Method of manufacturing multi-layer printed circuit board

Abstract

A method of manufacturing a printed circuit board includes the following steps (A) to (D). (A) Laminating a resin insulating layer on each of two sides of a core member to form a core substrate, (B) forming penetrating openings in the core substrate by applying laser beams, (C) forming a rough surface on the core substrate, and (D) providing a metal film for each penetrating opening to form through holes.

What is claimed is: 
     
       1. A method of manufacturing a printed circuit board, comprising:
 laminating a resin insulating layer on each of two sides of a core member to form a core substrate; 
 forming a plurality of penetrating openings in said core substrate by applying laser beams; 
 forming a rough surface on said core substrate; and 
 providing a metal film in each of the penetrating openings to form a plurality of through holes, respectively. 
 
     
     
       2. A method of manufacturing a printed circuit board according to  claim 1 , wherein said core member is formed by impregnating a core material with a resin material. 
     
     
       3. A method of manufacturing a printed circuit board according to  claim 1 , wherein said resin insulating layer is formed by dispersing soluble particles in a refractory resin material. 
     
     
       4. A method of manufacturing a printed circuit board according to  claim 1 , wherein said core member comprises a core material and a resin material impregnated to the core material. 
     
     
       5. A method of manufacturing a printed circuit board according to  claim 1 , wherein said resin insulating layer comprises a refractory resin material and soluble particles dispersed in the refractory resin material. 
     
     
       6. A method of manufacturing a printed circuit board according to  claim 1 , further comprising impregnating a core material with a resin material such that the core member comprising the core material and the resin material is formed. 
     
     
       7. A method of manufacturing a printed circuit board according to  claim 1 , further comprising dispersing soluble particles in a refractory resin material such that said resin insulating layer comprising the refractory resin material and the soluble particles is formed. 
     
     
       8. A method of manufacturing a printed circuit board according to  claim 6 , further comprising dispersing soluble particles in a refractory resin material such that said resin insulating layer comprising the refractory resin material and the soluble particles is formed. 
     
     
       9. A method of manufacturing a printed circuit board according to  claim 4 , wherein said resin insulating layer comprises a refractory resin material and soluble particles dispersed in the refractory resin material. 
     
     
       10. A method of manufacturing a printed circuit board according to  claim 1 , further comprising forming an electroplated film on the metal film formed in each of the penetrating openings. 
     
     
       11. A method of manufacturing a printed circuit board according to  claim 1 , wherein the providing of the metal film in each of the penetrating openings comprises forming an electroless plating layer in each of the penetrating openings. 
     
     
       12. A method of manufacturing a printed circuit board according to  claim 11 , further comprising forming an electroplated film on the metal film comprising the electroless plating layer formed in each of the penetrating openings. 
     
     
       13. A method of manufacturing a printed circuit board according to  claim 5 , further comprising forming an electroplated film on the metal film formed in each of the penetrating openings. 
     
     
       14. A method of manufacturing a printed circuit board according to  claim 9 , further comprising forming an electroplated film on the metal film formed in each of the penetrating openings. 
     
     
       15. A method of manufacturing a printed circuit board according to  claim 1 , further comprising forming a conductor circuit on at least one side of the core substrate. 
     
     
       16. A method of manufacturing a printed circuit board according to  claim 1 , further comprising forming a conductor circuit on at least one side of the core substrate such that the conductor circuit is connected to at least one of the through holes. 
     
     
       17. A method of manufacturing a printed circuit board according to  claim 1 , further comprising forming a conductor circuit on each of two sides of the core substrate such that the conductor circuits are connected by at least one of the through holes through the core substrate. 
     
     
       18. A method of manufacturing a printed circuit board according to  claim 5 , further comprising forming a conductor circuit on at least one side of the core substrate. 
     
     
       19. A method of manufacturing a printed circuit board according to  claim 5 , further comprising forming a conductor circuit on at least one side of the core substrate such that the conductor circuit is connected to at least one of the through holes. 
     
     
       20. A method of manufacturing a printed circuit board according to  claim 5 , further comprising forming a conductor circuit on each of two sides of the core substrate such that the conductor circuits are connected by at least one of the through holes through the core substrate.