USD405429SExpiredUtility

Processing tube for use in a semiconductor wafer heat processing apparatus

85
Assignee: TOKYO ELECTRON LTDPriority: Jan 31, 1997Filed: Jul 24, 1997Granted: Feb 9, 1999
Est. expiryJan 31, 2017(expired)· nominal 20-yr term from priority
Inventors:Tetsuya HanagataShingo Watanabe
85
PatentIndex Score
32
Cited by
10
References
1
Claims

Claims

exact text as granted — not AI-modified
We claim the ornamental design for a processing tube for use in a semiconductor wafer heat processing apparatus, as shown and described.

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