Semiconductor devices and methods of manufacture thereof

Abstract

Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a semiconductor device comprises a workpiece including a conductive feature disposed in a first insulating material and a second insulating material disposed over the first insulating material, the second insulating material having an opening over the conductive feature. A graphene-based conductive layer is disposed over an exposed top surface of the conductive feature within the opening in the second insulating material. A carbon-based adhesive layer is disposed over sidewalls of the opening in the second insulating material. A carbon nano-tube (CNT) is disposed within the patterned second insulating material over the graphene-based conductive layer and the carbon-based adhesive layer.

What is claimed is: 
     
       1. A semiconductor device, comprising:
 a workpiece including a conductive feature disposed in a first insulating material and a second insulating material disposed over the first insulating material, the second insulating material having an opening over the conductive feature; 
 a graphene-based conductive layer disposed over an exposed top surface of the conductive feature within the opening in the second insulating material; 
 a carbon-based adhesive layer disposed over sidewalls of the opening in the second insulating material; and 
 a carbon nano-tube (CNT) disposed within the second insulating material over the graphene-based conductive layer and the carbon-based adhesive layer. 
 
     
     
       2. The semiconductor device according to  claim 1 , wherein the conductive feature comprises a material selected from the group consisting essentially of Cu, Fe, Co, Ni, alloys thereof, and combinations thereof. 
     
     
       3. The semiconductor device according to  claim 1 , wherein the conductive feature comprises a first conductive feature, further comprising a second conductive feature disposed within a third insulating material, the second conductive feature being disposed over the CNT. 
     
     
       4. The semiconductor device according to  claim 3 , wherein the second conductive feature comprises a material selected from the group consisting essentially of Au, Ag, Al, Cu, Fe, Co, Ni, alloys thereof, and combinations thereof. 
     
     
       5. The semiconductor device according to  claim 3 , wherein the graphene-based conductive layer comprises a first graphene-based conductive layer, and wherein the semiconductor device further comprises a second graphene-based conductive layer disposed between the second conductive feature and the CNT. 
     
     
       6. The semiconductor device according to  claim 5 , wherein the CNT comprises a first CNT, and wherein the semiconductor device further comprises a plurality of second conductive features disposed within a plurality of the third insulating materials, and wherein a second CNT is disposed between each adjacent one of the plurality of second conductive features. 
     
     
       7. The semiconductor device according to  claim 1 , wherein the CNT comprises a plurality of CNTs within the second insulating material. 
     
     
       8. The semiconductor device according to  claim 7 , further comprising a conductive material filling interspaces between adjacent ones of the plurality of CNTs. 
     
     
       9. The semiconductor device according to  claim 5 , further comprising another carbon-based adhesive layer between the second conductive feature and the third insulating material. 
     
     
       10. A semiconductor device comprising:
 a substrate; 
 a first insulating layer on the substrate; 
 a first conductive feature formed within a recess in the first insulating layer; 
 a second insulating layer on the first insulating layer and the first conductive feature, the second insulating layer having an opening formed therein, the opening aligned to the first conductive feature to expose a portion of the first conductive feature; 
 a graphene-based conductive layer on the exposed portion of the first conductive feature; 
 a carbon-based adhesive layer lining sidewalls of the opening in the second insulating layer; 
 a planar catalyst layer over and contacting the graphene-based conductive layer; and 
 a plurality of carbon nano-tubes (CNTs) within the opening in electrical and physical contact with the planar catalyst layer at a first end of respective CNTs. 
 
     
     
       11. The semiconductor device according to  claim 10 , further comprising:
 a third insulating layer on the second insulating layer; and 
 a second conductive feature in electrical contact with the plurality of carbon nano-tubes (CNTs) at a second end of the respective CNTs opposite the first end. 
 
     
     
       12. The semiconductor device according to  claim 11 , further comprising a second graphene-based conductive layer between the second end of the respective CNTs and the second conductive feature. 
     
     
       13. The semiconductor device according to  claim 10 , wherein the graphene-based conductive layer comprises one or more graphene sheets formed on exposed portion of the first conductive feature. 
     
     
       14. The semiconductor device according to  claim 10 , wherein the graphene-based conductive layer has a thickness of from about 0.1 nm to about 20 nm. 
     
     
       15. The semiconductor device according to  claim 10 , further comprising a conductive material filling interspaces between adjacent ones of the plurality of CNTs. 
     
     
       16. A semiconductor device comprising:
 a first conductive feature; 
 a second conductive feature; and 
 an electrical connection between the first and second conductive features, the electrical connection including
 an insulating layer having an opening therein extending between the first and second conductive features, the opening aligned with a first portion of the first conductive feature and a second portion of the second conductive feature, 
 a first graphene-based conductive layer lining the first portion of the first conductive feature, 
 a carbon-based adhesive layer lining sidewalls of the opening, and 
 a plurality of carbon nano-tubes (CNTs) having the same length electrically connecting the first graphene-based conductive layer and the second conductive feature. 
 
 
     
     
       17. The semiconductor device according to  claim 16 , further comprising a conductive material filling interspaces between adjacent ones of the plurality of CNTs. 
     
     
       18. The semiconductor device according to  claim 16 , further comprising a second graphene-based conductive layer lining the second portion of the second conductive feature. 
     
     
       19. The semiconductor device according to  claim 16 , wherein the first portion of the first conductive feature extends beyond a surface of the insulating layer. 
     
     
       20. The semiconductor device according to  claim 16 , wherein the plurality of CNTs comprises hundreds of hollow tubes.