Inventor · disambiguated record
Katsutoshi Ishii
Also filed as: ISHII KATSUTOSHI
32 granted patents·10 pending applications·1,284 citations·filing 1984–2022
97Inventor score
Files withTOKYO ELECTRON LTD31MATSUURA HIROYUKI2WATANABE MASAHISA2ISHII KATSUTOSHI1MORISHITA JINTAN CO1
Top patents by PatentIndex Score
42 records- 0198US6884295B2Method of forming oxynitride film or the like and system for carrying out the sameTOKYO ELECTRON LTD·Filed 2001·Granted Apr 26, 2005·483 cites·3 claims
- 0298USD404372SRing for use in a semiconductor wafer heat processing apparatusTOKYO ELECTRON LTD·Filed 1998·Granted Jan 19, 1999·462 cites·1 claims
- 0390US8394200B2Vertical plasma processing apparatus for semiconductor processMATSUURA HIROYUKI·Filed 2008·Granted Mar 12, 2013·10 cites·18 claims
- 0485US6540509B2Heat treatment system and methodTOKYO ELECTRON LTD·Filed 2001·Granted Apr 1, 2003·31 cites·12 claims
- 0583US5221201AVertical heat treatment apparatusTEL SAGAMI LTD·Filed 1991·Granted Jun 22, 1993·52 cites·17 claims
- 0681US10535501B2Film forming apparatus, film forming method and non-transitory storage mediumTOKYO ELECTRON LTD·Filed 2014·Granted Jan 14, 2020·2 cites·11 claims
- 0781US6863732B2Heat treatment system and methodTOKYO ELECTRON LTD·Filed 2003·Granted Mar 8, 2005·24 cites·12 claims
- 0881USD380454SWafer boatTOKYO ELECTRON LTD·Filed 1995·Granted Jul 1, 1997·25 cites·1 claims
- 0980US6903030B2System and method for heat treating semiconductorTOKYO ELECTRON LTD·Filed 2002·Granted Jun 7, 2005·26 cites·32 claims
- 1080US6516143B2Fluid heating apparatusTOSHIBA CERAMICS CO·Filed 2001·Granted Feb 4, 2003·27 cites·22 claims
- 1170US10799896B2Substrate processing apparatus, method of coating particle in process gas nozzle and substrate processing methodTOKYO ELECTRON LTD·Filed 2018·Granted Oct 13, 2020·1 cites·12 claims
- 1268USD521464SProcess tube for semiconductor device manufacturing apparatusTOKYO ELECTRON LTD·Filed 2004·Granted May 23, 2006·15 cites·1 claims
- 1364USD521465SProcess tube for semiconductor device manufacturing apparatusTOKYO ELECTRON LTD·Filed 2004·Granted May 23, 2006·13 cites·1 claims
- 1463US7211295B2Silicon dioxide film forming methodTOKYO ELECTRON LTD·Filed 2004·Granted May 1, 2007·7 cites·4 claims
- 1563USD427570SQuartz fin heat retaining tubeTOKYO ELECTRON LTD·Filed 1997·Granted Jul 4, 2000·12 cites·1 claims
- 1660US2007240644A1Vertical plasma processing apparatus for semiconductor processMATSUURA HIROYUKI·Filed 2007·Application pending·0 cites
- 1753USD520467SProcess tube for semiconductor device manufacturing apparatusTOKYO ELECTRON LTD·Filed 2004·Granted May 9, 2006·8 cites·1 claims
- 1853USD410438SHeat retaining tube for use in a semiconductor wafer heat processing apparatusTOKYO ELECTRON LTD·Filed 1997·Granted Jun 1, 1999·8 cites·1 claims
- 1953USD404016SHeat retaining tube for use in a semiconductor wafer heat processing apparatusTOKYO ELECTRON LTD·Filed 1997·Granted Jan 12, 1999·8 cites·1 claims
- 2053US2009041650A1Method for removing metal impurity from quartz component part used in heat processing apparatus of batch typeWATANABE MASAHISA·Filed 2008·Application pending·0 cites
- 2152US2018312967A1Substrate processing apparatus, method of removing particles in injector, and substrate processing methodTOKYO ELECTRON LTD·Filed 2018·Application pending·0 cites
- 2251US11270895B2Gas introduction structure, treatment apparatus, and treatment methodTOKYO ELECTRON LTD·Filed 2019·Granted Mar 8, 2022·0 cites·16 claims
- 2351US5820683AObject-supporting boatTOKYO ELECTRON LTD·Filed 1996·Granted Oct 13, 1998·21 cites·10 claims
- 2451US2023374656A1Filling method and film forming apparatusTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 2550USD428858SQuartz fin heat retaining tubeTOKYO ELECTRON LTD·Filed 1997·Granted Aug 1, 2000·7 cites·1 claims
- 2650USD405428SHeat retaining tube for use in a semiconductor wafer heat processing apparatusTOKYO ELECTRON LTD·Filed 1997·Granted Feb 9, 1999·7 cites·1 claims
- 2748US2024180219A1Seamless capsule stably disintegrable even in high-temperature and high-humidity environment, and method for producing the sameMORISHITA JINTAN CO·Filed 2022·Application pending·0 cites
- 2848US2023175115A1Selective film formation methodTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 2947USD405427SHeat retaining tube for use in a semiconductor wafer heat processing apparatusTOKYO ELECTRON LTD·Filed 1997·Granted Feb 9, 1999·6 cites·1 claims
- 3046US10559460B2Film forming apparatus and film forming methodTOKYO ELECTRON LTD·Filed 2018·Granted Feb 11, 2020·0 cites·16 claims
- 3146US8834817B2Method for removing metal impurity from quartz component part used in heat processing apparatus of batch typeWATANABE MASAHISA·Filed 2010·Granted Sep 16, 2014·0 cites·16 claims
- 3246USD564462SRF electrode for a process tube of semiconductor manufacturing apparatusTOKYO ELECTRON LTD·Filed 2006·Granted Mar 18, 2008·6 cites·1 claims
- 3346US4586295AWorkpiece centerless support device for use in internal grinding machineSEIKO SEIKI KK·Filed 1984·Granted May 6, 1986·5 cites·1 claims
- 3446US2004163677A1Heat treatment apparatus and cleaning method of the sameFiled 2004·Application pending·0 cites
- 3546US2007048145A1Vacuum evacuation device and method, and substrate processing apparatus and methodISHII KATSUTOSHI·Filed 2006·Application pending·0 cites
- 3642US10876204B2Substrate processing apparatus, exhaust pipe coating method and substrate processing methodTOKYO ELECTRON LTD·Filed 2018·Granted Dec 29, 2020·0 cites·8 claims
- 3741US2001055738A1Heat treatment apparatus and cleaning method of the sameFiled 2001·Application pending·0 cites
- 3840US6110286AVertical processing unitTOKYO ELECTRON LTD·Filed 1998·Granted Aug 29, 2000·8 cites·18 claims
- 3940USD429224SQuartz fin heat retaining tubeTOKYO ELECTRON LTD·Filed 1997·Granted Aug 8, 2000·4 cites·1 claims
- 4038USD426521SQuartz fin heat retaining tubeTOKYO ELECTRON LTD·Filed 1997·Granted Jun 13, 2000·3 cites·1 claims
- 4138USD425871SQuartz fin heat retaining tubeTOKYO ELECTRON LTD·Filed 1997·Granted May 30, 2000·3 cites·1 claims
- 4236US2010186667A1Vertical heat processing apparatus and component for same, for forming high dielectric constant filmTOKYO ELECTRON LTD·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Katsutoshi Ishii files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →