US5340688AExpiredUtility

Positive type photoresist composition

47
Assignee: FUJI PHOTO FILM CO LTDPriority: Feb 12, 1992Filed: Feb 10, 1993Granted: Aug 23, 1994
Est. expiryFeb 12, 2012(expired)· nominal 20-yr term from priority
G03F 7/022
47
PatentIndex Score
8
Cited by
17
References
9
Claims

Abstract

Disclosed is a novel positive type photoresist composition comprising a 1,2-naphthoquinonediazido-5-(and/or -4-)sulfonic ester of a member selected from the group consisting of the polyhydroxy compounds represented by the following formula (I), (II) or (III) and an alkali-soluble resin: ##STR1## wherein the variables of Formula I are defined in the specification; ##STR2## wherein the variables of Formula II are defined in the specification; ##STR3## wherein the variables of Formula III are defined in the specification.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A positive type photoresist composition comprising an admixture of a 1,2-naphthoquinonediazido-5-(and/or -4-)-sulfonic ester of a polyhydroxy compound represented by the following formula (I), (II) or (III) and an alkali soluble resin: ##STR15## wherein R 1  to R 27 , which may be the same or different, each represents a hydrogen atom, a hydroxyl group, a halogen atom, an alkyl group, an alkoxy group, a nitro group, an alkenyl group, an aryl group, an aralkyl group, an alkoxycarbonyl group, an arylcarbonyl group, an acyloxy group, an acyl group, an aryloxyl group or an aralkoxy group; ##STR16## wherein R 31  to R 34 , which may be the same or different and in which the four groups for each of R 31  to R 34  may be the same or different, each represents a hydrogen atom, a hydroxyl group, a halogen atom, an alkyl group, an alkoxy group or an alkenyl group; R 35  and R 36  represents a hydrogen atom, an alkyl group or ##STR17## a and c each represents 0 or 1; and b ##STR18## wherein R 41  to R 45 , which may be the same or different, each represents a hydrogen atom, a hydroxyl group, a halogen atom, an alkyl group or an alkoxy group, with the proviso that at least one of R 41  to R 45  is a hydroxyl group; X represents a single bond or a --(CH 2 ) m  -- group; Y represents a --COO--X-- or --OCO--X-- group; Z represents an organic group having a valence of n; n represents an integer 3 to 6; and m represents n integer 1 to 4. 
     
     
       2. The positive type photoresist composition of claim 1, wherein the polyhydroxy compound is according to formula (I). 
     
     
       3. The positive type photoresist composition of claim 1, wherein the polyhydroxy compound is according to formula (II). 
     
     
       4. The positive type photoresist composition of claim 1, wherein the polyhydroxy compound is according to formula (III). 
     
     
       5. The positive type photoresist composition of claim 1, wherein the ester is present in an amount of 5 to 100 parts by weight based on 100 parts by weight of the alkali-soluble resin. 
     
     
       6. The positive type photoresist composition of claim 1, wherein the ester is present in an amount of 10 to 50 parts by weight based on 100 parts by weight of the alkali-soluble resin. 
     
     
       7. The positive type photoresist composition of claim 1 , wherein the ester is a 1 , 2-naphthoquinonediazide-4-sulfonic ester. 
     
     
       8. The positive type photoresist composition of claim 1 , wherein the ester is a 1 , 2-naphthoquinonediazide-5-sulfonic ester. 
     
     
       9. The positive type photoresist composition of claim 1, wherein the alkali-soluble resin ia a novolak resin.

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