USD404372SExpiredUtility

Ring for use in a semiconductor wafer heat processing apparatus

98
Assignee: TOKYO ELECTRON LTDPriority: Aug 20, 1997Filed: Feb 12, 1998Granted: Jan 19, 1999
Est. expiryAug 20, 2017(expired)· nominal 20-yr term from priority
Inventors:Katsutoshi Ishii
98
PatentIndex Score
462
Cited by
4
References
1
Claims

Claims

exact text as granted — not AI-modified
I claim the ornamental design for a ring for use in a semiconductor wafer heat processing apparatus, as shown and described.

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