Inventor · disambiguated record
Yusaku Okajima
Also filed as: OKAJIMA YUSAKU
35 granted patents·24 pending applications·189 citations·filing 2017–2025
96Inventor score
Top patents by PatentIndex Score
59 records- 0193US10731254B2Protective plate, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Aug 4, 2020·3 cites·10 claims
- 0292US10453735B2Substrate processing apparatus, reaction tube, semiconductor device manufacturing method, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 22, 2019·8 cites·5 claims
- 0388USD813181SCover of seal cap for reaction chamber of semiconductorHITACHI INT ELECTRIC INC·Filed 2017·Granted Mar 20, 2018·41 cites·1 claims
- 0487USD846514SBoat of substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Granted Apr 23, 2019·28 cites·1 claims
- 0586US11685992B2Substrate processing apparatus, quartz reaction tube and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jun 27, 2023·2 cites·10 claims
- 0685US2025101583A1Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0784US12203167B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2023·Granted Jan 21, 2025·0 cites·15 claims
- 0879US11859280B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jan 2, 2024·0 cites·14 claims
- 0979US10961625B2Substrate processing apparatus, reaction tube and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Mar 30, 2021·2 cites·20 claims
- 1078US11453942B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Sep 27, 2022·1 cites·18 claims
- 1175USD888196SGas nozzle for substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2018·Granted Jun 23, 2020·16 cites·1 claims
- 1273USD1003834SHeat insulator cover of semiconductor manufacturing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Nov 7, 2023·5 cites·1 claims
- 1372USD847105SBoat of substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Granted Apr 30, 2019·13 cites·1 claims
- 1472US2025259873A1Substrate processing apparatus, elevator and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1568USD937385SReturn nozzleKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 30, 2021·10 cites·1 claims
- 1666US12293932B2Substrate processing apparatus, elevator and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted May 6, 2025·0 cites·13 claims
- 1765USD916037SCover of seal cap for reaction chamber for semiconductorKOKUSAI ELECTRIC CORP·Filed 2018·Granted Apr 13, 2021·9 cites·1 claims
- 1865USD853979SReaction tubeHITACHI INT ELECTRIC INC·Filed 2018·Granted Jul 16, 2019·10 cites·1 claims
- 1964USD872037SCover of seal cap for reaction chamber for semiconductor manufacturingHITACHI INT ELECTRIC INC·Filed 2018·Granted Jan 7, 2020·9 cites·1 claims
- 2064USD842823SReaction tubeHITACHI INT ELECTRIC INC·Filed 2018·Granted Mar 12, 2019·9 cites·1 claims
- 2162USD843958SReaction tubeHITACHI INT ELECTRIC INC·Filed 2018·Granted Mar 26, 2019·8 cites·1 claims
- 2261US12435423B2Substrate processing method, method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Oct 7, 2025·0 cites·19 claims
- 2361USD855027SCover of seal cap for reaction chamber of semiconductorHITACHI INT ELECTRIC INC·Filed 2018·Granted Jul 30, 2019·8 cites·1 claims
- 2461US2024337021A1Substrate processing apparatus, process vessel, method of processing substrate, method of manufacturing semiconductor device and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2561US2025340993A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2660US2025014894A1Substrate Processing Method, Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-transitory Computer-readable Recording MediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2760US2023193465A1Substrate processing method, method of manufacturing semiconductor device and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2860US2024186156A1Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2959US12272579B2Substrate processing apparatus, substrate suppport and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Apr 8, 2025·0 cites·17 claims
- 3059USD1003243SHeat insulator cover of semiconductor manufacturing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Oct 31, 2023·2 cites·1 claims
- 3158US2024254630A1Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 3258US2023407479A1Substrate holder, substrate processing apparatus, method of manufacturing semiconductor device and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 3357US2025343029A1Substrate processing apparatus, gas supply structure, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3456US11898247B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Feb 13, 2024·0 cites·19 claims
- 3556US2025215561A1Substrate Processing Apparatus, Heat Insulating Structure, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording MediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3656US2025003066A1Substrate processing apparatus, gas nozzle, method of processing substrate, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 3755US2025215567A1Substrate processing apparatus, nozzle, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3855US2023230861A1Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 3955US2023411145A1Processing method, method of manufacturing semiconductor device, processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 4054US2025215568A1Substrate Processing Apparatus, Gas Supply Assembly, Substrate Processing Method, Method of Manufacturing Semiconductor Device and Non-transitory Computer-Readable Recording MediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 4154US2025201584A1Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 4254US2023100076A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 4354US2023012668A1Substrate processing apparatus, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and inner tubeKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 4454US2023005760A1Substrate processing apparatus, inner tube and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 4554US2022356580A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 4653US2025188606A1Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 4749USD889596SGas nozzle for substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Granted Jul 7, 2020·5 cites·1 claims
- 4849US2023100702A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 4947US10923366B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Feb 16, 2021·0 cites·12 claims
- 5041US2019071777A1Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2018·Application pending·0 cites
Showing the top 50 of 59 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →