer by chemical vapor deposition, the metallic molybdenum derived from molybdenum halide precursor or molybdenum oxyhalide precursor.
28 . The substrate of claim 30 , wherein the bis(alkyl-arene) molybdenum is bis(ethyl-benzene) molybdenum.
29 . The substrate of claim 30 , wherein the molybdenum halide precusor or molybdenum oxyhalide precursor is selected from the group consisting of MoOCl 4 , MoCl 5 , and MoF 6 .
30 . The substrate of claim 30 , wherein the seed layer has a thickness of from 5 angstroms to 100 angstroms.
31 . The substrate of claim 30 , wherein the seed layer has a thickness of from 5 angstroms to 50 angstroms.
32 . A substrate comprising:
A molybdenum carbide seed layer deposited onto titanium nitride by chemical vapor deposition, the molybdenum carbide seed layer derived from bis(alkyl-arene) molybdenum precursor and the molybdenum carbide seed layer consists essentially of molybdenum carbide, and metallic molybdenum deposited on the seed layer by chemical vapor deposition, the metallic molybdenum derived from molybdenum halide precursor or molybdenum oxyhalide precursor.
33 . The substrate of claim 35 , wherein the seed layer contains not more than 1 percent (atomic) of any material other than carbon and molybdenum.Join the waitlist — get patent alerts
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