Microelectromechanical device and method for forming a microelectromechanical device

Abstract

A microelectromechanical device may include: a semiconductor carrier; a microelectromechanical element disposed in a position distant to the semiconductor carrier; wherein the microelectromechanical element is configured to generate or modify an electrical signal in response to a mechanical signal and/or is configured to generate or modify a mechanical signal in response to an electrical signal; at least one contact pad, which is electrically connected to the microelectromechanical element for transferring the electrical signal between the contact pad and the microelectromechanical element; and a connection structure which extends from the semiconductor carrier to the microelectromechanical element and mechanically couples the microelectromechanical element with the semiconductor carrier.

What is claimed is: 
     
       1. A microelectromechanical device comprising:
 a semiconductor carrier; 
 a microelectromechanical element disposed in a position distant to the semiconductor carrier;
 wherein the microelectromechanical element is configured to generate or modify an electrical signal in response to a mechanical signal and/or is configured to generate or modify a mechanical signal in response to an electrical signal; 
 
 at least one contact pad, which is electrically connected to the microelectromechanical element for transferring the electrical signal between the contact pad and the microelectromechanical element; and 
 a connection structure which extends from the semiconductor carrier to the microelectromechanical element and mechanically couples the microelectromechanical element with the semiconductor carrier;
 wherein a stiffness of the connection structure is less than a stiffness of at least one of the microelectromechanical element and the semiconductor carrier; 
 wherein along a first direction a stiffness of the connection structure is less than a stiffness of at least one of the microelectromechanical element and the semiconductor carrier; 
 wherein along a second direction a stiffness of the connection structure is more than a stiffness of at least one of the microelectromechanical element and a membrane of the microelectromechanical element; and 
 wherein the first direction is perpendicular to the second direction. 
 
 
     
     
       2. The microelectromechanical device of  claim 1 ,
 wherein the microelectromechanical element is resiliently supported by the semiconductor carrier via the connection structure. 
 
     
     
       3. The microelectromechanical device of  claim 1 ,
 wherein a thickness of the connection structure is smaller than a thickness of at least one of the microelectromechanical element and the semiconductor carrier. 
 
     
     
       4. The microelectromechanical device of  claim 1 ,
 wherein the microelectromechanical element comprises a mechanical member and one or more electrical members, which are mechanically coupled with each other and with the connection structure. 
 
     
     
       5. The microelectromechanical device of  claim 4 ,
 wherein at least one of the mechanical member and one electrical member of the one or more electrical members are disposed distant from the semiconductor carrier. 
 
     
     
       6. The microelectromechanical device of  claim 4 ,
 wherein the one or more electrical members are configured to move the mechanical member based on the electrical signal for generating or modifying the mechanical signal; and/or 
 wherein the electrical element is configured to sense a movement of the mechanical member and to generate or modify the electrical signal based on the movement. 
 
     
     
       7. The microelectromechanical device of  claim 1 , further comprising:
 a stiffening element at least partially surrounding the microelectromechanical element and being distant from the semiconductor carrier. 
 
     
     
       8. The microelectromechanical device of  claim 1 ,
 wherein a gap extends between the semiconductor carrier and the microelectromechanical element at least substantially around the microelectromechanical element, wherein the connection structure extends through the gap. 
 
     
     
       9. The microelectromechanical device of  claim 1 ,
 wherein the semiconductor carrier comprises an opening, wherein the microelectromechanical element is disposed at least one of in or over the opening, wherein an extension of the opening parallel to a surface of the semiconductor carrier is greater than an extension of the microelectromechanical element parallel to the surface of the semiconductor carrier. 
 
     
     
       10. The microelectromechanical device of  claim 1 ,
 an electrical circuit which is electrically coupled to the at least one contact pad for transmitting the electrical signal, wherein the electrical circuit is configured to generate or modify electrical signals for driving the microelectromechanical element and/or wherein the electrical circuit is configured to process electrical signals generated or modified by the microelectromechanical element. 
 
     
     
       11. The microelectromechanical device of  claim 10 , wherein the electrical circuit includes a data converter which includes a data input/output interface, wherein the data converter is configured to convert data received at the input/output interface into an electrical signal and/or wherein the data converter is configured to convert an electrical signal into data which is supported to the input/output interface. 
     
     
       12. The microelectromechanical device of  claim 10 , wherein the electrical circuit includes an analog/digital converter which includes a data input/output interface, wherein the analog/digital converter is configured to convert a digital signal received at the input/output interface into an electrical signal and/or wherein the analog/digital converter is configured to convert an electrical signal into a digital signal which is supported to the input/output interface. 
     
     
       13. The microelectromechanical device of  claim 1 ,
 wherein the connection structure is in physical contact with at least one of: a peripheral region of the microelectromechanical element and the semiconductor carrier. 
 
     
     
       14. The microelectromechanical device of  claim 1 ,
 wherein the connection structure comprises one or more spring arms which extend from the semiconductor carrier to the microelectromechanical element and elastically couple the microelectromechanical element with the semiconductor carrier. 
 
     
     
       15. The microelectromechanical device of  claim 14 ,
 wherein the one or more spring arms are configured to deflect in response to a mechanical load, such that the mechanical load is at least partially absorbed by the one or more spring arms. 
 
     
     
       16. The microelectromechanical device of  claim 14 ,
 wherein at least one spring arm of the one or more spring arms is at least one of meander shaped and corrugated. 
 
     
     
       17. The microelectromechanical device of  claim 14 ,
 wherein the one or more spring arms are in physical contact with a peripheral region of the microelectromechanical element. 
 
     
     
       18. The microelectromechanical device of  claim 14 ,
 wherein the one or more spring arms comprise at least two spring arms. 
 
     
     
       19. The microelectromechanical device of  claim 18 ,
 wherein the at least two spring arms are disposed on opposite sides of the microelectromechanical element. 
 
     
     
       20. The microelectromechanical device of  claim 1 ,
 wherein the microelectromechanical element comprises a mechanical member in form of a membrane and wherein the microelectromechanical element is configured to generate the electrical signal in response to an oscillation of the membrane and/or to generate an oscillation of the membrane in response to an electrical signal. 
 
     
     
       21. The microelectromechanical device of  claim 1 ,
 wherein the microelectromechanical element is electrically insulated from the semiconductor carrier. 
 
     
     
       22. The microelectromechanical device of  claim 1 ,
 wherein the connection structure comprises at least one of a non-polymer or an inorganic material. 
 
     
     
       23. The microelectromechanical device of  claim 1 , wherein a cross sectional area of the connection structure is smaller than a cross sectional area of the micro electromechanical element. 
     
     
       24. The microelectromechanical device of  claim 1 , wherein the connection structure defines a mean position of the microelectromechanical element relative to the semiconductor carrier, wherein the connection structure is configured to generate a spring force pointing to the mean position in response to a displacement of the microelectromechanical element from the mean position. 
     
     
       25. The microelectromechanical device of  claim 1 , wherein the connection structure includes one or more openings extending through the connection structure. 
     
     
       26. A method for forming a microelectromechanical device, the method comprising:
 forming a microelectromechanical element in a position distant to a semiconductor carrier; 
 forming a contact pad which is electrically connected to the microelectromechanical element; 
 forming a connection structure extending between the semiconductor carrier and the microelectromechanical element for mechanically coupling the microelectromechanical element with the semiconductor carrier; and 
 surrounding at least partially the microelectromechanical element with a stiffening element;
 wherein the stiffening element is distant from the semiconductor carrier. 
 
 
     
     
       27. The microelectromechanical device of  claim 26 ,
 wherein the connection structure comprises one or more spring arms which extend from the semiconductor carrier to the microelectromechanical element and elastically couple the microelectromechanical element with the semiconductor carrier. 
 
     
     
       28. A microelectromechanical device comprising:
 a semiconductor carrier; 
 a microelectromechanical element disposed in a position distant to the semiconductor carrier;
 wherein the microelectromechanical element is configured to generate or modify an electrical signal in response to a mechanical signal and/or is configured to generate or modify a mechanical signal in response to an electrical signal; and 
 wherein the microelectromechanical element comprises a mechanical member and one or more electrical members, which are mechanically coupled with each other and with the connection structure; 
 
 at least one contact pad, which is electrically connected to the microelectromechanical element for transferring the electrical signal between the contact pad and the microelectromechanical element; and 
 a connection structure which extends from the semiconductor carrier to the microelectromechanical element and mechanically couples the microelectromechanical element with the semiconductor carrier. 
 
     
     
       29. The microelectromechanical device of  claim 28 , wherein the mechanical member is perforated. 
     
     
       30. The microelectromechanical device of  claim 28 , wherein at least one first electrical member of the one or more electrical members and the connection structure are formed from one layer, wherein the mechanical member is coupled to the layer in between the first electrical member and the connection structure. 
     
     
       31. A microelectromechanical device comprising:
 a semiconductor carrier; 
 a microelectromechanical element disposed in a position distant to the semiconductor carrier;
 wherein the microelectromechanical element is configured to generate or modify an electrical signal in response to a mechanical signal and/or is configured to generate or modify a mechanical signal in response to an electrical signal; 
 
 at least one contact pad, which is electrically connected to the microelectromechanical element for transferring the electrical signal between the contact pad and the microelectromechanical element; 
 a connection structure which extends from the semiconductor carrier to the microelectromechanical element and mechanically couples the microelectromechanical element with the semiconductor carrier; 
 a stiffening element at least partially surrounding the microelectromechanical element and being distant from the semiconductor carrier. 
 
     
     
       32. The microelectromechanical device of  claim 31 , wherein the stiffening element is configured for at least partially absorbing torsion of the microelectromechanical element. 
     
     
       33. The microelectromechanical device of  claim 31 , wherein the stiffening element is mechanically coupled to the microelectromechanical element.