Method for making a microelectronic package using pre-patterned, reusable mold and method for making the mold

Abstract

A method for making a reusable mold for forming a microelectronic element package. The method including the steps of removing material from portions of a base to form recesses in the base and then depositing a mask material on at least some portions of the base.

1. A method of making a reusable mold for forming a microelectronic package, comprising:
 removing material from portions of a base to form first recesses having a first size and second recesses having a second size said second size being different than said first size, wherein a plurality of second recesses are associated with at least one first recess in said base; and then 
 depositing a mask material on at least some portions of said base so as to form a mask attached to said base. 
 
     
     
       2. The method of  claim 1 , wherein the step of removing material comprises removing material from said base and wherein said base comprises a metal plate. 
     
     
       3. The method of  claim 2 , wherein the step of removing comprises etching said metal plate with Ferric Chloride and wherein said base comprises a stainless steel plate. 
     
     
       4. The method of  claim 1 , wherein the step of removing material comprises etching said base. 
     
     
       5. A method of making a reusable mold for forming a microelectronic package, comprising:
 removing material from portions of a base to form first recesses having a first size and second recesses having a second size said second size being different than said first size, wherein a plurality of second recesses are associated with at least one first recess in said base; 
 depositing a mask material on at least some portions of said base so as to form a mask attached to said base; and 
 providing an additional mask having openings on said base, 
 wherein the step of removing material comprises removing material from said portions of said base that are aligned with said openings in said additional mask. 
 
     
     
       6. The method of  claim 5 , wherein the step of providing an additional mask comprises depositing a photoresist on said base and patterning said photoresist so as to form openings in said photoresist. 
     
     
       7. The method of  claim 1 , wherein the step of depositing a the mask material comprises utilizing electrophoretic deposition. 
     
     
       8. The method of  claim 7 , wherein the step of depositing the mask material comprises depositing a polymer utilizing electrophoretic deposition. 
     
     
       9. The method of  claim 5 , further comprising removing portions of said additional mask to form said openings in said additional mask, wherein said mask material is partially cured before the step of removing said additional mask. 
     
     
       10. The method of  claim 9 , further comprising removing portions of said additional mask after the step of depositing the mask material. 
     
     
       11. The method of  claim 10 , further comprising further curing of said mask material after the step of removing said additional mask. 
     
     
       12. The method of  claim 11 , wherein the further curing includes applying pressure.