USD1022933SActiveUtility

Wafer support of semiconductor manufacturing apparatus

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Assignee: KOKUSAI ELECTRIC CORPPriority: Aug 27, 2021Filed: Feb 24, 2022Granted: Apr 16, 2024
Est. expiryAug 27, 2041(~15.1 yrs left)· nominal 20-yr term from priority
Inventors:Yusaku Okajima
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PatentIndex Score
0
Cited by
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References
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Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a wafer support of semiconductor manufacturing apparatus, as shown and described.

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