P
US7323748B2ExpiredUtilityPatentIndex 93

Semiconductor device having epitaxial layer

Assignee: TOSHIBA KKPriority: Aug 28, 2003Filed: Jun 20, 2006Granted: Jan 29, 2008
Est. expiryAug 28, 2023(expired)· nominal 20-yr term from priority
Inventors:YAMADA TAKASHINAGANO HAJIMEHAMAMOTO TAKESHI
H10W 10/181H10W 10/061H10P 90/1906H10D 84/0151H10D 87/00H10D 86/201H10D 86/01H10D 84/0135H10D 30/711H10D 84/0128H10D 84/038H10B 41/40H10B 41/43H10B 12/50
93
PatentIndex Score
13
Cited by
27
References
3
Claims

Abstract

A semiconductor device includes a substrate having first and second regions, a first insulating film formed on the substrate in the first region, a first epitaxial layer formed on the substrate in the second region and having an upper surface higher than an upper surface of the first insulating film, and a first semiconductor layer formed on the first insulating film with a space provided with respect to the first epitaxial layer, having an upper surface set at substantially the same height as the upper surface of the first epitaxial layer and having a tapered surface faced to a side surface of the first epitaxial layer.

Claims

exact text as granted — not AI-modified
1. A semiconductor device comprising:
 a substrate having first and second regions, 
 a first insulating film formed on the substrate in the first region, 
 a first epitaxial layer formed on the substrate in the second region and having an upper surface higher than an upper surface of the first insulating film, and 
 a first semiconductor layer formed on the first insulating film with a space provided with respect to the first epitaxial layer, having an upper surface set at substantially the same height as the upper surface of the first epitaxial layer and having a tapered surface faced to a side surface of the first epitaxial layer. 
 
     
     
       2. The semiconductor device according to  claim 1 , wherein the side surface of first epitaxial layer has a facet. 
     
     
       3. The semiconductor device according to  claim 1 , further comprising:
 a first gate insulating film formed on the upper surface and the tapered surface of the first semiconductor layer; and 
 a second gate insulating film formed on the upper surface and the side surface of the first epitaxial layer.

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