Vertical single electron transistor formed by condensation
Abstract
A method for forming a vertical single electron transistor includes forming a heterostructured nanowire having a SiGe region centrally disposed between an upper portion and a lower portion in the nanowire. An oxide is deposited to cover the SiGe region, and a condensation process is performed to convert the SiGe to oxide and condense Ge to form an island between the upper portion and the lower portion of the nanowire. A bottom contact is formed about the lower portion, a first dielectric layer is formed on the bottom contact and a gate structure is formed about the island on the first dielectric layer. A second dielectric layer is formed on the gate structure, and a top contact is formed on the second dielectric layer.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A method for forming a vertical single electron transistor, comprising;
forming a heterostructured nanowire having a SiGe region centrally disposed between an upper portion and a lower portion in the nanowire;
depositing an oxide to cover the SiGe region;
performing a condensation process to convert the SiGe to oxide and condense Ge to form an island between the upper portion and the lower portion of the nanowire;
forming a bottom contact about the lower portion;
forming a first dielectric layer on the bottom contact;
forming a gate structure about the island on the first dielectric layer;
forming a second dielectric layer on the gate structure; and
forming a top contact on the second dielectric layer.
2. The method as recited in claim 1 , wherein the island includes a quantum dot having a diameter of less than about 6 nm.
3. The method as recited in claim 1 , wherein the upper portion and lower portion include doped Si.
4. The method as recited in claim 1 , wherein at least one of the first dielectric layer and/or the second dielectric layer are formed using a directional deposition method.
5. The method as recited in claim 4 , wherein the directional deposition method includes a gas cluster ion beam (GCIB) method.
6. The method as recited in claim 1 , wherein forming the heterostructured nanowire includes:
lithographically etching a stack of layers to form one or more fins; and
lithographically etching the one or more fins in a fin cut etch to form one or more nanowires.
7. The method as recited in claim 1 , wherein forming the heterostructured nanowire includes:
patterning metal seeds on a semiconductor layer; and
growing nanowires by a vapor liquid solid growth method.
8. The method as recited in claim 1 , further comprising trimming an area around the island to form a necked down region about the island.
9. A method for forming a vertical single electron transistor, comprising;
forming a nanowire from a first doped silicon layer, a SiGe layer, and a second doped silicon layer on a semiconductor substrate;
depositing an oxide to cover the nanowire;
performing a condensation process to convert the SiGe to oxide and condense Ge to form an island between the first doped silicon layer and the second doped silicon layer of the nanowire;
forming a source region about the first doped silicon layer;
forming a gate structure about the island between the first doped silicon layer and the second doped silicon layer of the nanowire; and
forming a drain region about the second doped silicon layer.
10. The method as recited in claim 9 , wherein the island includes a quantum dot having a diameter of less than about 6 nm.
11. The method as recited in claim 9 , wherein the drain region is separated from the gate structure by a first dielectric layer and the source region is separated from the gate structure by a second dielectric layer.
12. The method as recited in claim 11 , wherein the first and second dielectric layers are formed by a directional deposition method including a gas cluster ion beam (GCIB) method.
13. The method as recited in claim 9 , wherein forming the nanowire includes:
lithographically etching the first doped silicon layer, the SiGe layer, and the second doped silicon layer on the semiconductor substrate to form one or more fins; and
lithographically etching the one or more fins in a fin cut etch to form one or more nanowires.
14. The method as recited in claim 9 , wherein forming the nanowire includes:
patterning metal seeds on a doped silicon layer; and
growing nanowires by a vapor liquid solid growth method to form the first doped silicon layer, the SiGe layer, and the second doped silicon layer.
15. The method as recited in claim 9 , further comprising trimming an area around the island to form a necked down region about the island.
16. A vertical single electron transistor, comprising;
a nanowire having a lower doped layer and an upper doped layer;
a dielectric gap disposed between the lower doped layer and the upper doped layer;
a quantum dot formed within the dielectric gap and encapsulated in dielectric material;
a source region formed about one of the lower doped layer and the upper doped layer;
a gate structure formed about the quantum dot; and
a drain region formed about the other of the lower doped layer and the upper doped layer.
17. The transistor as recited in claim 16 , wherein the quantum dot includes a diameter of less than about 6 nm.
18. The transistor as recited in claim 16 , wherein drain region is separated from the gate structure by a first dielectric layer and the source is separated from the gate structure by a second dielectric layer.
19. The transistor as recited in claim 16 , further comprising a necked down region in an area around the quantum dot.
20. The transistor as recited in claim 16 , wherein the quantum dot includes condensed Ge.Cited by (0)
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