USD404016SExpiredUtility

Heat retaining tube for use in a semiconductor wafer heat processing apparatus

53
Assignee: TOKYO ELECTRON LTDPriority: Jan 31, 1997Filed: Jul 24, 1997Granted: Jan 12, 1999
Est. expiryJan 31, 2017(expired)· nominal 20-yr term from priority
Inventors:Katsutoshi Ishii
53
PatentIndex Score
8
Cited by
8
References
1
Claims

Claims

exact text as granted — not AI-modified
I claim the ornamental design for heat retaining tube for use in a semiconductor wafer heat processing apparatus, as shown and described.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.