Inventor · disambiguated record
Wolfgang Friza
Also filed as: FRIZA WOLFGANG
22 granted patents·2 pending applications·156 citations·filing 2001–2023
94Inventor score
Files withINFINEON TECHNOLOGIES AG19DEHE ALFONS2FRIZA WOLFGANG1INFINEON TECHNOLOGIES AUSTRIA AG1KLEIN WOLFGANG1
Top patents by PatentIndex Score
24 records- 0195US9002037B2MEMS structure with adjustable ventilation openingsDEHE ALFONS·Filed 2012·Granted Apr 7, 2015·24 cites·30 claims
- 0295US8461655B2Micromechanical sound transducer having a membrane support with tapered surfaceKLEIN WOLFGANG·Filed 2011·Granted Jun 11, 2013·30 cites·26 claims
- 0392US9745188B1Microelectromechanical device and method for forming a microelectromechanical deviceINFINEON TECHNOLOGIES AG·Filed 2016·Granted Aug 29, 2017·5 cites·33 claims
- 0491US8575037B2Method for fabricating a cavity structure, for fabricating a cavity structure for a semiconductor structure and a semiconductor microphone fabricated by the sameFRIZA WOLFGANG·Filed 2010·Granted Nov 5, 2013·18 cites·25 claims
- 0590US9565488B2Micro-electro-mechanical system devicesINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 7, 2017·5 cites·30 claims
- 0690US8975107B2Method of manufacturing a semiconductor device comprising a membrane over a substrate by forming a plurality of features using local oxidation regionsDEHE ALFONS·Filed 2011·Granted Mar 10, 2015·11 cites·28 claims
- 0789US9902612B2Method for forming a microelectromechanical deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 27, 2018·3 cites·9 claims
- 0889US9458009B2Semiconductor devices and methods of forming thereofINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 4, 2016·4 cites·23 claims
- 0987US6649459B2Method for manufacturing a semiconductor componentINFINEON TECHNOLOGIES AG·Filed 2001·Granted Nov 18, 2003·38 cites·14 claims
- 1083US9102519B2Semiconductor devices and methods of forming thereofINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 11, 2015·4 cites·26 claims
- 1180US9363609B2Method for fabricating a cavity structure, for fabricating a cavity structure for a semiconductor structure and a semiconductor microphone fabricated by the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jun 7, 2016·5 cites·19 claims
- 1279US9503823B2Capacitive microphone with insulated conductive plateINFINEON TECHNOLOGIES AG·Filed 2014·Granted Nov 22, 2016·5 cites·9 claims
- 1377US10405099B2MEMS device and method for producing a MEMS deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Sep 3, 2019·3 cites·21 claims
- 1476US2023224657A1Semiconductor devices having a membrane layer with smooth stress-relieving corrugations and methods of fabrication thereofINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1569US11787686B2Method for processing a layer structure and microelectromechanical componentINFINEON TECHNOLOGIES AG·Filed 2021·Granted Oct 17, 2023·0 cites·20 claims
- 1669US11180362B2Method for processing a layer structure and microelectromechanical componentINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 23, 2021·0 cites·14 claims
- 1768US10464807B2Semiconductor device, microphone and method for producing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Nov 5, 2019·1 cites·20 claims
- 1863US10766766B2Method for processing a layer structure and microelectromechanical componentINFINEON TECHNOLOGIES AG·Filed 2018·Granted Sep 8, 2020·0 cites·13 claims
- 1961US11414320B2Methods for producing thin-film layers and microsystems having thin-film layersINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 16, 2022·0 cites·36 claims
- 2061US2019297441A1Semiconductor Devices Having a Membrane Layer with Smooth Stress-Relieving Corrugations and Methods of Fabrication ThereofINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 2159US11223904B2Method for manufacturing an opening structure and opening structureINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 11, 2022·0 cites·14 claims
- 2258US10889492B2Methods for producing thin-film layers and microsystems having thin-film layersINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 12, 2021·0 cites·17 claims
- 2358US10405118B2Semiconductor devices having a membrane layer with smooth stress-relieving corrugations and methods of fabrication thereofINFINEON TECHNOLOGIES AG·Filed 2015·Granted Sep 3, 2019·0 cites·5 claims
- 2456US10469948B2Method for manufacturing an opening structure and opening structureINFINEON TECHNOLOGIES AG·Filed 2014·Granted Nov 5, 2019·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →