USD405428SExpiredUtility

Heat retaining tube for use in a semiconductor wafer heat processing apparatus

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Assignee: TOKYO ELECTRON LTDPriority: Jan 31, 1997Filed: Jul 24, 1997Granted: Feb 9, 1999
Est. expiryJan 31, 2017(expired)· nominal 20-yr term from priority
Inventors:Katsutoshi Ishii
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PatentIndex Score
7
Cited by
8
References
1
Claims

Claims

exact text as granted — not AI-modified
I claim the ornamental design for a heat retaining tube for use in a semiconductor wafer heat processing apparatus, as shown and described.

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