Positive photoresist composition utilizing O-quinonediazide and novolak resin

Abstract

A positive photoresist composition containing the combination of at least one alkali-soluble novolak resin and at least one light-sensitive compound represented by formula (I): ##STR1## wherein each of R 1 to R 10 , which may be the same or different, represents hydrogen, --OH, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkoxy group, a substituted or unsubstituted aryl group, a substituted or unsubstituted aralkyl group, a substituted or unsubstituted alkylester group, a substituted or unsubstituted arylester group, a substituted or unsubstituted aralkylester group, a substituted or unsubstituted alkylsulfonylester group, a substituted or unsubstituted arylsulfonylester group, ##STR2## provided that at least one of R 1 to R 10 represents ##STR3## where R 17 represents a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group or a substituted or unsubstituted aralkyl group; and at least two of R 1 to R 10 represent ##STR4## and R 11 and R 12 , which may be the same or different, each represents hydrogen, --OH, --COOH, --CN, a halogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkoxy group, a substituted or unsubstituted aralkyl group, --COOR 13 , --R 14 --COOH, or --R 15 --COOR 16 ; where R 13 and R 16 , which may be the same or different, each represents a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted aralkyl group; and R 14 and R 15 each represents a substituted or unsubstituted alkylene group, or a substituted or unsubstituted arylene group; provided that at least one of R 11 and R 12 represents a group other than hydrogen. The positive photoresist composition has high resolving power and sensitivity, and a nearly perpendicular cross-section.

What is claimed is: 
     
       1. A positive photoresist composition comprising in admixture at least one alkali-soluble novolak resin and at least one light-sensitive compound represented by formula (I): ##STR20## wherein each of R 1  to R 10 , which may be the same or different, represents hydrogen, --OH, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkoxy group, a substituted or unsubstituted aryl group, a substituted or unsubstituted aralkyl group, a substituted or unsubstituted alkylester group, a substituted or unsubstituted arylester group, a substituted or unsubstituted aralkylester group, a substituted or unsubstituted alkylsulfonylester group, a substituted or unsubstituted arylsulfonylester group, ##STR21## provided that at least one of R 1  to R 10  represents ##STR22## where R 17  represents a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group or a substituted or unsubstituted aralkyl group; and at least two of R 1  to R 10  represent ##STR23## and R 11  and R 12 , which may be the same or different, each represents hydrogen, --OH, --COOH, --CN, a halogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkoxy group, a substituted or unsubstituted aralkyl group, --COOR 13 , --R 14  --COOH, or --R 15  --COOR 16  ; where R 13  and R 16 , which may be the same or different, each represents a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted aralkyl group; and R 14  and R 15  each represents a substituted or unsubstituted alkylene group, or a substituted or unsubstituted arylene group; provided that at least one of R 11  represents a group other than hydrogen; wherein from 5 to 100 parts by weight of said light-sensitive compound represented by formula (I) are present per 100 parts by weight of said novolak resin. 
     
     
       2. The positive photoresist composition as claimed in claim 1, wherein at least two of R 1  to R 10  represent ##STR24## 
     
     
       3. The positive photoresist composition as claimed in claim 1, wherein at least two of R 1  to R 10  represent ##STR25## 
     
     
       4. The positive photoresist composition as claimed in claim 1, wherein each of said alkyl groups and alkoxy groups represented by R 1  to R 13 , R 16  and R 17  contains 1 to 8 carbon atoms; each of said aryl groups and aralkyl groups represented by R 1  to R 13 , R 16  and R 17  contains 6 to 15 carbon atoms; each of said substituted alkyl groups and substituted alkoxy groups represented by R 1  to R 13 , R 16  and R 17  is substituted with a substituent selected from an alkoxy group, an aryloxy group, an aryl group, a hydroxyl group, a carboxyl group, a sulfonic acid group, an amino group, a nitro group, a silyl group, a silyl ether group, a cyano group, an aldehyde group, a mercapto group or a halogen atom; and each of said substituted aryl groups and substituted aralkyl groups represented by R 1  to R 13 , R 16  and R 17  is substituted with at least one substituent selected from an alkoxy group, an aryloxy group, an aryl group, a hydroxyl group, a carboxyl group, a sulfonic acid group, an aryl group, a nitro group, a silyl group, a silyl ether group, a cyano group, an aldehyde group, a mercapto group or halogen atoms. 
     
     
       5. The positive photoresist composition as claimed in claim 1, wherein each of R 14  and R 15  represents an alkylene group containing 1 to 8 carbon atoms; an arylene group containing 6 to 15 carbon atoms; an alkylene group containing 1 to 8 carbon atoms substituted with an alkoxy group, an aryloxy group, an aryl group, a hydroxyl group, a carboxyl group, a sulfonic acid group, an amino group, a nitro group, a silyl group, a silyl ether group, a cyano group, an aldehyde group, a mercapto group, or a halogen atom; or an arylene group containing 6 to 15 carbon atoms substituted with an alkoxy group, an aryloxy group, an aryl group, a hydroxyl group, a carboxyl group, a sulfonic acid group, an amino group, a nitro group, a silyl group, a silyl ether group, a cyano group, an aldehyde group, a mercapto group, or a halogen atom. 
     
     
       6. The positive photoresist composition as claimed in claim 1, comprising from 10 to 50 parts by weight of said light-sensitive compound represented by formula (I) per 100 parts by weight of said novolak resin. 
     
     
       7. The positive photoresist composition as claimed claim 6, further comprising up to 100 parts by weight of a second light-sensitive compound selected from an ester of 1,2-naphthoquinonediazido-5-sulfonyl chloride and an ester of 1,2-naphthoquinonediazido-4-sulfonyl chloride, with any of 2,3,4-trihydroxybenzophenone, 2,4,4'-trihydroxybenzophenone, and 2,4,6-trihydroxybenzophenone; per 100 parts by weight of said light-sensitive compound represented by formula (I). 
     
     
       8. The positive photoresist composition as claimed in claim 7, comprising at most 30 parts by weight of said second light-sensitive compound per 100 parts by weight of said light-sensitive compound represented by formula (I). 
     
     
       9. The positive photoresist composition as claimed in claim 7, further comprising a polyhydroxy compound.