Top ring of polishing apparatus and polishing apparatus

Abstract

Provided is a technique that allows suppressing disengagement of a fitting portion of a band from a groove during the use of a top ring. In a top ring 10 of a polishing apparatus 100 , at least one of an outer peripheral wall 11 of a retainer member 30 and an outer peripheral wall 11 of a pressing mechanism 40 is provided with a groove 15 in which fitting portions 71 a, 71 b of a band 70 are fitted. The groove is a dovetail groove configured to have a groove opening, a groove bottom opposed to the groove opening, a first groove side wall connecting the groove opening to the groove bottom, and a second groove side wall connecting the groove opening to the groove bottom and opposed to the first groove side wall, in cross-sectional view, and the dovetail groove is configured such that an interval between the first groove side wall and the second groove side wall widens as the interval approaches the groove bottom. The fitting portion is configured to be in contact with the first groove side wall and the second groove side wall in a state where the fitting portion of the band is fitted in the dovetail groove.

1 . A top ring of a polishing apparatus, comprising:
 a top ring main body having a substrate support surface supporting an upper surface of a substrate;   a retainer member disposed so as to surround an outer periphery of the substrate support surface to hold an outer edge of the substrate;   a pressing mechanism disposed above the retainer member and configured to press the retainer member downward; and   a band disposed extending from an outer peripheral wall of the retainer member to an outer peripheral wall of the pressing mechanism, the band having at least one fitting portion, wherein   at least one of the outer peripheral wall of the retainer member and the outer peripheral wall of the pressing mechanism is provided with a groove in which the fitting portion of the band is fitted,   the groove is a dovetail groove configured to have a groove opening, a groove bottom opposed to the groove opening, a first groove side wall connecting the groove opening to the groove bottom, and a second groove side wall connecting the groove opening to the groove bottom and opposed to the first groove side wall, in cross-sectional view, and the dovetail groove is configured such that an interval between the first groove side wall and the second groove side wall widens as the interval approaches the groove bottom, and   the fitting portion is configured to be in contact with the first groove side wall and the second groove side wall in a state where the fitting portion of the band is fitted in the dovetail groove.   
     
     
         2 . The top ring of the polishing apparatus according to  claim 1 , wherein
 the fitting portion of the band has a first projecting portion in contact with the first groove side wall and a second projecting portion in contact with the second groove side wall, and   a V-shaped groove in a cross-sectionally V shape is provided between the first projecting portion and the second projecting portion.   
     
     
         3 . The top ring of the polishing apparatus according to  claim 1 , wherein
 a part of the band is provided with an expansion and contraction portion expandable and contractable in a vertical direction.   
     
     
         4 . The top ring of the polishing apparatus according to  claim 1 , wherein
 the groove is provided only on any one of the outer peripheral wall of the retainer member and the outer peripheral wall of the pressing mechanism.   
     
     
         5 . The top ring of the polishing apparatus according to  claim 1 , wherein
 the groove is provided on both the outer peripheral wall of the retainer member and the outer peripheral wall of the pressing mechanism.   
     
     
         6 . The top ring of the polishing apparatus according to  claim 1 , wherein
 the groove is provided only on the outer peripheral wall of the retainer member among the outer peripheral wall of the retainer member and the outer peripheral wall of the pressing mechanism,   the top ring main body has an upper side member disposed so as to cover an upper portion of the pressing mechanism,   one end portion of both end portions of the band is sandwiched between the upper side member and the pressing mechanism, and   the fitting portion of the band is disposed on another end portion of the band.   
     
     
         7 . The top ring of the polishing apparatus according to  claim 1 , wherein
 the groove opening is provided with a depressed portion for a processing tool for processing the groove to pass through when the processing tool is inserted from the groove opening into the groove.   
     
     
         8 . The top ring of the polishing apparatus according to  claim 1 , wherein
 the substrate is a polygonal substrate.   
     
     
         9 . A top ring of a polishing apparatus, comprising:
 a top ring main body having a substrate support surface supporting an upper surface of a substrate;   a retainer member disposed so as to surround an outer periphery of the substrate support surface to hold an outer edge of the substrate;   a pressing mechanism disposed above the retainer member and configured to press the retainer member downward; and   a band disposed extending from an outer peripheral wall of the retainer member to an outer peripheral wall of the pressing mechanism, the band having a fitting portion, wherein   the outer peripheral wall of the retainer member is provided with a groove in which the fitting portion of the band is fitted,   the top ring main body has an upper side member disposed so as to cover an upper portion of the pressing mechanism,   one end portion of both end portions of the band is sandwiched between the upper side member and the pressing mechanism, and   the fitting portion of the band is disposed on another end portion of the band.   
     
     
         10 . A polishing apparatus comprising:
 the top ring according to  claim 1 ; and   a polishing table configured to hold a polishing pad for polishing the substrate held by the top ring.