Dust particle inspection method for X-ray mask

Abstract

Disclosed is an X-ray mask for use in an exposure apparatus for transferring a circuit pattern onto an exposure substrate by use of an X-ray beam to produce a semiconductor device, wherein the X-ray mask includes an X-ray transmission film having a layered X-ray absorptive material formed thereon, and a holding frame for holding the X-ray transmission film, and wherein the X-ray transmission film is held by the holding frame with an even step-like structure defined at its peripheral portion. With this arrangement, a dust particle adhered to the X-ray mask surface and having a predetermined height can be detected precisely, such that a large integration device can be produced effectively.

What is claimed is:  
     
       1. A dust particle inspection method for use with an X-ray mask for use in a proximity exposure apparatus, wherein said X-ray mask comprises an X-ray transmission film having a layered X-ray absorptive material formed thereon and a holding member for holding said X-ray transmission film, wherein a peripheral portion of the X-ray transmission film and the X-ray absorptive material is formed into a step-like shape with respect to the holding member wherein the method comprises: 
       when the dust particle inspection is made with respect to the peripheral portion of the X-ray transmission film and the X-ray absorptive material, an even signal output is produced therefrom such that the peripheral portion of the X-ray transmission film and the X-ray absorptive material can be detected to enable dust particle control at the peripheral portion.  
     
     
       2. A method according to  claim 1 , wherein the step-like shape of the peripheral portion of the X-ray transmission film and the X-ray absorptive material is defined by removing, by etching, a substance at the peripheral portion of the X-ray transmission film and the X-ray absorptive material.