USD410438SExpiredUtility

Heat retaining tube for use in a semiconductor wafer heat processing apparatus

Assignee: TOKYO ELECTRON LTDPriority: Jan 31, 1997Filed: Jul 24, 1997Granted: Jun 1, 1999

Est. expiryJan 31, 2017(expired)· nominal 20-yr term from priority

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Claims

exact text as granted — not AI-modified

I claim the ornamental design for a heat retaining tube for use in a semiconductor wafer heat processing apparatus, as shown and described.

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